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公开(公告)号：US20140162475A1
公开(公告)日：2014-06-12
申请号：US13711187
申请日：2012-12-11
IPC分类号： H01R12/71
CPC分类号： H01R12/722 , H01L23/34 , H01L2924/0002 , H01R12/7005 , H01R12/71 , H01R12/724 , H01R12/79 , H01R13/114 , H01L2924/00
摘要： Connectors and methods to couple packages and dies are shown. Selected examples include plugs and receptacles having two or more terraces with contacts provided along the terraces. Examples of connectors and methods include configurations where the connector is usable with a package including a die coupled along a substrate. In selected examples a heat sink is coupled over the die, and a package includes a side access port between the heat sink and the substrate configured to receive the connector, such as one or more of a plug or receptacle through the side access port.
摘要翻译： 显示连接器和耦合封装和管芯的方法。 所选择的实例包括具有两个或更多台阶的插头和插座，其具有沿梯田提供的触点。 连接器和方法的示例包括其中连接器可用于包括沿衬底耦合的裸片的封装的配置。 在所选择的示例中，散热器耦合在管芯上，并且封装包括在散热器和被配置为接收连接器的基板之间的侧入口，例如通过侧面接入端口的一个或多个插头或插座。
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公开(公告)号：US07867003B2
公开(公告)日：2011-01-11
申请号：US12344173
申请日：2008-12-24
IPC分类号： H01R13/62
CPC分类号： H05K7/1061 , Y10T74/20612
摘要： Electronic assemblies are described. One embodiment includes a circuit board and a socket coupled to the circuit board. The assembly also includes a load mechanism including a first lever arm and a second lever arm. The load mechanism also includes a first axis portion extending from a first longitudinal end of the first lever arm, the first axis portion pivotally coupled to the circuit board, and a second axis portion extending from a first longitudinal end of the second lever arm, the second axis portion pivotally coupled to the circuit board. The load mechanism also includes a first load arm region extending from the first axis portion and the second axis portion and positioned between the first and second lever arms. The load mechanism also includes a first handle region at a second longitudinal end of the first lever arm, and a second handle region at a second longitudinal end of the second lever arm. The load mechanism also includes a second load arm region extending from the first handle region, and a third load arm region extending from the second handle region, the second and third load arm regions positioned between the first and second lever arms. The load mechanism also includes a gap positioned between an end of the second load arm and an end of the third load arm. The load mechanism is coupled to the circuit board. Other embodiments are described and claimed.
摘要翻译： 描述电子组件。 一个实施例包括电路板和耦合到电路板的插座。 组件还包括包括第一杠杆臂和第二杠杆臂的负载机构。 负载机构还包括从第一杠杆臂的第一纵向端部延伸的第一轴线部分，枢转地联接到电路板的第一轴线部分和从第二杠杆臂的第一纵向端部延伸的第二轴线部分， 枢转地联接到电路板的第二轴部分。 负载机构还包括从第一轴部分和第二轴部分延伸并且定位在第一和第二杠杆臂之间的第一负载臂区域。 负载机构还包括在第一杠杆臂的第二纵向端处的第一手柄区域和在第二杠杆臂的第二纵向端处的第二手柄区域。 负载机构还包括从第一手柄区域延伸的第二负载臂区域和从第二手柄区域延伸的第三负载臂区域，位于第一和第二杠杆臂之间的第二和第三负载臂区域。 负载机构还包括位于第二负载臂的端部和第三负载臂的端部之间的间隙。 负载机构耦合到电路板。 描述和要求保护其他实施例。
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公开(公告)号：US07050302B2
公开(公告)日：2006-05-23
申请号：US10836442
申请日：2004-04-29
申请人： David J. Llapitan , Alan W. Tate
发明人： David J. Llapitan , Alan W. Tate
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： Illustrative embodiments of the present invention include, but are not limited to, a heat sink equipped with a captive socket actuating device designed to facilitate engagement and disengagement of the apparatus to and from an integrated circuit (IC) socket.
摘要翻译： 本发明的说明性实施例包括但不限于配备有被设计成便于装置与集成电路（IC）插座的装置的接合和分离的捕获插座致动装置的散热器。
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公开(公告)号：US09681556B2
公开(公告)日：2017-06-13
申请号：US13631806
申请日：2012-09-28
CPC分类号： H05K3/301 , H05K7/1007 , H05K7/1061 , H05K2201/10325 , H05K2201/2018 , H05K2203/167
摘要： In one embodiment, a load frame and an integrated circuit device are aligned, with a base frame carried on a substrate, along a first alignment axis defined by a first alignment post extending from the base frame to the load frame, in a direction transverse to the substrate, and a first biasing device carried on the base frame is actuated to engage and bias the load frame toward the base frame aligned with the load frame, and to bias the integrated circuit toward the substrate. A latch latches the load and base frames together, aligned with and biased towards each other with the integrated circuit device and the substrate aligned with, and biased toward each other. Other aspects and features are also described.
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公开(公告)号：US20100157563A1
公开(公告)日：2010-06-24
申请号：US12344193
申请日：2008-12-24
CPC分类号： H05K7/1007
摘要： Electronic assemblies are described. One embodiment includes a circuit board, a socket coupled to the circuit board, and a device positioned in the socket. The embodiment also includes a load mechanism including first and second components, the first component pivotally coupled to the circuit board, the first component including first and second lever arms and an axle region therebetween, the first component also including a load arm region extending from the axle region and adapted to transmit a load when a force is applied to the first component lever arms. The load mechanism also includes a second component pivotally coupled to the circuit board, the second component including first and second lever arms and an axle region therebetween, the second wire component also including a load arm region extending from the axle region and adapted to transmit a load when a force is applied to the second wire component lever arms. The first and second wire components are positioned so that when a force is applied to the first component lever arms, the first lever arm of the first component engages the first lever arm of the second component and applies a force thereto, and the second lever arm of the first component engages the second lever arm of the second component and applies a force thereto. Other embodiments are described and claimed.
摘要翻译： 描述电子组件。 一个实施例包括电路板，耦合到电路板的插座和定位在插座中的装置。 该实施例还包括包括第一和第二部件的负载机构，第一部件枢转地联接到电路板，第一部件包括第一和第二杠杆臂及其间的轴区域，第一部件还包括从 轴区域，并且当力施加到第一部件杆臂时适于传递负载。 负载机构还包括枢转地联接到电路板的第二部件，第二部件包括第一和第二杠杆臂及其间的轴区域，第二线部件还包括从轴区域延伸的负载臂区域， 当力施加到第二线部件杆臂时的负载。 第一和第二线组件被定位成使得当力施加到第一部件杆臂时，第一部件的第一杠杆臂接合第二部件的第一杠杆臂并向其施加力，并且第二杠杆臂 的第一部件接合第二部件的第二杠杆臂并向其施加力。 描述和要求保护其他实施例。
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公开(公告)号：US06722908B2
公开(公告)日：2004-04-20
申请号：US10335679
申请日：2003-01-02
IPC分类号： H01R1362
CPC分类号： H05K7/1405 , H01L23/4093 , H01L2924/0002 , H01R12/7047 , H01L2924/00
摘要： A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.
摘要翻译： 一种用于具有基板和散热器的电子组件的保持机构。 保持机构包括接收基板的基板槽和接收散热器的散热槽。 可能有两个固定机构连接到与电连接器相邻的印刷电路板。 可能有两个对准地位于基板槽周围的散热槽，使得该机构可以安装在连接器的左侧或右侧。 对称槽消除了对左侧机构和右侧机构的需要。 保持器机构还可以具有螺母保持器，其捕获用于将机构附接到印刷电路板的螺母。 螺母固定器允许螺母在组装过程中与保持器机构一起运输。
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公开(公告)号：US06671172B2
公开(公告)日：2003-12-30
申请号：US09950100
申请日：2001-09-10
IPC分类号： H05K720
CPC分类号： H01L23/3672 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.
摘要翻译： 包括一个或多个高性能集成电路的电子组件包括至少一个高容量散热器。 散热器包括从芯部大体上径向突出的多个翅片，其被构造成从风扇捕获空气并引导空气以优化从散热器的热传递。 散热片可以形成为不同的形状。 在一个实施例中，翅片是弯曲的。 在另一个实施例中，翅片弯曲。 在另一个实施例中，翅片弯曲并弯曲。 还描述了制造散热器和电子组件的方法，以及将散热器应用于电子组件和电子系统。
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18.发明授权
公开(公告)号：US6159031A
公开(公告)日：2000-12-12
申请号：US327212
申请日：1999-06-07
IPC分类号： H01R13/627 , H01R13/62
CPC分类号： H01R13/6275 , H01R12/716
摘要： A retention mechanism for securing an electronic subassembly. The retention mechanism may include a latch that extends from a wall. The latch may extend into either a cover opening of a SECC type subassembly or a heat sink notch of a SEPP type subassembly.
摘要翻译： 一种用于固定电子组件的保持机构。 保持机构可以包括从壁延伸的闩锁。 闩锁可以延伸到SEPP型子组件的SECC型子组件的盖开口或散热器槽口中。
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