公开(公告)号：US20090169190A1

公开(公告)日：2009-07-02

申请号：US12005862

申请日：2007-12-27

申请人： Ming Fang ,  Fuchao Wang

发明人： Ming Fang ,  Fuchao Wang

IPC分类号： F24H1/10 ,  H01L21/02

CPC分类号： B81C1/00119 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/14137 ,  B41J2/16 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1639 ,  B81B1/006 ,  B81B2201/052 ,  B81B2201/058 ,  B81C2201/013 ,  B81C2203/075 ,  H01L28/20 ,  Y10T29/41 ,  Y10T29/49401 ,  Y10T29/49826

摘要： An integrated semiconductor heating assembly includes a semiconductor substrate, a chamber formed therein, and an exit port in fluid communication with the chamber, allowing fluid to exit the chamber in response to heating the chamber. The integrated heating assembly includes a first heating element adjacent the chamber, which can generate heat above a selected threshold and bias fluid in the chamber toward the exit port. A second heating element is positioned adjacent the exit port to generate heat above a selected threshold, facilitating movement of the fluid through the exit port away from the chamber. Addition of the second heating element reduces the amount of heat emitted per heating element and minimizes thickness of a heat absorption material toward an open end of the exit port. Since such material is expensive, this reduces the manufacturing cost and retail price of the assembly while improving efficiency and longevity thereof.

摘要翻译： 集成半导体加热组件包括半导体衬底，形成在其中的腔室以及与腔室流体连通的出口，允许流体响应于加热室而离开腔室。 集成加热组件包括邻近腔室的第一加热元件，该第一加热元件可以产生高于选定阈值的热量，并将腔室中的流体朝向出口偏压。 第二加热元件邻近出口定位以产生高于所选阈值的热量，便于流体通过出口远离腔室的运动。 添加第二加热元件减少了每个加热元件发出的热量，并使吸热材料的厚度最小化到出口的开口端。 由于这样的材料是昂贵的，所以这降低了组件的制造成本和零售价格，同时提高了其效率和使用寿命。

公开(公告)号：US08493171B2

公开(公告)日：2013-07-23

申请号：US13541468

申请日：2012-07-03

申请人： Olivier Le Neel ,  Pascale Dumont-Girard ,  Chengyu Niu ,  Fuchao Wang ,  Michel Arnoux

发明人： Olivier Le Neel ,  Pascale Dumont-Girard ,  Chengyu Niu ,  Fuchao Wang ,  Michel Arnoux

IPC分类号： H01C3/04 ,  H01C7/02

CPC分类号： H01C17/265 ,  H01L23/345 ,  H01L23/5228 ,  H01L27/016 ,  H01L27/0688 ,  H01L28/20 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/49087 ,  H01L2924/00

摘要： A trimmable resistor for use in an integrated circuit is trimmed using a heater. The heater is selectively coupled to a voltage source. The application of voltage to the heater causes the heater temperature to increase and produce heat. The heat permeates through a thermal separator to the trimmable resistor. The resistance of the trimmable resistor is permanently increased or decreased when the temperature of the resistor is increased to a value within a particular range of temperatures.

摘要翻译： 用于集成电路的微调电阻器使用加热器进行修整。 加热器选择性地耦合到电压源。 对加热器施加电压导致加热器温度升高并产生热量。 热量通过热分离器渗透到可调节电阻器。 当电阻器的温度增加到特定温度范围内的值时，可调整电阻器的电阻永久地增加或减小。

公开(公告)号：US20120085748A1

公开(公告)日：2012-04-12

申请号：US12902005

申请日：2010-10-11

申请人： Olivier Le Neel ,  Fuchao Wang ,  Ravi Shankar

发明人： Olivier Le Neel ,  Fuchao Wang ,  Ravi Shankar

IPC分类号： H05B1/00

CPC分类号： H05B3/0014 ,  H01L23/34 ,  H01L23/345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H05B1/0227 ,  H05B3/02 ,  H05B3/06 ,  H05B3/12 ,  H05B3/34 ,  H01L2924/00014 ,  H01L2924/00

摘要： An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.

摘要翻译： 提供具有有源电路的集成电路。 加热元件邻近有源电路并且被配置为加热有源电路。 温度传感器也与有源电路相邻并且被配置为测量有源电路的温度。 温度控制器耦合到有源电路并被配置为从温度传感器接收温度信号。 温度控制器操作加热元件以加热有源电路以将有源电路的温度保持在所选择的温度范围内。

公开(公告)号：US20110081138A1

公开(公告)日：2011-04-07

申请号：US12968150

申请日：2010-12-14

申请人： Ming Fang ,  Fuchao Wang

发明人： Ming Fang ,  Fuchao Wang

IPC分类号： H05B3/82 ,  B23P19/04

CPC分类号： B81C1/00119 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/14137 ,  B41J2/16 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1639 ,  B81B1/006 ,  B81B2201/052 ,  B81B2201/058 ,  B81C2201/013 ,  B81C2203/075 ,  H01L28/20 ,  Y10T29/41 ,  Y10T29/49401 ,  Y10T29/49826

摘要： An integrated semiconductor heating assembly includes a semiconductor substrate, a chamber formed therein, and an exit port in fluid communication with the chamber, allowing fluid to exit the chamber in response to heating the chamber. The integrated heating assembly includes a first heating element adjacent the chamber, which can generate heat above a selected threshold and bias fluid in the chamber toward the exit port. A second heating element is positioned adjacent the exit port to generate heat above a selected threshold, facilitating movement of the fluid through the exit port away from the chamber. Addition of the second heating element reduces the amount of heat emitted per heating element and minimizes thickness of a heat absorption material toward an open end of the exit port. Since such material is expensive, this reduces the manufacturing cost and retail price of the assembly while improving efficiency and longevity thereof.

摘要翻译： 集成半导体加热组件包括半导体衬底，形成在其中的腔室以及与腔室流体连通的出口，允许流体响应于加热室而离开腔室。 集成加热组件包括邻近腔室的第一加热元件，该第一加热元件可以产生高于选定阈值的热量，并将腔室中的流体朝向出口偏压。 第二加热元件邻近出口定位以产生高于所选阈值的热量，便于流体通过出口远离腔室的运动。 添加第二加热元件减少了每个加热元件发出的热量，并使吸热材料的厚度最小化到出口的开口端。 由于这样的材料是昂贵的，所以这降低了组件的制造成本和零售价格，同时提高了其效率和使用寿命。

公开(公告)号：US20100163517A1

公开(公告)日：2010-07-01

申请号：US12422732

申请日：2009-04-13

申请人： Fuchao Wang ,  Ming Fang

发明人： Fuchao Wang ,  Ming Fang

IPC分类号： B44C1/22

CPC分类号： B41J2/1601 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1639 ,  B41J2202/13 ,  B41J2202/16

摘要： A method includes forming a recess in a first surface of a substrate, the recess having a width, depth, and height selected to correspond to a width, depth, and height of a fluid chamber, forming a sacrificial material in the recess, forming a first heater element, forming a metal layer overlying the first heater element, and forming a nozzle opening in the metal layer to expose the sacrificial material. The method also includes forming a path from a second surface of the substrate to expose the sacrificial material and removing the sacrificial material from the recess to expose the chamber with the selected width, depth, and height, the chamber in fluid communication with the path, the nozzle opening, and a surrounding environment.

摘要翻译： 一种方法包括在基板的第一表面中形成凹槽，所述凹槽具有选定为对应于流体室的宽度，深度和高度的宽度，深度和高度，在凹槽中形成牺牲材料，形成凹陷 第一加热器元件，形成覆盖在第一加热器元件上的金属层，以及在金属层中形成喷嘴开口以露出牺牲材料。 该方法还包括从衬底的第二表面形成路径以暴露牺牲材料并从凹部移除牺牲材料，以使选定的宽度，深度和高度暴露腔室，该腔室与路径流体连通， 喷嘴开口和周围环境。

公开(公告)号：US20100163116A1

公开(公告)日：2010-07-01

申请号：US12422690

申请日：2009-04-13

申请人： Ming Fang ,  Fuchao Wang

发明人： Ming Fang ,  Fuchao Wang

IPC分类号： F16L53/00 ,  B44C1/22

CPC分类号： B41J2/1601 ,  B41J2/14056 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646 ,  B41J2002/1437 ,  B41J2202/16 ,  Y10T137/6416

摘要： A method that includes forming a chamber in a substrate, forming a silicon layer overlying the chamber, etching the silicon layer to remove selected regions and retain a selected portion overlying the chamber, the selected portion being at a location and having dimensions that correspond to a location and to dimensions of a nozzle, and forming a first metal layer adjacent to the selected portion. The method also includes forming a path in the substrate to expose the chamber concurrently with removing the selected portion of the silicon layer to expose the nozzle, the nozzle being in fluid communication with the path, the chamber, and a surrounding environment.

摘要翻译： 一种方法，其包括在衬底中形成腔室，形成覆盖在所述腔室上的硅层，蚀刻所述硅层以去除所选择的区域并且保持覆盖所述腔室的选定部分，所述选定部分位于并且具有对应于 位置和尺寸，以及形成与选定部分相邻的第一金属层。 该方法还包括在衬底中形成路径以同时去除硅层的选定部分以暴露喷嘴，喷嘴与路径，腔室和周围环境流体连通。

公开(公告)号：US20060071149A1

公开(公告)日：2006-04-06

申请号：US10955722

申请日：2004-09-30

申请人： Fuchao Wang ,  Ming Fang

发明人： Fuchao Wang ,  Ming Fang

IPC分类号： H01L31/00

CPC分类号： H01L33/20 ,  G02B3/00 ,  H01L31/02327 ,  H01L33/58

摘要： A semiconductor device includes a semiconductor material substrate, an opto-electric component formed on the substrate, and a first transparent layer formed on an upper surface of the substrate over the component, the layer having a planar upper surface with a cavity formed therein. The first transparent layer has a selected thickness and a first index of refraction. The semiconductor device further includes a lens having a second index of refraction, the lens being formed in the cavity and having a planar upper surface. An upper surface of the lens and the upper surface of the transparent layer may be coplanar, or alternatively, they may lie in separate planes. The semiconductor device may also include a second transparent layer formed over the first layer and lens, as a passivation layer. The first transparent layer may be silicon dioxide, while the lens may be a flowable dielectric.

摘要翻译： 半导体器件包括半导体材料基板，形成在基板上的光电部件和形成在该部件上的基板的上表面上的第一透明层，该层具有形成在其中的空腔的平面上表面。 第一透明层具有选定的厚度和第一折射率。 所述半导体器件还包括具有第二折射率的透镜，所述透镜形成在所述空腔中并且具有平坦的上表面。 透镜的上表面和透明层的上表面可以是共面的，或者可以位于分开的平面中。 半导体器件还可以包括形成在第一层和透镜上的第二透明层作为钝化层。 第一透明层可以是二氧化硅，而透镜可以是可流动的电介质。

公开(公告)号：US08927909B2

公开(公告)日：2015-01-06

申请号：US12902005

申请日：2010-10-11

申请人： Olivier Le Neel ,  Fuchao Wang ,  Ravi Shankar

发明人： Olivier Le Neel ,  Fuchao Wang ,  Ravi Shankar

IPC分类号： H05B1/02 ,  H05B3/12 ,  H05B3/34

CPC分类号： H05B3/0014 ,  H01L23/34 ,  H01L23/345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15311 ,  H05B1/0227 ,  H05B3/02 ,  H05B3/06 ,  H05B3/12 ,  H05B3/34 ,  H01L2924/00014 ,  H01L2924/00

摘要： An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.

公开(公告)号：US08925835B2

公开(公告)日：2015-01-06

申请号：US12422690

申请日：2009-04-13

申请人： Ming Fang ,  Fuchao Wang

发明人： Ming Fang ,  Fuchao Wang

IPC分类号： B05B1/24 ,  B41J2/16 ,  B41J2/14

CPC分类号： B41J2/1601 ,  B41J2/14056 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646 ,  B41J2002/1437 ,  B41J2202/16 ,  Y10T137/6416

摘要： A method that includes forming a chamber in a substrate, forming a silicon layer overlying the chamber, etching the silicon layer to remove selected regions and retain a selected portion overlying the chamber, the selected portion being at a location and having dimensions that correspond to a location and to dimensions of a nozzle, and forming a first metal layer adjacent to the selected portion. The method also includes forming a path in the substrate to expose the chamber concurrently with removing the selected portion of the silicon layer to expose the nozzle, the nozzle being in fluid communication with the path, the chamber, and a surrounding environment.

摘要翻译： 一种方法，其包括在衬底中形成腔室，形成覆盖在所述腔室上的硅层，蚀刻所述硅层以去除所选择的区域并且保持覆盖所述腔室的选定部分，所述选定部分位于并且具有对应于 位置和尺寸，以及形成与选定部分相邻的第一金属层。 该方法还包括在衬底中形成路径以同时去除硅层的选定部分以暴露喷嘴，喷嘴与路径，腔室和周围环境流体连通。

公开(公告)号：US08798448B2

公开(公告)日：2014-08-05

申请号：US12968150

申请日：2010-12-14

申请人： Ming Fang ,  Fuchao Wang

发明人： Ming Fang ,  Fuchao Wang

IPC分类号： F24H1/20

CPC分类号： B81C1/00119 ,  B41J2/14056 ,  B41J2/14072 ,  B41J2/14137 ,  B41J2/16 ,  B41J2/1601 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1639 ,  B81B1/006 ,  B81B2201/052 ,  B81B2201/058 ,  B81C2201/013 ,  B81C2203/075 ,  H01L28/20 ,  Y10T29/41 ,  Y10T29/49401 ,  Y10T29/49826

摘要： An integrated semiconductor heating assembly includes a semiconductor substrate, a chamber formed therein, and an exit port in fluid communication with the chamber, allowing fluid to exit the chamber in response to heating the chamber. The integrated heating assembly includes a first heating element adjacent the chamber, which can generate heat above a selected threshold and bias fluid in the chamber toward the exit port. A second heating element is positioned adjacent the exit port to generate heat above a selected threshold, facilitating movement of the fluid through the exit port away from the chamber. Addition of the second heating element reduces the amount of heat emitted per heating element and minimizes thickness of a heat absorption material toward an open end of the exit port. Since such material is expensive, this reduces the manufacturing cost and retail price of the assembly while improving efficiency and longevity thereof.

摘要翻译： 集成半导体加热组件包括半导体衬底，形成在其中的腔室以及与腔室流体连通的出口，允许流体响应于加热室而离开腔室。 集成加热组件包括邻近腔室的第一加热元件，该第一加热元件可以产生高于选定阈值的热量，并将腔室中的流体朝向出口偏压。 第二加热元件邻近出口定位以产生高于所选阈值的热量，便于流体通过出口远离腔室的运动。 添加第二加热元件减少了每个加热元件发出的热量，并使吸热材料的厚度最小化到出口的开口端。 由于这样的材料是昂贵的，所以这降低了组件的制造成本和零售价格，同时提高了其效率和使用寿命。