Overpass grounding spring and integrated component protection
    11.
    发明授权
    Overpass grounding spring and integrated component protection 有权
    立交接地弹簧和集成元件保护

    公开(公告)号:US09445491B2

    公开(公告)日:2016-09-13

    申请号:US14231372

    申请日:2014-03-31

    Applicant: Apple Inc.

    Abstract: The described embodiments relate generally to use of an electrically conductive member, such as a grounding spring, used to electrically ground components on a printed circuit board as well as provide mechanical protection to the components. More particularly, a method and apparatus for attaching a grounding spring to multiple locations on the printed circuit board are disclosed. In one embodiment, the grounding spring can act as both a ground and a mechanical protection element for other surface mounted components disposed on the printed circuit board.

    Abstract translation: 所描述的实施例大体上涉及用于电气接地印刷电路板上的部件的导电部件,例如接地弹簧,以及为部件提供机械保护。 更具体地,公开了一种用于将接地弹簧连接到印刷电路板上的多个位置的方法和装置。 在一个实施例中,接地弹簧可以用作布置在印刷电路板上的其它表面安装部件的接地和机械保护元件。

    HANDHELD ELECTRONIC DEVICE
    15.
    发明公开

    公开(公告)号:US20230224391A1

    公开(公告)日:2023-07-13

    申请号:US17903864

    申请日:2022-09-06

    Applicant: Apple Inc.

    CPC classification number: H04M1/0266 H04M1/0264 G06F3/0412 H04M2250/22

    Abstract: A portable electronic device may include an enclosure including a housing component and a front cover coupled to the housing component and defining a front exterior surface of the portable electronic device. The portable electronic device may also include a display positioned below the front cover, the display defining an active display region, a first hole surrounded by the active display region, and a second hole surrounded by the active display region. The portable electronic device may also include a first optical sensor positioned below the front cover and below the first hole, a second optical sensor positioned below the front cover and below the second hole, and a touch-sensing component configured to detect a first touch input applied to the front cover in the active display region of the display and a second touch input applied to the front cover over the first hole in the display.

    HOUSING FEATURES OF AN ELECTRONIC DEVICE

    公开(公告)号:US20210344784A1

    公开(公告)日:2021-11-04

    申请号:US17378695

    申请日:2021-07-17

    Applicant: Apple Inc.

    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

    Electronic devices with dielectric resonator antennas

    公开(公告)号:US10886619B2

    公开(公告)日:2021-01-05

    申请号:US16289433

    申请日:2019-02-28

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a dielectric resonator antenna. The dielectric resonator antenna may include a dielectric resonating element embedded in a lower permittivity dielectric substrate. The substrate and the resonating element may be mounted to a flexible printed circuit. A slot may be formed in ground traces on the flexible printed circuit and aligned with the resonating element. The slot may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the cover layer. A dielectric matching layer may be interposed between the resonating element and the cover layer. If desired, the slot may radiate additional radio-frequency signals and the matching layer may have a tapered shape. Dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the array.

    Housing features of an electronic device

    公开(公告)号:US10547717B2

    公开(公告)日:2020-01-28

    申请号:US16241914

    申请日:2019-01-07

    Applicant: Apple Inc.

    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

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