公开(公告)号：US20200299506A1

公开(公告)日：2020-09-24

申请号：US16088876

申请日：2017-03-31

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Benjamin J. Anderson ,  Jay R. Lomeda ,  Wendy L. Thompson ,  Jeremy M. Higgins ,  Amit J. Patel

IPC: C08L71/00

Abstract: The present disclosure provides a resin blend containing a blend of a first phthalonitrile resin, a filler, and a bisphenol M diphthalonitrile ether resin. Suitable fillers include at least one of nanoparticles, microparticles, or fibers. The present disclosure also provides an article including a polymerization product of such a resin blend. The resin blends can be prepared at lower temperatures than phthalonitrile resin blends without a bisphenol M diphthalonitrile ether resin.

公开(公告)号：US20200283619A1

公开(公告)日：2020-09-10

申请号：US16756518

申请日：2018-12-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Brett A. Beiermann ,  John C. Clark ,  Eric G. Larson ,  Jeremy M. Higgins ,  Audrey S. Forticaux ,  Jay R. Lomeda ,  Wayne S. Mahoney ,  Scott B. Charles ,  Timothy D. Fletcher ,  Wendy L. Thompson ,  Kyle R. Schwartz

IPC: C08L63/00 ,  H05K5/02 ,  C08K3/22 ,  C08K7/20 ,  C08K3/14 ,  C08K3/38

Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure maybe a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.

公开(公告)号：US20210403646A1

公开(公告)日：2021-12-30

申请号：US17288955

申请日：2019-11-04

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Peter Bissinger ,  Wolf Steiger ,  Simone Jurjevic ,  Jenny B. Werness ,  Jens Eichler ,  Jeremy M. Higgins ,  Emelie Fritz

IPC: C08G73/02

Abstract: The present disclosure relates to an acid-curable composition, comprising: a) abase component comprising a cationically self-curable oligomeric compound; and b) a curing system for the cationically self-curable oligomeric compound, which comprises an ionogenic compound comprising an anion and an aminium ion as a cation. According to another aspect, the present disclosure is directed to a curing system suitable for an acid-curable composition comprising a cationically self-curable oligomeric compound. According to still another aspect, the present disclosure relates to a method of manufacturing an acid-curable composition. In yet another aspect, the disclosure relates to the use of an acid-curable composition for industrial applications, in particular for thermal management applications in the automotive industry.

公开(公告)号：US20210371608A1

公开(公告)日：2021-12-02

申请号：US16632979

申请日：2018-07-30

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Mario A. Perez ,  Jeremy M. Higgins ,  Clint J. Novotny ,  Mitchell T. Huang

IPC: C08J5/18 ,  H05K7/20 ,  B29C48/00 ,  B29C48/08 ,  C08L67/02

Abstract: A thermally conductive dielectric film includes a thermoplastic layer including polyester segments and 5 to 30% by wt polyether amide segments. The thermally conductive dielectric film has a thickness of less than 100 micrometers.

公开(公告)号：US20210363397A1

公开(公告)日：2021-11-25

申请号：US16763168

申请日：2018-11-15

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Derek J. Dehn ,  Clinton P. Waller, Jr. ,  Bharat R. Acharya ,  Brandon A. Bartling ,  Audrey S. Forticaux ,  Jeremy M. Higgins ,  Satinder K. Nayar

IPC: C09K5/14 ,  C08K3/38 ,  C08K3/22 ,  C08K3/34 ,  C08K3/08 ,  C08K3/04 ,  B29C41/00 ,  B29C41/46

Abstract: Polymer matrix composite comprising a porous polymeric network; and a plurality of thermally conductive particles distributed within the polymeric network structure; wherein the thermally conductive particles are present in a range from 15 to 99 weight percent, based on the total weight of the thermally conductive particles and the polymer (excluding the solvent); and wherein the polymer matrix composite has a density of at least 0.3 g/cm3; and methods for making the same. The polymer matrix composites are useful, for example, in electronic devices.

公开(公告)号：US20210189212A1

公开(公告)日：2021-06-24

申请号：US17055220

申请日：2019-05-10

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jenny B. Werness ,  Simone Jurjevic ,  Siegfried R. Goeb ,  Peter Bissinger ,  Wolf Steiger ,  Jeremy M. Higgins ,  Jens Eichler

IPC: C09K5/14 ,  C08K9/04 ,  C08K3/22 ,  C08K3/08 ,  C08K7/18 ,  C08K5/521 ,  C08K13/06 ,  C08L71/02 ,  H01M50/264 ,  H01M10/613 ,  H01M10/653 ,  H01M10/6551

Abstract: Control cure thermally-conductive gap filler materials are described, as are methods of curing. Also described are curing agents and methods of making curing agents.

公开(公告)号：US20200259137A1

公开(公告)日：2020-08-13

申请号：US16753897

申请日：2018-10-03

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Li Yao ,  Rajdeep S. Kalgutkar ,  Mario A. Perez ,  Jeremy M. Higgins ,  Taesung Kim ,  Brett A. Beiermann

IPC: H01M2/10 ,  C08G59/54 ,  C09K5/14 ,  C09J163/00 ,  C09J9/00 ,  H01M10/653 ,  H01M10/625

Abstract: A curable composition includes a polyamide composition comprising a polyamide. The polyamide comprises a tertiary amide in the backbone thereof and is amine terminated. The curable composition also comprises an epoxy composition that includes an epoxy resin.

公开(公告)号：US20180057727A1

公开(公告)日：2018-03-01

申请号：US15804076

申请日：2017-11-06

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Mario A. Perez ,  Mitchell T. Huang ,  Jeremy M. Higgins ,  Clint J. Novotny

IPC: C09K5/14 ,  B29C55/00 ,  B29K507/04 ,  B29K507/02 ,  B29K505/02 ,  B29K67/00 ,  B29K509/00 ,  B29K505/08

CPC classification number: C09K5/14 ,  B29C55/005 ,  B29K2067/003 ,  B29K2505/02 ,  B29K2505/08 ,  B29K2507/02 ,  B29K2507/04 ,  B29K2509/00

Abstract: An oriented film includes an orientated semi-aromatic polyester layer and a thermally conductive filler dispersed in the orientated semi-aromatic polyester layer. The thermally conductive filler is at least 20% wt. of the oriented film.

公开(公告)号：US09834713B2

公开(公告)日：2017-12-05

申请号：US15050922

申请日：2016-02-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Mario A. Perez ,  Mitchell T. Huang ,  Jeremy M. Higgins ,  Clint J. Novotny

IPC: B32B15/09 ,  B32B27/08 ,  C09K5/14 ,  B29C55/00 ,  B29K67/00 ,  B29K505/02 ,  B29K507/02 ,  B29K507/04 ,  B29K509/00 ,  B29K505/08

CPC classification number: C09K5/14 ,  B29C55/005 ,  B29K2067/003 ,  B29K2505/02 ,  B29K2505/08 ,  B29K2507/02 ,  B29K2507/04 ,  B29K2509/00

Abstract: An oriented film includes an orientated semi-aromatic polyester layer and a thermally conductive filler dispersed in the orientated semi-aromatic polyester layer. The thermally conductive filler is at least 20% wt. of the oriented film.

公开(公告)号：US11773254B2

公开(公告)日：2023-10-03

申请号：US16756518

申请日：2018-12-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Brett A. Beiermann ,  John C. Clark ,  Eric G. Larson ,  Jeremy M. Higgins ,  Audrey S. Forticaux ,  Jay R. Lomeda ,  Wayne S. Mahoney ,  Scott B. Charles ,  Timothy D. Fletcher ,  Wendy L. Thompson ,  Kyle R. Schwartz

IPC: C08L63/00 ,  C08K3/14 ,  C08K3/22 ,  C08K3/38 ,  C08K7/20 ,  H05K5/02

CPC classification number: C08L63/00 ,  C08K3/14 ,  C08K3/22 ,  C08K3/38 ,  C08K7/20 ,  H05K5/02 ,  C08K2003/2227 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/009

Abstract: An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, wherein the inorganic particles are selected from alumina, boron nitride, silicon carbide, alumina trihydrate and mixtures thereof. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.