Housing features of an electronic device

    公开(公告)号:US10547717B2

    公开(公告)日:2020-01-28

    申请号:US16241914

    申请日:2019-01-07

    Applicant: Apple Inc.

    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

    APPARATUS AND METHOD OF FORMING A COMPOUND STRUCTURE

    公开(公告)号:US20190217513A1

    公开(公告)日:2019-07-18

    申请号:US16360929

    申请日:2019-03-21

    Applicant: Apple Inc.

    Abstract: Compound structures and methods for forming the same are described. The compound structures can be used to form an enclosure. The enclosure may be formed from metal, such as aluminum, and further include one or more non-metal regions that allow for transmission and receipt of electromagnetic waves, such as radio frequency waves. The non-metal region can include a first section, a second section, and an optional cosmetic section. The first section can be firmly molded onto a metal section of the enclosure by small pores formed within the metal section. The second section can engage with interlock features of the first section. The optional cosmetic section can cover the first section and the second section such that the first section and the second section are not visible from an exterior of the enclosure.

    Enclosure seal for an electronic device

    公开(公告)号:US09954572B2

    公开(公告)日:2018-04-24

    申请号:US15236157

    申请日:2016-08-12

    Applicant: Apple Inc.

    CPC classification number: H04B1/3888 H04B2001/3894 H04M1/0249 H04M1/18

    Abstract: An electronic device having an enclosure with a sealing element to prevent ingress of contaminants at an interface between sealing element and a material is disclosed. The material may include an injection molded material that forms at least part of a radio frequency transparent window. The enclosure may include a first channel that receives the material. A second channel may open to the first channel and receive the sealing element. The sealing element may initially extend at least partially into the first channel. However, the material may provide compression forces to the sealing element to compress the sealing element out of the first channel, or at least compress the sealing element further into the second channel. The sealing element may provide a counterforce against the material to increase or enhance a seal against ingress attempting to pass through the enclosure at the interface between sealing element and the material.

    ASSEMBLED INTEGRAL PLASTIC ELEMENTS ON AN ANODIZED MOBILE DEVICE ENCLOSURE
    16.
    发明申请
    ASSEMBLED INTEGRAL PLASTIC ELEMENTS ON AN ANODIZED MOBILE DEVICE ENCLOSURE 有权
    固定移动装置外壳上的组装塑料元件

    公开(公告)号:US20160089834A1

    公开(公告)日:2016-03-31

    申请号:US14503009

    申请日:2014-09-30

    Applicant: Apple Inc.

    Abstract: Methods and systems for manufacturing composite parts that include anodizable portions and non-anodizable portions such that an interface between the anodizable portions and non-anodizable portions are free of visible defects are described. The non-anodizable portions can be made of anodizable metals such as aluminum or aluminum alloy. The non-anodizable portions are made of material that do not generally form an anodic film, such as plastic, ceramic or glass materials. In particular, the methods described relate to manufacturing methods that are compatible with anodizing processes and avoid defects related to anodizing processes. In particular embodiments, the methods involve avoiding trapping of anodizing chemicals within a gap between an anodizable portion and a non-anodizable portion, which prevents the anodizing chemicals from disrupting the uptake of dye in a post-anodizing dyeing process.

    Abstract translation: 描述了包括阳极化部分和非阳极氧化部分的复合部件的制造方法和系统,使得可阳极氧化部分和非阳极氧化部分之间的界面没有可见的缺陷。 非阳极氧化部分可以由诸如铝或铝合金的阳极化金属制成。 非阳极氧化部分由通常不形成阳极膜的材料制成,例如塑料,陶瓷或玻璃材料。 特别地,所描述的方法涉及与阳极氧化工艺兼容并避免与阳极氧化工艺相关的缺陷的制造方法。 在具体实施方案中,所述方法涉及避免在阳极氧化部分和非阳极化部分之间的间隙内捕获阳极化化学品,这防止阳极氧化化学品在后阳极氧化染色过程中破坏染料的吸收。

    CABLE STRUCTURES WITH LOCALIZED FOAM STRAIN RELIEFS AND SYSTEMS AND METHODS FOR MAKING THE SAME
    17.
    发明申请
    CABLE STRUCTURES WITH LOCALIZED FOAM STRAIN RELIEFS AND SYSTEMS AND METHODS FOR MAKING THE SAME 有权
    具有本地化泡沫应变消除和系统的电缆结构及其制造方法

    公开(公告)号:US20150083490A1

    公开(公告)日:2015-03-26

    申请号:US14038215

    申请日:2013-09-26

    Applicant: Apple Inc.

    CPC classification number: H01B3/004 H04R1/1016 H04R1/1033

    Abstract: Cable structures with localized foam strain reliefs and systems and methods for making the same are provided. In some embodiments, at least one localized foam strain relief may be incorporated into or positioned underneath a cover of a cable structure. For example, the ratio of base material to foam material may be varied during the manufacture of the cover, such that distinct portions of the cover may include more foam than other portions of the cover. This may provide localized strain relief properties to the cable structure while also obviating the need for additional strain relief components to be provided adjacent to or over specific portions of the cover.

    Abstract translation: 提供具有局部泡沫应变消除的电缆结构及其制造方法及其制造方法。 在一些实施例中,至少一个局部化的泡沫应变消除件可以结合到电缆结构的盖子中或者位于电缆结构的盖子的下方。 例如,基材与泡沫材料的比例可以在盖的制造期间变化,使得盖的不同部分可以包括比盖的其它部分更多的泡沫。 这可以为电缆结构提供局部应变消除特性,同时也避免了在盖的特定部分附近或其上的特定部分附近提供额外的应变消除部件的需要。

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