公开(公告)号：US20240003995A1

公开(公告)日：2024-01-04

申请号：US17810353

申请日：2022-07-01

Applicant: Allegro MicroSystems, LLC

Inventor： Simon E. Rock ,  Georges El Bacha ,  Shaun D. Milano ,  Loïc André Messier ,  Alexander Latham ,  Maxwell McNally ,  Shixi Louis Liu

IPC: G01R33/06 ,  G01R19/00 ,  H05K1/18

CPC classification number: G01R33/06 ,  G01R19/0092 ,  H05K1/181 ,  H05K2201/10151

Abstract: A current sensor IC includes a lead frame having a die attach pad and elongated leads extending in a single direction with respect to the die attach pad, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface supporting magnetic field sensing elements, and a non-conductive mold material. A first portion of the mold material encloses the semiconductor die and the die attach pad, a second portion of the mold material encloses a portion of the elongated leads, and the mold material further includes a wing structure between the first portion and the second portion. In assembly, the first portion of the mold material extends into a cutout through a current conductor and the wing structure abuts a surface of the conductor. The current sensor can implement differential sensing based on signals from at least two magnetic field sensing elements.

公开(公告)号：US11313899B2

公开(公告)日：2022-04-26

申请号：US16655657

申请日：2019-10-17

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Georges El Bacha ,  Michael C. Doogue ,  David J. Haas ,  Gregory Delmain ,  Michael Gaboury ,  William P. Taylor

IPC: G01R31/28 ,  G01R33/02 ,  G01R31/3187 ,  G01R35/00 ,  G01R33/09 ,  G01R33/00 ,  G01R33/07

Abstract: Methods and apparatus for providing an integrated circuit having a drive current source, a magnetic sensing element coupled to the drive current source, the magnetic sensing element having first and second differential outputs, and first and second current elements to provide respective currents in relation to the drive current source, wherein the first current element is coupled to the first differential output and the second current element is coupled to the second differential output. In illustrative embodiments, an IC output can output a voltage corresponding to the currents of the first and second current elements.

公开(公告)号：US20190391185A1

公开(公告)日：2019-12-26

申请号：US16013330

申请日：2018-06-20

Applicant: Allegro MicroSystems, LLC

Inventor： Georges El Bacha ,  Evan Shorman ,  Cory Voisine ,  Alexander Latham ,  William P. Taylor

IPC: G01R15/20 ,  G01R19/00 ,  G01R33/09 ,  G01R33/07

Abstract: A current sensor integrated circuit including a magnetic field sensing element, a current conductor, an insulation structure, and a power calculation circuit is configured to meet safety isolation requirements. The current sensor integrated circuit may include or be used with isolation resistors to allow for voltage from a high voltage side to be sensed at a low voltage side of the circuit. The insulation structure, current sensor package, and isolation resistors can achieve at least 500 Vrms isolation.

公开(公告)号：US09910088B2

公开(公告)日：2018-03-06

申请号：US14578813

申请日：2014-12-22

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： Shaun D. Milano ,  Georges El Bacha ,  Michael C. Doogue ,  William P. Taylor

IPC: G01B7/30 ,  G01R27/02 ,  G01R31/02 ,  G01R31/28 ,  G01R33/00 ,  G01R31/3187 ,  G01R33/02 ,  G01R33/07 ,  G01R33/09 ,  G01R35/00

CPC classification number: G01R31/2884 ,  G01R31/2829 ,  G01R31/3187 ,  G01R33/00 ,  G01R33/0023 ,  G01R33/02 ,  G01R33/07 ,  G01R33/09 ,  G01R33/091 ,  G01R35/00 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Methods and apparatus to provide an integrated circuit having a magnetic sensing element and fault detection module coupled to the sensing element, the fault detection module including circuitry to detect a fault condition and to self-test operation of the circuitry for detecting the fault condition. In illustrative embodiments, a fault pin indicates the fault condition.