公开(公告)号：US20220157681A1

公开(公告)日：2022-05-19

申请号：US17494298

申请日：2021-10-05

Applicant: STMicroelectronics SDN BHD

Inventor： Yang Hong HENG

IPC: H01L23/31 ,  H01L23/495

Abstract: A lead frame includes a die pad and electrical leads. An integrated circuit chip is mounted to the die pad. An encapsulating package has a perimeter defined by first, second, third and fourth sidewalls. The electrical leads extend from the opposed first and second sidewalls of the package. At least one sidewall of the opposed third and fourth sidewalls of the package includes a V-shaped concavity functioning to increase a creepage distance between the electrical leads at the opposed first and second sidewalls.