公开(公告)号：US20170327946A1

公开(公告)日：2017-11-16

申请号：US15668064

申请日：2017-08-03

Applicant: Applied Materials, Inc.

Inventor： Jozef KUDELA ,  Carl A. SORENSEN ,  John M. WHITE

IPC: C23C16/455 ,  C23C16/505

CPC classification number: H01F17/06 ,  C23C16/455 ,  C23C16/505 ,  H01F27/08 ,  H01F2017/065 ,  H01J37/32082 ,  H01J37/3244 ,  H01J2237/0206 ,  Y10T117/10 ,  Y10T117/1004 ,  Y10T117/1008

Abstract: In large area plasma processing systems, process gases may be introduced to the chamber via the showerhead assembly which may be driven as an RF electrode. The gas feed tube, which is grounded, is electrically isolated from the showerhead. The gas feed tube may provide not only process gases, but also cleaning gases from a remote plasma source to the process chamber. The inside of the gas feed tube may remain at either a low RF field or a zero RF field to avoid premature gas breakdown within the gas feed tube that may lead to parasitic plasma formation between the gas source and the showerhead. By feeding the gas through an RF choke, the RF field and the processing gas may be introduced to the processing chamber through a common location and thus simplify the chamber design.

公开(公告)号：US20160319422A1

公开(公告)日：2016-11-03

申请号：US15108119

申请日：2015-01-20

Applicant: APPLIED MATERIALS, INC.

Inventor： Shinichi KURITA ,  Jozef KUDELA ,  John M. WHITE ,  Dieter HAAS

IPC: C23C16/04 ,  H01L51/52 ,  H01J37/32 ,  H01L21/67 ,  H01L21/677 ,  H01L51/56 ,  H01L21/687

CPC classification number: C23C16/45548 ,  C23C16/042 ,  C23C16/4402 ,  C23C16/54 ,  H01J37/32082 ,  H01J37/3244 ,  H01J37/32467 ,  H01J37/32513 ,  H01J37/32715 ,  H01J37/32834 ,  H01J37/32853 ,  H01J37/32899 ,  H01J2237/327 ,  H01J2237/3321 ,  H01L21/6719 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/68742 ,  H01L51/0011 ,  H01L51/5237 ,  H01L51/5253 ,  H01L51/56

Abstract: The present disclosure relates to methods and apparatus for a thin film encapsulation (TFE). A process kit for TFE is provided. The process kit is an assembly including a window, a mask parallel to the window, and a frame. The process kit further includes an inlet channel for flowing process gases into the volume between the window and the mask, an outlet channel for pumping effluent gases away from the volume between the window and the mask, and seals for inhibiting the flow of process gases and effluent gases to undesired locations. A method of performing TFE is provided, including placing a substrate under the mask of the above described process kit, flowing process gases into the process kit, and activating some of the process gases into reactive species by means of an energy source within a processing chamber.

Abstract translation: 本公开涉及薄膜封装（TFE）的方法和装置。 提供TFE的工艺套件。 处理套件是包括窗口，与窗口平行的掩模和框架的组件。 工艺组件还包括用于将工艺气体流入窗口和面罩之间的体积的入口通道，用于将流出气体从窗口和面罩之间的体积排出的出口通道，以及用于抑制工艺气体流动的密封件， 流出气体到不需要的位置。 提供了一种执行TFE的方法，包括将基底放置在上述处理试剂盒的掩模之下，将工艺气体流入工艺试剂盒，并通过处理室内的能量源将一些工艺气体活化成反应性物质 。