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    Image sensor package and camera module utilizing the same
    11.
    发明授权
    Image sensor package and camera module utilizing the same 有权
    图像传感器封装和相机模块

    公开(公告)号：US07916212B2

    公开(公告)日：2011-03-29

    申请号：US12210534

    申请日：2008-09-15

    Applicant: Ying-Cheng Wu ,  Te-Chun Chou

    Inventor： Ying-Cheng Wu ,  Te-Chun Chou

    IPC: H04N5/225 ,  H01L31/0203

    CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014

    Abstract: An image sensor package includes an image sensor chip, a sidewall, an encapsulation glass, conductive material, and a plurality of solder balls. The image sensor chip comprises a photosensitive area, a non-photosensitive area surrounding the photosensitive area, and a plurality of bonding pads formed on the non-photosensitive area. The sidewall is located on the non-photosensitive are and defines a plurality of first through holes aligned with and corresponding to the bonding pads. The encapsulation glass is located on the sidewall. A plurality of solder balls are formed on the encapsulation glass aligned with the bonding pads, respectively. The encapsulation glass defines a plurality of second through holes each corresponding to a bonding pad and a corresponding solder ball. The image sensor package further comprises a conductive material through which the first and second through holes penetrate.

    Abstract translation: 图像传感器封装包括图像传感器芯片，侧壁，封装玻璃，导电材料和多个焊球。 图像传感器芯片包括感光区域，环绕感光区域的非感光区域和形成在非感光区域上的多个接合焊盘。 侧壁位于非感光体上，并且限定与接合焊盘对准并对应于接合焊盘的多个第一通孔。 封装玻璃位于侧壁上。 分别在与焊盘对准的封装玻璃上形成多个焊球。 封装玻璃限定多个第二通孔，每个通孔对应于焊盘和相应的焊球。 图像传感器封装还包括导电材料，第一和第二通孔穿过该导电材料。

    Image sensor chip package
    13.
    发明授权
    Image sensor chip package 失效
    图像传感器芯片封装

    公开(公告)号：US07554184B2

    公开(公告)日：2009-06-30

    申请号：US11448570

    申请日：2006-06-07

    Applicant: Steven Webster ,  Ying-Cheng Wu

    Inventor： Steven Webster ,  Ying-Cheng Wu

    IPC: H01L23/02 ,  H01L23/48

    CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/16195 ,  H01L2924/00014

    Abstract: A chip package (200) includes a carrier (20), a chip (22), a second conductive means (26) and a transparent cover (28). The carrier (20) includes a base (24). The chip is mounted on the base and has an active area (222). The second conductive means electronically connects the chip with the conductive means. The first adhesive means is applied around the active area of the chip. The transparent cover is mounted to the base of the carrier. The cover is adhered with the first adhesive means so as to define a sealing space (32) for sealing the active area of the chip therein. It can be seen that the active area of the chip is sufficiently protected from pollution by the small volume of the sealing space.

    Abstract translation: 芯片封装（200）包括载体（20），芯片（22），第二导电装置（26）和透明盖（28）。 载体（20）包括基座（24）。 芯片安装在基座上并具有有源区域（222）。 第二导电装置将芯片与导电装置电连接。 第一粘合装置被施加在芯片的有效区域周围。 透明盖安装在托架的底座上。 该盖用第一粘合装置粘合以便限定用于密封芯片的有效区域的密封空间（32）。 可以看出，芯片的有效面积被充分保护，免受小体积密封空间的污染。

    Digital camera module with improved image quality
    14.
    发明授权
    Digital camera module with improved image quality 有权
    具有改善图像质量的数码相机模块

    公开(公告)号：US07460317B2

    公开(公告)日：2008-12-02

    申请号：US11450649

    申请日：2006-06-09

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

    IPC: G02B7/02

    CPC classification number: G02B7/02

    Abstract: A digital camera module (100) includes a lens barrel (20), a lens holder (22), an image pick-up module (26), and a protective member. The lens barrel defines a central hollow, and has at least one lens (202) received therein. The lens holder defines a central hollow. The lens barrel is movably received in the lens holder along an axis of the lens holder. The image pick-up module is arranged to receive light from the lenses. The protective member is configured for preventing dust and/or particle contamination associated with a relative movement of the lens barrel and the lens holder falling onto the image pick-up module.

    Abstract translation: 数码相机模块（100）包括镜筒（20），透镜保持架（22），图像拾取模块（26）和保护构件。 透镜筒限定中心空腔，并且其中容纳有至少一个透镜（202）。 透镜架定义中心空心。 透镜镜筒沿透镜保持器的轴线可移动地容纳在透镜保持器中。 图像拾取模块被布置成接收来自透镜的光。 保护构件被配置为防止与透镜镜筒和透镜保持器落在图像拾取模块上的相对运动相关联的灰尘和/或颗粒污染。

    IMAGE CAPTURING DEVICE
    15.
    发明申请
    IMAGE CAPTURING DEVICE 有权
    图像捕获设备

    公开(公告)号：US20080265350A1

    公开(公告)日：2008-10-30

    申请号：US11862510

    申请日：2007-09-27

    Applicant: YING-CHENG WU ,  KUN-HSIAO LIU

    Inventor： YING-CHENG WU ,  KUN-HSIAO LIU

    IPC: H01L31/0232

    CPC classification number: H01L31/0203 ,  H01L31/02325 ,  H01L2224/48227 ,  H01L2924/3025 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An image capturing device includes an image sensor package and a lens module aligned with the image sensor package. The image sensor package includes a substrate, at least one passive component, an insulative layer, and an image sensor. The substrate has a surface facing an object side of the image capturing device, the surface defines a cavity therein. The at least one passive component is disposed within the cavity and electrically connected to the substrate. The insulative layer is received in the cavity and encases the at least one passive component. The image sensor is disposed on the insulative layer and electrically connected to the substrate. The holder has an end connecting with the barrel and an opposite end secured on the substrate.

    Abstract translation: 图像捕获装置包括图像传感器封装和与图像传感器封装件对准的透镜模块。 图像传感器封装包括衬底，至少一个无源部件，绝缘层和图像传感器。 基板具有面向图像捕获装置的物体侧的表面，该表面在其中限定空腔。 所述至少一个无源部件设置在所述腔体内并电连接到所述基板。 绝缘层被接收在空腔中并且包围至少一个无源部件。 图像传感器设置在绝缘层上并与衬底电连接。 保持器具有与筒连接的端部，并且相对端固定在基底上。

    CAMERA MODULE WITH COMPACT PACKAGING OF IMAGE SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME
    16.
    发明申请
    CAMERA MODULE WITH COMPACT PACKAGING OF IMAGE SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME 审中-公开
    具有图像传感器芯片的紧凑包装的相机模块及其制造方法

    公开(公告)号：US20080252771A1

    公开(公告)日：2008-10-16

    申请号：US11871923

    申请日：2007-10-12

    Applicant: YING-CHENG WU

    Inventor： YING-CHENG WU

    IPC: H04N5/225

    CPC classification number: H04N5/2254 ,  H04N5/2257

    Abstract: An exemplary camera module includes a lens module, a base, an image sensor chip, a bonding layer, and an imaging lens. The lens module is disposed on the base. The lens module is optically aligned with the image sensor chip. The image sensor chip is disposed on the base. The image sensor chip includes a photosensitive area. The bonding layer is disposed on at least one of the image sensor chip and the base. The bonding pads surround the photosensitive area. The imaging lens is adhered onto the bonding layer and hermetically seals the photosensitive area. The imaging lens is configured for focusing light signals onto the photosensitive area. The present invention also relates to a method for manufacturing the camera module.

    Abstract translation: 示例性相机模块包括透镜模块，底座，图像传感器芯片，粘结层和成像透镜。 透镜模块设置在基座上。 镜头模块与图像传感器芯片光学对准。 图像传感器芯片设置在基座上。 图像传感器芯片包括感光区域。 接合层设置在图像传感器芯片和基底中的至少一个上。 接合焊盘围绕感光区域。 成像透镜粘附到粘合层上并气密地密封感光区域。 成像透镜被配置为将光信号聚焦到感光区域上。 本发明还涉及一种用于制造相机模块的方法。

    LENS MODULE AND DIGITAL CAMERA MODULE USING SAME
    17.
    发明申请
    LENS MODULE AND DIGITAL CAMERA MODULE USING SAME 有权
    镜头模块和数码相机模块

    公开(公告)号：US20080100934A1

    公开(公告)日：2008-05-01

    申请号：US11682275

    申请日：2007-03-05

    Applicant: STEVEN WEBSTER ,  YING-CHENG WU ,  CHUN-HUNG LIN

    Inventor： STEVEN WEBSTER ,  YING-CHENG WU ,  CHUN-HUNG LIN

    IPC: G02B7/02

    CPC classification number: G02B7/021 ,  G02B7/023 ,  G02B7/025 ,  H04N5/2257

    Abstract: A digital camera module (100) includes a lens module (20) and a chip package (50) mounted in a light path of the lens module. The lens module includes a first lens assembly (21) and a second lens assembly (23). The first lens assembly includes a first fixture (211) having a through hole (212) defined therein and at least one lens (218) received in the through hole. The second assembly includes a second fixture (23) having a through hole (232) defined therein and at least one lens (238) attached therein. One of the first fixture and the second fixture has a slotted annular ring (213) protruding therefrom with an annular slot (214) defined therein. The other has a male annular ring (235) extending therefrom, and the slotted annular ring and the male annular ring matingly engage with each other to fix the first lens assembly and second assembly together.

    Abstract translation: 数字照相机模块（100）包括安装在透镜模块的光路中的透镜模块（20）和芯片封装（50）。 透镜模块包括第一透镜组件（21）和第二透镜组件（23）。 第一透镜组件包括其中限定有通孔（212）的第一固定件（211）和容纳在通孔中的至少一个透镜（218）。 第二组件包括具有限定在其中的通孔（232）的第二固定件（23）和附接在其中的至少一个透镜（238）。 第一固定装置和第二固定装置之一具有从其中突出的开槽环形圈（213），其中限定有环形槽（214）。 另一个具有从其延伸的阳环形环（235），并且开槽的环形环和阳环形环彼此配合地接合以将第一透镜组件和第二组件固定在一起。

    Image sensor chip packaging method
    18.
    发明申请
    Image sensor chip packaging method 有权
    图像传感器芯片封装方法

    公开(公告)号：US20070126916A1

    公开(公告)日：2007-06-07

    申请号：US11595331

    申请日：2006-11-10

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

    IPC: H04N5/225

    CPC classification number: H04N5/2254 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2924/01079 ,  H01L2924/16195 ,  H04N5/2253 ,  H01L2924/00014

    Abstract: An image sensor chip packaging method includes: first, providing a carrier (20). The carrier includes a base (21) and a lead frame (23). The base has a chamber (214) defined therein. The lead frame has a plurality of conduction pieces (233). The conduction pieces of the lead frame are embedded in the base and are spaced from each other. An image sensor chip (30) is then mounted in the chamber. The image sensor has a photosensitive area (301) and a plurality of chip pads (302). A plurality of bonding wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one of the exposed ends of a corresponding conduction piece of the carrier. A holder (50) having a holding cavity (54) is then provided. Finally, the carrier is then mounted in the holding cavity of the holder.

    Abstract translation: 图像传感器芯片封装方法包括：首先提供载体（20）。 载体包括基座（21）和引线框架（23）。 底座具有限定在其中的腔室（214）。 引线框架具有多个导电件（233）。 引线框架的导电片嵌入基座并彼此间隔开。 然后将图像传感器芯片（30）安装在腔室中。 图像传感器具有感光区域（301）和多个芯片焊盘（302）。 然后提供多个接合线（40）。 每根线将图像传感器芯片的相应的芯片焊盘和载体的相应导电片的暴露端之一电连接。 然后提供具有保持腔（54）的保持器（50）。 最后，将载体安装在支架的保持腔中。

    Digital camera module with improved image quality
    19.
    发明申请
    Digital camera module with improved image quality 有权
    具有改善图像质量的数码相机模块

    公开(公告)号：US20070008631A1

    公开(公告)日：2007-01-11

    申请号：US11450649

    申请日：2006-06-09

    Applicant: Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

    Inventor： Steven Webster ,  Ying-Cheng Wu ,  Ching-Lung Jao

    IPC: G02B7/02

    CPC classification number: G02B7/02

    Abstract: A digital camera module (100) includes a lens barrel (20), a lens holder (22), an image pick-up module (26), and a protective member. The lens barrel defines a central hollow, and has at least one lens (202) received therein. The lens holder defines a central hollow. The lens barrel is movably received in the lens holder along an axis of the lens holder. The image pick-up module is arranged to receive light from the lenses. The protective member is configured for preventing dust and/or particle contamination associated with a relative movement of the lens barrel and the lens holder falling onto the image pick-up module.

    Abstract translation: 数码相机模块（100）包括镜筒（20），透镜保持架（22），图像拾取模块（26）和保护构件。 透镜筒限定中心空腔，并且其中容纳有至少一个透镜（202）。 透镜架定义中心空心。 透镜镜筒沿透镜保持器的轴线可移动地容纳在透镜保持器中。 图像拾取模块被布置成接收来自透镜的光。 保护构件被配置为防止与透镜镜筒和透镜保持器落在图像拾取模块上的相对运动相关联的灰尘和/或颗粒污染。

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