Production of mechanically alloyed powder
    12.
    发明授权
    Production of mechanically alloyed powder 失效
    生产机械合金粉末

    公开(公告)号:US4443249A

    公开(公告)日:1984-04-17

    申请号:US354884

    申请日:1982-03-04

    摘要: An improved process is provided for producing mechanically alloyed powders of simple and complex alloy systems. In the improved process, the mechanically alloyed powder is milled to an acceptable processing level in a gravity-dependent ball mill to obtain a powder characterized by a laminate-type microstructure which is substantially optically homogeneous at a magnification of 100.times.. Such acceptable processing level is reached without processing the powder to a featureless microstructure or to saturation hardness.

    摘要翻译: 提供了一种改进的方法来生产简单和复杂的合金系统的机械合金粉末。 在改进的方法中,机械合金粉末在重力依赖性球磨机中被研磨至可接受的加工水平,以获得以100倍放大率基本上光学均匀的叠层型微结构的粉末。 在不将粉末处理成无特征微结构或饱和硬度的情况下达到可接受的处理水平。

    Controlled-grain-precious metal sputter targets
    15.
    发明授权
    Controlled-grain-precious metal sputter targets 有权
    受控颗粒贵金属溅射靶

    公开(公告)号:US07235143B2

    公开(公告)日:2007-06-26

    申请号:US10214671

    申请日:2002-08-08

    IPC分类号: C22C5/04

    CPC分类号: C22C5/04 C22F1/14 C23C14/3414

    摘要: A precious metal sputter target has a composition selected from the group consisting of platinum, palladium, rhodium, iridium, ruthenium, osmium and single-phase alloys thereof. The sputter target's grain structure is at least about 99 percent recrystallized and has a grain size of less than about 200 μm for improving sputter uniformity. The cryogenic method for producing these sputter targets is also effective for improving sputter performance for silver and gold sputter targets.

    摘要翻译: 贵金属溅射靶具有选自铂,钯,铑,铱,钌,锇及其单相合金的组成。 溅射靶的晶粒结构至少约99%重结晶,并且具有小于约200μm的粒度以改善溅射均匀性。 用于制造这些溅射靶的低温方法对于改善银和金溅射靶的溅射性能也是有效的。

    Method for forming sputter target assemblies
    17.
    发明授权
    Method for forming sputter target assemblies 失效
    用于形成溅射靶组件的方法

    公开(公告)号:US06708870B2

    公开(公告)日:2004-03-23

    申请号:US10153660

    申请日:2002-05-24

    IPC分类号: B23K3102

    摘要: The method forms a sputter target assembly by attaching a sputter target to an insert and applying a bond metal layer between the insert and a backing plate. Then pressing the insert and backing plate together forms a solid state bond with the bond metal layer, attaches the insert to the backing plate and forms at least one cooling channel between the insert and the backing plate. A filler metal secures the outer perimeter of the insert to the backing plate in order to eliminate leakage from the cooling channel during sputtering of the sputter target.

    摘要翻译: 该方法通过将溅射靶附接到插入件并且在插入件和背板之间施加粘合金属层来形成溅射靶组件。 然后将插入物和背板压在一起形成与粘合金属层的固态结合,将插入物附接到背板上,并在插入件和背板之间形成至少一个冷却通道。 填充金属将插入件的外周固定到背板上,以便在溅射靶溅射期间消除冷却通道的泄漏。

    Sputtering target having a shrink fit mounting ring
    18.
    发明授权
    Sputtering target having a shrink fit mounting ring 失效
    具有收缩配合安装环的溅射靶

    公开(公告)号:US5674367A

    公开(公告)日:1997-10-07

    申请号:US577798

    申请日:1995-12-22

    IPC分类号: C23C14/34 H01J37/34

    CPC分类号: H01J37/3435 C23C14/3407

    摘要: A target assembly for use in a sputtering system used for forming a thin film on a substrate is disclosed. The target assembly includes a mounting element having an interior wall which defines an aperture. The target assembly further includes a target for providing material for forming the film on the substrate. In particular, the target is affixed within the mounting element by an interference fit between the aperture and the target. Furthermore, the mounting ring includes a groove for holding an O-ring which serves to maintain a vacuum in the sputtering system.

    摘要翻译: 公开了一种用于在衬底上形成薄膜的溅射系统中的靶组件。 目标组件包括具有限定孔的内壁的安装元件。 目标组件还包括用于提供用于在衬底上形成膜的材料的靶。 特别地,目标通过孔径和目标之间的过盈配合固定在安装元件内。 此外,安装环包括用于保持用于在溅射系统中保持真空的O形环的凹槽。

    Mechanically joined sputtering target and adapter therefor
    19.
    发明授权
    Mechanically joined sputtering target and adapter therefor 失效
    机械连接溅射靶和适配器

    公开(公告)号:US5641389A

    公开(公告)日:1997-06-24

    申请号:US636320

    申请日:1996-04-23

    IPC分类号: C23C14/34 H01J37/34

    CPC分类号: H01J37/3435 C23C14/3407

    摘要: A target assembly in which the sputtering material is not soldered or otherwise metallurgically bonded to a backing plate. Rather, the target, which is homogeneously manufactured of sputtering material, is mechanically coupled (e.g., with bolts) to an adapter, which is itself permanently affixed to the chamber. As a result, the target can be easily uncoupled from the chamber and replaced, without also requiring removal and replacement of a backing plate.

    摘要翻译: 其中溅射材料不被焊接或以其它方式冶金结合到背板的目标组件。 相反,由溅射材料均匀地制造的靶被机械地联接(例如,用螺栓)到适配器,该适配器本身永久地固定在腔室上。 结果,目标可以容易地从腔室脱离并被更换,而不需要拆卸和更换背板。

    Magnesium based metal matrix composites produced from rapidly solidified
alloys
    20.
    发明授权
    Magnesium based metal matrix composites produced from rapidly solidified alloys 失效
    由快速固化的合金制成的镁基金属基复合材料

    公开(公告)号:US5273569A

    公开(公告)日:1993-12-28

    申请号:US433829

    申请日:1989-11-09

    IPC分类号: C22C1/10 C22C29/00

    CPC分类号: C22C1/1084 Y10T428/12486

    摘要: A composite has a magnesium base metal matrix and a reinforcing phase. The composite is produced from a charge containing a rapidly solidified magnesium base alloy and particles of a reinforcing material present in an amount ranging from about 0.1 to 50 percent by volume of the charge. Ball milling the charge energetically enfolds metal matrix material around each of the particles, while maintaining the charge in a pulverant state. Consolidation of the charge provides a mechanically formable, substantially void-free mass.

    摘要翻译: 复合材料具有镁基金属基体和增强相。 复合材料由含有快速固化的镁基合金的电荷和增强材料的颗粒以约0.1-50体积%的量存在。 球磨电荷能够在每个颗粒周围包含金属基质材料,同时将电荷保持在粉末状态。 电荷的固结提供机械可成形,基本上无空隙的质量。