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    LIFT PIN ASSEMBLY
    11.
    发明申请
    LIFT PIN ASSEMBLY 有权

    公开(公告)号：US20220293451A1

    公开(公告)日：2022-09-15

    申请号：US17688705

    申请日：2022-03-07

    Applicant: Applied Materials, Inc.

    Inventor： Alexander SULYMAN ,  Anwar HUSAIN ,  Timothy Joseph FRANKLIN ,  Carlaton WONG ,  Xue Yang CHANG

    IPC: H01L21/687 ,  H01L21/683

    Abstract: Methods and apparatus for lift pin assemblies for substrate processing chambers are provided. In some embodiments, a lift pin assembly includes a lift pin comprising a shaft, a head, and a coupling end, the head configured to rest against an electrostatic chuck; an upper guide comprising a top end, a bottom end, and a first opening extending from the top end to the bottom end, wherein the shaft is disposed and axially movable through the first opening; a lower guide comprising a top end, a bottom end, and a second opening and a third opening extending from the top end to the bottom end, wherein the third opening is larger than the second opening, and wherein the shaft is disposed and axially movable through the second opening and the third opening; and a biasing mechanism coupled to the shaft and configured to bias the lift pin against the electrostatic chuck.

    SHOWERHEAD ASSEMBLY WITH RECURSIVE GAS CHANNELS
    12.
    发明申请
    SHOWERHEAD ASSEMBLY WITH RECURSIVE GAS CHANNELS 有权

    公开(公告)号：US20220093361A1

    公开(公告)日：2022-03-24

    申请号：US17028587

    申请日：2020-09-22

    Applicant: Applied Materials, Inc.

    Inventor： Reyn Tetsuro WAKABAYASHI ,  Carlaton WONG ,  Timothy Joseph FRANKLIN

    IPC: H01J37/32

    Abstract: Embodiments of showerheads are provided herein. In some embodiments, a showerhead assembly includes a chill plate having a plurality of recursive gas paths and one or more cooling channels disposed therein, wherein each of the plurality of recursive gas paths is fluidly coupled to a single gas inlet extending to a first side of the chill plate and a plurality of gas outlets extending to a second side of the chill plate; and a heater plate coupled to the chill plate, wherein the heater plate includes a plurality of first gas distribution holes extending from a top surface thereof to a plurality of plenums disposed within the heater plate, the plurality of first gas distribution holes corresponding with the plurality of gas outlets of the chill plate, and a plurality of second gas distribution holes extending from the plurality of plenums to a lower surface of the heater plate.

    METHODS AND APPARATUS FOR TUNING SEMICONDUCTOR PROCESSES
    15.
    发明申请
    METHODS AND APPARATUS FOR TUNING SEMICONDUCTOR PROCESSES 有权

    公开(公告)号：US20210287881A1

    公开(公告)日：2021-09-16

    申请号：US17156957

    申请日：2021-01-25

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Timothy Joseph FRANKLIN ,  Carlaton WONG ,  Reyn Tetsuro WAKABAYASHI ,  Daniel Sang BYUN ,  Steven BABAYAN

    IPC: H01J37/32 ,  H01L21/687

    Abstract: An apparatus for processing substrates that includes a process chamber with a process volume located above a substrate support assembly surrounded by an edge ring, an upper electrode located above the process volume and a conductive tuning ring surrounding the upper electrode and in electrical contact with the upper electrode. The conductive tuning ring has at least one gas port on a lower surface above the edge ring. The conductive tuning may also have at least one stepped portion on the lower surface that forms an extended bottom surface. In some embodiments, the extended bottom surface may slant radially inwardly or radially outwardly. In some embodiments, the extended bottom surface may have one or more radiused edges.

    SHUNT DOOR FOR MAGNETS IN PLASMA PROCESS CHAMBER
    16.
    发明申请
    SHUNT DOOR FOR MAGNETS IN PLASMA PROCESS CHAMBER 有权

    公开(公告)号：US20210269919A1

    公开(公告)日：2021-09-02

    申请号：US17131315

    申请日：2020-12-22

    Applicant: Applied Materials, Inc.

    Inventor： Kallol BERA ,  Sathya Swaroop GANTA ,  Timothy Joseph FRANKLIN ,  Kaushik ALAYAVALLI ,  Akshay DHANAKSHIRUR ,  Stephen C. GARNER ,  Bhaskar KUMAR

    IPC: C23C16/52 ,  H01J37/32 ,  C23C16/54

    Abstract: Embodiments described herein relate to magnetic and electromagnetic systems and a method for controlling the density profile of plasma generated in a process volume of a PECVD chamber to affect deposition profile of a film on a substrate and/or facilitate chamber cleaning after processing. In one embodiment, a system is disclosed that includes a rotational magnetic housing disposed about an exterior sidewall of a chamber. The rotational magnetic housing includes a plurality of magnets coupled to a sleeve that are configured to travel in a circular path when the rotational magnetic housing is rotated around the chamber, and a plurality of shunt doors movably disposed between the chamber and the sleeve, wherein each of the shunt doors are configured to move relative to the magnets.

    THERMAL REPEATABILITY AND IN-SITU SHOWERHEAD TEMPERATURE MONITORING
    17.
    发明申请
    THERMAL REPEATABILITY AND IN-SITU SHOWERHEAD TEMPERATURE MONITORING 审中-公开

    公开(公告)号：US20200227242A1

    公开(公告)日：2020-07-16

    申请号：US16834814

    申请日：2020-03-30

    Applicant: Applied Materials, Inc.

    Inventor： Timothy Joseph FRANKLIN ,  Steven E. BABAYAN ,  Philip Allan KRAUS

    IPC: H01J37/32 ,  B05B1/00 ,  B05B1/18 ,  B05B12/10 ,  H01L21/67

    Abstract: Embodiments described herein generally related to a substrate processing apparatus, and more specifically to an improved showerhead assembly for a substrate processing apparatus. The showerhead assembly includes a chill plate, a gas plate, and a gas distribution plate having a top surface and a bottom surface. A plurality of protruded features contacts the top surface of the gas distribution plate. A fastener and an energy storage structure is provided on the protruded features. The energy storage structure is compressed by the fastener and axially loads at least one of the protruded features to compress the chill plate, the gas plate and the gas distribution plate.

    METHODS TO FABRICATE CHAMBER COMPONENT USING LASER DRILLING
    20.
    发明申请
    METHODS TO FABRICATE CHAMBER COMPONENT USING LASER DRILLING 有权

    公开(公告)号：US20220111468A1

    公开(公告)日：2022-04-14

    申请号：US17090770

    申请日：2020-11-05

    Applicant: Applied Materials, Inc.

    Inventor： Sumit AGARWAL ,  Timothy Joseph FRANKLIN

    IPC: B23K26/388 ,  H01L21/306 ,  H01L21/67

    Abstract: Embodiments of a method of forming one or more holes in a substrate for use as a process chamber component are provided herein. In some embodiments, a method of forming one or more holes in a substrate for use as a process chamber component include forming the one or more holes in the substrate with one or more laser drills using at least one of a percussion drilling, a trepanning, or an ablation process, wherein each of the one or more holes have an aspect ratio of about 1:1 to about 50:1, and wherein the substrate is a component for gas delivery or fluid delivery.

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