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公开(公告)号:US20240236525A1
公开(公告)日:2024-07-11
申请号:US18326940
申请日:2023-05-31
Applicant: Apple Inc.
Inventor: Jiaju Ma , Arnaud Laflaquiere
IPC: H04N25/75
CPC classification number: H04N25/75
Abstract: An image sensor may include a plurality of pixels, each of which may include a photodiode having a charge accumulation region (“PD”), a floating diffusion region (“FD”), and a charge transfer region vertically between the PD and FD. The vertical charge transfer region may include a first charge modulation region (“P1”), a second charge modulation region (“P2”), and a third charge modulation region (“P3”). The image sensor may operate in a global shutter mode, in which the P2 may be used as an in-pixel charge memory region to temporarily store charge during transfer of the charge from PD to FD via P1, P2, and P3.
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公开(公告)号:US11271031B2
公开(公告)日:2022-03-08
申请号:US16876511
申请日:2020-05-18
Applicant: Apple Inc.
Inventor: Shingo Mandai , Cristiano L. Niclass , Nobuhiro Karasawa , Xiaofeng Fan , Arnaud Laflaquiere , Gennadiy A. Agranov
IPC: H01L27/146 , G01S7/4863 , H01L31/107 , H04N5/355 , H04N5/357 , H04N5/369 , H04N5/3745 , H04N5/376 , H04N5/378 , G01S7/4861 , H01L31/02 , H01L31/0352
Abstract: A back-illuminated single-photon avalanche diode (SPAD) image sensor includes a sensor wafer stacked vertically over a circuit wafer. The sensor wafer includes one or more SPAD regions, with each SPAD region including an anode gradient layer, a cathode region positioned adjacent to a front surface of the SPAD region, and an anode avalanche layer positioned over the cathode region. Each SPAD region is connected to a voltage supply and an output circuit in the circuit wafer through inter-wafer connectors. Deep trench isolation elements are used to provide electrical and optical isolation between SPAD regions.
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公开(公告)号:US10658419B2
公开(公告)日:2020-05-19
申请号:US15713520
申请日:2017-09-22
Applicant: Apple Inc.
Inventor: Shingo Mandai , Cristiano L. Niclass , Nobuhiro Karasawa , Xiaofeng Fan , Arnaud Laflaquiere , Gennadiy A. Agranov
IPC: H01L27/146 , G01S7/486 , H04N5/357 , H04N5/369 , H01L31/107 , H04N5/355 , H04N5/376 , H04N5/3745 , H04N5/378 , H01L31/02 , H01L31/0352 , G01S7/4861 , G01S7/4863
Abstract: A back-illuminated single-photon avalanche diode (SPAD) image sensor includes a sensor wafer stacked vertically over a circuit wafer. The sensor wafer includes one or more SPAD regions, with each SPAD region including an anode gradient layer, a cathode region positioned adjacent to a front surface of the SPAD region, and an anode avalanche layer positioned over the cathode region. Each SPAD region is connected to a voltage supply and an output circuit in the circuit wafer through inter-wafer connectors. Deep trench isolation elements are used to provide electrical and optical isolation between SPAD regions.
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公开(公告)号:US20250102628A1
公开(公告)日:2025-03-27
申请号:US18763961
申请日:2024-07-03
Applicant: Apple Inc.
Inventor: Fei Tan , Pengfei Qiao , Alexander Hein , Chin Han Lin , Tong Chen , Takashi Hosoda , Arnaud Laflaquiere
Abstract: Disclosed herein are self-mixing interference (SMI) sensors, frequency modulated continuous wave (FMCW) sensors, and electronic devices that include SMI and FMCW sensors. Both types of sensors include a photonic crystal surface-emitting laser diode. The SMI sensors include a photonic crystal surface-emitting laser diode configured to undergo SMI between a primary emitted light from the photonic crystal surface-emitting laser diode and reflections thereof from an object. The SMI sensor includes a photodetector configured to receive a secondary light emission from the photonic crystal surface-emitting laser diode and detect a parameter related to the SMI, from which distance or motion to the object may be inferred. The FMCW sensors include a photonic crystal surface-emitting laser diode configured to emit a primary light emission toward the object and a secondary light emission toward a light beam combiner. The light beam combiner also receives reflections from the object and detects distances and/or motion of the object based on the frequency modulations of the two light beams.
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公开(公告)号:US20240372328A1
公开(公告)日:2024-11-07
申请号:US18143869
申请日:2023-05-05
Applicant: Apple Inc.
Inventor: Siddharth Joshi , Nicolas Hotellier , Fei Tan , Anne-Laure Bavencove , Chin-Han Lin , Arnaud Laflaquiere
Abstract: An optoelectronic device includes a silicon interposer and an array of resonant cavity mesas. The array of resonant cavity mesas is monolithically integrated in a set of one or more epitaxial layers and flip-chip bonded to the silicon interposer. The array of resonant cavity mesas includes a first subset of resonant cavity mesas connected to a first subset of conductors of the silicon interposer and biased to a first electrical polarity, and a second subset of resonant cavity mesas connected to a second subset of conductors of the silicon interposer. The second subset of resonant cavity mesas provides electrostatic discharge (ESD) protection for the first subset of resonant cavity mesas.
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公开(公告)号:US20230152081A1
公开(公告)日:2023-05-18
申请号:US18094255
申请日:2023-01-06
Applicant: Apple Inc.
Inventor: Fei Tan , Arnaud Laflaquiere , Chin Han Lin , Keith Lyon , Marc A. Drader , Weiping Li
IPC: G01B9/02097 , H01S5/026 , H01S5/343 , H01S5/183 , H01S5/30 , G01B9/02 , G01B11/02 , G01S17/34 , G01S7/4912
CPC classification number: G01B9/02097 , H01S5/0262 , H01S5/3432 , H01S5/18313 , H01S5/3095 , G01B9/02092 , G01B11/026 , H01S5/183 , G01S17/34 , G01S7/4916
Abstract: Disclosed herein are self-mixing interferometry (SMI) sensors, such as may include vertical cavity surface emitting laser (VCSEL) diodes and resonance cavity photodetectors (RCPDs). Structures for the VCSEL diodes and RCPDs are disclosed. In some embodiments, a VCSEL diode and an RCPD are laterally adjacent and formed from a common set of semiconductor layers epitaxially formed on a common substrate. In some embodiments, a first and a second VCSEL diode are laterally adjacent and formed from a common set of semiconductor layers epitaxially formed on a common substrate, and an RCPD is formed on the second VCSEL diode. In some embodiments, a VCSEL diode may include two quantum well layers, with a tunnel junction layer between them. In some embodiments, an RCPD may be vertically integrated with a VCSEL diode.
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公开(公告)号:US11549799B2
公开(公告)日:2023-01-10
申请号:US16913645
申请日:2020-06-26
Applicant: Apple Inc.
Inventor: Fei Tan , Arnaud Laflaquiere , Chin Han Lin , Keith Lyon , Marc A. Drader , Weiping Li
IPC: G01B9/02 , G01B9/02097 , H01S5/026 , H01S5/343 , H01S5/183 , H01S5/30 , G01B11/02 , G01S17/34 , G01S7/4912
Abstract: Disclosed herein are self-mixing interferometry (SMI) sensors, such as may include vertical cavity surface emitting laser (VCSEL) diodes and resonance cavity photodetectors (RCPDs). Structures for the VCSEL diodes and RCPDs are disclosed. In some embodiments, a VCSEL diode and an RCPD are laterally adjacent and formed from a common set of semiconductor layers epitaxially formed on a common substrate. In some embodiments, a first and a second VCSEL diode are laterally adjacent and formed from a common set of semiconductor layers epitaxially formed on a common substrate, and an RCPD is formed on the second VCSEL diode. In some embodiments, a VCSEL diode may include two quantum well layers, with a tunnel junction layer between them. In some embodiments, an RCPD may be vertically integrated with a VCSEL diode.
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公开(公告)号:US11469573B2
公开(公告)日:2022-10-11
申请号:US16779609
申请日:2020-02-02
Applicant: Apple Inc.
Inventor: Keith Lyon , Arnaud Laflaquiere
IPC: H01S5/00 , H01S5/183 , H01S5/02 , H01S5/30 , H01S5/42 , H01S5/02255 , H01S5/026 , G02B27/42 , H01S5/02253 , H01S5/02326
Abstract: An optoelectronic device includes a semiconductor substrate having first and second faces. A first array of emitters are formed on the first face of the semiconductor substrate and are configured to emit respective beams of radiation through the substrate. Electrical connections are coupled to actuate selectively first and second sets of the emitters in the first array. A second array of microlenses are formed on the second face of the semiconductor substrate in respective alignment with the emitters in at least one of the first and second sets and are configured to focus the beams emitted from the emitters in the at least one of the first and second sets so that the beams are transmitted from the second face with different, respective first and second focal properties.
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公开(公告)号:US20210336422A1
公开(公告)日:2021-10-28
申请号:US17228742
申请日:2021-04-13
Applicant: Apple Inc.
Inventor: Fei Tan , Arnaud Laflaquiere , Chinhan Lin , Christophe Verove , Jae Y Park
Abstract: An optoelectronic device includes: (i) a semiconductor substrate doped with a first level of n-type dopants, (ii) a contact semiconductor layer disposed over the semiconductor substrate and doped with a second level of n-type dopants, larger than the first level, (iii) an upper distributed Bragg-reflector (DBR) stack disposed over the contact semiconductor layer and including alternating first and second epitaxial semiconductor layers having respective first and second indexes of refraction that differ from one another in a predefined wavelength band, (iv) a set of epitaxial layers disposed over the upper DBR, the set of epitaxial layers includes one or more III-V semiconductor materials and defines: (a) a quantum well structure, and (b) a confinement layer, and (v) a lower DBR stack disposed over the set of epitaxial layers, opposite the upper DBR, and including alternating dielectric and semiconductor layers.
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公开(公告)号:US20180090526A1
公开(公告)日:2018-03-29
申请号:US15713520
申请日:2017-09-22
Applicant: Apple Inc.
Inventor: Shingo Mandai , Cristiano L. Niclass , Nobuhiro Karasawa , Xiaofeng Fan , Arnaud Laflaquiere , Gennadiy A. Agranov
IPC: H01L27/146 , H04N5/378 , H04N5/369
CPC classification number: H01L27/14665 , G01S7/4861 , G01S7/4863 , H01L27/14603 , H01L27/14609 , H01L27/1461 , H01L27/14616 , H01L27/14623 , H01L27/14627 , H01L27/14629 , H01L27/1463 , H01L27/14632 , H01L27/14634 , H01L27/1464 , H01L27/14643 , H01L31/02027 , H01L31/03529 , H01L31/107 , H04N5/35572 , H04N5/3577 , H04N5/3698 , H04N5/37452 , H04N5/3765 , H04N5/378
Abstract: A back-illuminated single-photon avalanche diode (SPAD) image sensor includes a sensor wafer stacked vertically over a circuit wafer. The sensor wafer includes one or more SPAD regions, with each SPAD region including an anode gradient layer, a cathode region positioned adjacent to a front surface of the SPAD region, and an anode avalanche layer positioned over the cathode region. Each SPAD region is connected to a voltage supply and an output circuit in the circuit wafer through inter-wafer connectors. Deep trench isolation elements are used to provide electrical and optical isolation between SPAD regions.
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