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公开(公告)号:US20210122952A1
公开(公告)日:2021-04-29
申请号:US15733482
申请日:2019-01-31
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Li Yao , Rajdeep S. Kalgutkar , Mario A. Perez , Wayne S. Mahoney , Jeremy M. Higgins , Brett A. Beierman
IPC: C09J135/02 , C09J177/06 , C09J11/04 , C09K5/14 , H01M10/6551 , H01M10/625
Abstract: A curable composition includes a polyamide composition that includes a first polyamide. The first polyamide includes a tertiary amide in the backbone thereof and is amine terminated. The curable composition further includes an amino functional compound comprising from 2 to 20 carbon atoms, a multifunctional (meth)acrylate, an epoxy resin, and an inorganic filler. The inorganic filler is present an amount of at least 25 wt. %, based on the total weight of the curable composition.
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12.
公开(公告)号:US20190382579A1
公开(公告)日:2019-12-19
申请号:US16470570
申请日:2017-12-12
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Corinne E. Lipscomb , Jeremy M. Higgins
Abstract: A method of making a resin composition is described comprising providing a mixture of boron nitride particles and cellulose nanocrystals and combining the mixture with a resin composition. The weight ratio of boron nitride to cellulose nanocrystals typically ranges from 99.9:0.1 to 90:10. The resin composition can have a viscosity at least a 5, 10, 15, 20 or 25% lower than the same composition without the cellulose nanocrystals, which facilitate processing efficiency and is also amenable to incorporating higher boron nitride concentrations into the resin composition. Also described is a (e.g. powder) composition comprising premixed boron nitride particles and cellulose nanocrystals and resin composition comprising such (e.g. powder) composition.
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13.
公开(公告)号:US20230383114A1
公开(公告)日:2023-11-30
申请号:US18366753
申请日:2023-08-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Brett A. Beiermann , John C. Clark , Eric G. Larson , Jeremy M. Higgins , Audrey S. Forticaux , Jay R. Lomeda , Wayne S. Mahoney , Scott B. Charles , Timothy D. Fletcher , Wendy L. Thompson , Kyle R. Schwartz
CPC classification number: C08L63/00 , C08K3/14 , C08K3/22 , C08K3/38 , C08K7/20 , H05K5/02 , C08K2003/2227 , C08K2003/385 , C08K2201/001 , C08K2201/009
Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.
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14.
公开(公告)号:US20230323131A1
公开(公告)日:2023-10-12
申请号:US18024472
申请日:2021-09-03
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Yongbeom Seo , Matthew H. Frey , Jacob P. Podkaminer , Victor Ho , Samuel J. Carpenter , Audrey S. Forticaux , Lalitha V. N. R. Ganapatibhotla , Taisiya Skorina , Jeremy M. Higgins , Yangbin Chen
CPC classification number: C09C1/407 , C09C3/06 , C01P2006/16
Abstract: A decorated particle comprises a single inorganic particle core having an uneven outer surface with a plurality of crevices and an average particle diameter of 20 to 150 microns. A binder retaining decorating particles is disposed on at least a portion of the outer surface of the inorganic particle core and fills the crevices. The decorating particles have an average particle diameter of 0.05 to 10 microns. A method of making decorated particles is also disclosed.
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15.
公开(公告)号:US11472992B2
公开(公告)日:2022-10-18
申请号:US16763168
申请日:2018-11-15
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Derek J. Dehn , Clinton P. Waller, Jr. , Bharat R. Acharya , Brandon A. Bartling , Audrey S. Forticaux , Jeremy M. Higgins , Satinder K. Nayar
IPC: C09K5/14 , B29C41/00 , B29C41/46 , C08K3/04 , C08K3/08 , C08K3/22 , C08K3/34 , C08K3/38 , B29K101/12
Abstract: Polymer matrix composite comprising a porous polymeric network; and a plurality of thermally conductive particles distributed within the polymeric network structure; wherein the thermally conductive particles are present in a range from 15 to 99 weight percent, based on the total weight of the thermally conductive particles and the polymer (excluding the solvent); and wherein the polymer matrix composite has a density of at least 0.3 g/cm3; and methods for making the same. The polymer matrix composites are useful, for example, in electronic devices.
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公开(公告)号:US20220162376A1
公开(公告)日:2022-05-26
申请号:US17440976
申请日:2019-03-25
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Li Yao , Michael A. Kropp , Matthew J. Kryger , Wayne S. Mahoney , Mario A. Perez , Shuang Wu , Lingjie Tong , Ahmad Shaaban , Adrian T. Jung , Jeremy M. Higgins , Ying Lin
IPC: C08G59/66 , C08G59/24 , C08K5/37 , C08K3/22 , C08K7/18 , C08K9/06 , C09J163/00 , H01M50/233 , H01M10/653
Abstract: A curable composition includes a first part comprising an epoxy resin; and a second part comprising a multifunctional, functional thiol containing compound. The curable composition further includes an inorganic filler present in an amount of at least 20 weight %, based on the total weight of the curable composition. The multifunctional, functional thiol containing compound comprises an ether in the backbone thereof.
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公开(公告)号:US20210395455A1
公开(公告)日:2021-12-23
申请号:US17288032
申请日:2019-10-24
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Jenny B. Werness , Douglas L. Elmore , Jeremy M. Higgins , Jens Eichler , Simone Jurjevic , Siegfried R. Goeb , Wolf Steiger , Peter Bissinger
Abstract: The present disclosure relates to an acid-curable composition, comprising: a) a base component comprising a cationically self-curable oligomeric compound; b) a curing system for the cationically self-curable oligomeric compound, which comprises: i. an ionogenic compound comprising an anion and ammonium as a cation; and ii. water. According to another aspect, the present disclosure is directed to a curing system suitable for an acid-curable composition comprising a cationically self-curable oligomeric compound. According to still another aspect, the present disclosure relates to a method of manufacturing an acid-curable composition. In yet another aspect, the disclosure relates to the use of an acid-curable composition for industrial applications, in particular for thermal management applications in the automotive industry.
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公开(公告)号:US10899865B2
公开(公告)日:2021-01-26
申请号:US16088876
申请日:2017-03-31
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Benjamin J. Anderson , Jay R. Lomeda , Wendy L. Thompson , Jeremy M. Higgins , Amit J. Patel
IPC: C08G16/02 , C08L71/00 , C08G73/00 , C07C255/54 , C07C323/32 , C08L61/00
Abstract: The present disclosure provides a resin blend containing a blend of a first phthalonitrile resin, a filler, and a bisphenol M diphthalonitrile ether resin. Suitable fillers include at least one of nanoparticles, microparticles, or fibers. The present disclosure also provides an article including a polymerization product of such a resin blend. The resin blends can be prepared at lower temperatures than phthalonitrile resin blends without a bisphenol M diphthalonitrile ether resin.
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公开(公告)号:US20200156306A1
公开(公告)日:2020-05-21
申请号:US16632970
申请日:2018-07-26
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Mario A. Perez , Jeremy M. Higgins , Clint J. Novotny , Mitchell T. Huang
Abstract: An oriented film includes, an orientated polyester layer, and alumina particles dispersed within the orientated polyester layer. The alumina particles are present in an amount from 20 to 40% wt of the orientated film. The alumina particles having a D99 value of 25 micrometers or less.
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公开(公告)号:US10087352B2
公开(公告)日:2018-10-02
申请号:US15804076
申请日:2017-11-06
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Mario A. Perez , Mitchell T. Huang , Jeremy M. Higgins , Clint J. Novotny
IPC: B32B15/09 , B32B27/08 , C09K5/14 , B29C55/00 , B29K505/08 , B29K509/00 , B29K507/04 , B29K507/02 , B29K505/02 , B29K67/00
Abstract: An oriented film includes an orientated semi-aromatic polyester layer and a thermally conductive filler dispersed in the orientated semi-aromatic polyester layer. The thermally conductive filler is at least 20% wt. of the oriented film.
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