公开(公告)号：US09679832B1

公开(公告)日：2017-06-13

申请号：US15215359

申请日：2016-07-20

Applicant: STMICROELECTRONICS SDN BHD

Inventor： Yh Heng

IPC: H01L23/495 ,  H01L21/50 ,  H01L21/48 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/49513 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/291 ,  H01L2224/29116 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/49173 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83439 ,  H01L2224/83815 ,  H01L2224/85385 ,  H01L2224/85439 ,  H01L2224/92247 ,  H01L2924/141 ,  H01L2924/143 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/014

Abstract: One or more embodiments are directed to leadframes and leadframe semiconductor packages. One embodiment is directed to copper leadframes with one or more die pads and one more leads with a roughened surface. Covering the roughened surface of the die pad of the leadframe is nanolayer of Silver (Ag). The thickness of the nanolayer preferably has a thickness that corresponds to the roughened surface of the copper leadframe. For instance, in one embodiment, the copper leadframe is roughened to have peaks and valleys that approximately average 10 nanometers and the thickness of the nanolayer is 10 nanometers. Covering a portion of the nanolayer of Ag is a microlayer of Ag, which provides a suitable bonding surface for coupling a semiconductor die to the die pad by an adhesive material.

公开(公告)号：US20150001697A1

公开(公告)日：2015-01-01

申请号：US13931307

申请日：2013-06-28

Applicant: STMicroelectronics SDN BHD

Inventor： Yh Heng

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49575 ,  H01L21/4821 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49551 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/49173 ,  H01L2224/49175 ,  H01L2224/49177 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure are directed to a leadframe packages that include a leadframe having a surface that is selectively treated with chemicals that reduce the wettability of the surface and thereby reduce adhesive flow on the surface and methods of forming a packing comprising same. In one embodiment there is provided a leadframe having an upper surface that includes a first portion that is treated with an anti-epoxy bleed out chemical and a second portion that was not treated with the anti-epoxy bleed out chemical. A semiconductor die is attached to the upper surface of the leadframe at the second portion via an epoxy adhesive.

Abstract translation: 本公开的实施例涉及一种引线框封装，其包括引线框架，该引线框架具有用化学品选择性处理的表面，从而减少表面的润湿性，从而减少表面上的粘合剂流动，以及形成包含该粘合剂的填料的方法。 在一个实施例中，提供了一种引线框架，其具有上表面，该上表面包括用抗环氧树脂渗出化学品处理的第一部分和未用抗环氧树脂渗出化学品处理的第二部分。 半导体管芯通过环氧树脂粘合剂在第二部分附接到引线框架的上表面。

公开(公告)号：US20220157681A1

公开(公告)日：2022-05-19

申请号：US17494298

申请日：2021-10-05

Applicant: STMicroelectronics SDN BHD

Inventor： Yang Hong HENG

IPC: H01L23/31 ,  H01L23/495

Abstract: A lead frame includes a die pad and electrical leads. An integrated circuit chip is mounted to the die pad. An encapsulating package has a perimeter defined by first, second, third and fourth sidewalls. The electrical leads extend from the opposed first and second sidewalls of the package. At least one sidewall of the opposed third and fourth sidewalls of the package includes a V-shaped concavity functioning to increase a creepage distance between the electrical leads at the opposed first and second sidewalls.