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公开(公告)号:US20080115881A1
公开(公告)日:2008-05-22
申请号:US11985497
申请日:2007-11-15
申请人: Chih-Yung Lin , Po-Yu Chiang
发明人: Chih-Yung Lin , Po-Yu Chiang
CPC分类号: B29C66/342 , B29C65/18 , B29C65/4815 , B29C65/5021 , B29C65/5057 , B29C65/78 , B29C66/1122 , B29C66/348 , B29C66/47 , B29C66/4722 , B29C66/8322 , B29C66/91411 , B29C66/919 , B29C2793/0081 , Y10T156/1062
摘要: A process for heat-pressing a tape on a plastic carrier for a chip primarily comprises heating the plastic carrier to a predetermined temperature ranging from about 60 degrees centigrade to about 150 degrees centigrade so that an adhesive provided on the tape for adhering to the plastic carrier is melted such that the adhesive is in an optimum melted state and provides preferable adhesion force.
摘要翻译: 用于对用于芯片的塑料载体上的热压的方法主要包括将塑料载体加热到约60摄氏度至约150摄氏度的预定温度,使得设置在带上的粘合剂粘附到塑料载体上 熔化,使得粘合剂处于最佳熔融状态并提供优选的粘附力。
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公开(公告)号:US06455913B2
公开(公告)日:2002-09-24
申请号:US09495625
申请日:2000-01-31
申请人: Wen-Kuan Yeh , Chih-Yung Lin
发明人: Wen-Kuan Yeh , Chih-Yung Lin
IPC分类号: H01L2900
CPC分类号: H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要: A copper fuse structure for integrated circuit employs two copper pads formed over a semiconductor substrate. The two copper pads are electrically insulated by dielectrics. An aluminum line is utilized to cover and electrically connect the two copper pads.
摘要翻译: 用于集成电路的铜熔丝结构采用在半导体衬底上形成的两个铜焊盘。 两个铜焊盘由电介质电绝缘。 铝线用于覆盖和电连接两个铜焊盘。
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公开(公告)号:US08554276B2
公开(公告)日:2013-10-08
申请号:US12472075
申请日:2009-05-26
申请人: Chih-Yung Lin , Cheng-Yuan Lo , Yi-Wei Wang , Jui-Hsiang Chang
发明人: Chih-Yung Lin , Cheng-Yuan Lo , Yi-Wei Wang , Jui-Hsiang Chang
IPC分类号: H04M1/00
CPC分类号: H04B1/401 , H04B1/3816 , H04W92/08
摘要: A Subscriber Identity Module (SIM) card control apparatus applied to a mobile communication device is provided. The mobile communication device has a first SIM card and a second SIM card. The SIM card control apparatus includes a judgment unit, a SIM card controller and a switch device. The judgment unit is used to generate a selection signal according to a to-be-accessed SIM card among the first and the second SIM cards. The SIM card controller transmits signals via a group of signal lines. The switch device is used to selectively connect the group of signal lines to the first SIM card or the second SIM card according to the selection signal.
摘要翻译: 提供了一种应用于移动通信设备的用户识别模块(SIM)卡控制设备。 移动通信设备具有第一SIM卡和第二SIM卡。 SIM卡控制装置包括判断单元,SIM卡控制器和开关装置。 判断单元用于根据第一和第二SIM卡中的要被访问的SIM卡生成选择信号。 SIM卡控制器通过一组信号线发送信号。 开关装置用于根据选择信号将信号线组选择性地连接到第一SIM卡或第二SIM卡。
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公开(公告)号:US20120020089A1
公开(公告)日:2012-01-26
申请号:US13074016
申请日:2011-03-29
申请人: MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH , CHI-WEI LIAO
发明人: MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH , CHI-WEI LIAO
IPC分类号: F21S4/00
CPC分类号: F21V29/70 , F21S2/005 , F21S4/20 , F21Y2103/10 , F21Y2115/10
摘要: An LED light bar includes an elongated circuit board, a first lighting module formed in the middle of the circuit board and two second light modules formed at two opposite ends of the circuit board. Each of first lighting module and the two second lighting module includes a plurality of LEDs arranged linearly on a surface of the circuit board. A density of the LEDs in the first lighting module is smaller than that in the second lighting modules.
摘要翻译: LED灯条包括细长电路板,形成在电路板的中间的第一照明模块和形成在电路板的两个相对端的两个第二光模块。 第一照明模块和第二照明模块中的每一个包括在电路板的表面上直线布置的多个LED。 第一照明模块中的LED的密度小于第二照明模块中的LED的密度。
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公开(公告)号:US20110291138A1
公开(公告)日:2011-12-01
申请号:US13113081
申请日:2011-05-23
申请人: MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH , CHI-WEI LIAO
发明人: MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH , CHI-WEI LIAO
CPC分类号: H01L33/58 , H01L33/54 , H01L2933/005 , H01L2933/0083
摘要: A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.
摘要翻译: 发光元件封装包括用于封装发光元件的封装构件。 在封装构件上形成多个光子晶体图案。 光子晶体图案的分布密度对应于发光元件的光分布。 每个光子晶体图案由多个光子晶体组成。
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公开(公告)号:US20110278601A1
公开(公告)日:2011-11-17
申请号:US12979368
申请日:2010-12-28
申请人: MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
发明人: MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
IPC分类号: H01L33/48
CPC分类号: H01L33/486 , H01L25/167 , H01L33/507 , H01L33/508 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要: An LED package includes a silicon base, an LED and a glass encapsulant. The silicon base has a first surface and a second surface opposite to the first surface. The LED chip is located on the first surface of the silicon base. The glass encapsulant covers the LED chip. The glass encapsulant and the silicon base define a receiving space therebetween to receive the LED chip. The glass encapsulant is fixedly engaged with the first surface of the silicon base, so the glass encapsulant and the silicon base enclose the LED chip.
摘要翻译: LED封装包括硅基,LED和玻璃密封剂。 硅基部具有与第一表面相对的第一表面和第二表面。 LED芯片位于硅基底的第一表面上。 玻璃密封剂覆盖LED芯片。 玻璃密封剂和硅基底在其间限定了接收LED芯片的接收空间。 玻璃密封剂与硅基体的第一表面固定接合,因此玻璃密封剂和硅基底包围LED芯片。
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公开(公告)号:US20110261562A1
公开(公告)日:2011-10-27
申请号:US12900502
申请日:2010-10-08
申请人: CHI-WEI LIAO , WEN-LIANG TSENG , MIN-TSUN HSIEH , CHIH-YUNG LIN , CHING-LIEN YEH
发明人: CHI-WEI LIAO , WEN-LIANG TSENG , MIN-TSUN HSIEH , CHIH-YUNG LIN , CHING-LIEN YEH
摘要: A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a transparent housing located in front of the at least one lens, and a cleaning device. The cleaning device includes a wiper located on an outer surface of the transparent housing, and a driver which drives the wiper to brush the transparent housing.
摘要翻译: 交通灯组件包括至少一个灯模块,位于所述至少一个灯模块前面的至少一个透镜,位于所述至少一个透镜前面的透明壳体和清洁装置。 清洁装置包括位于透明壳体的外表面上的擦拭器和驱动刮水器以刷透透明壳体的驱动器。
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公开(公告)号:USD642994S1
公开(公告)日:2011-08-09
申请号:US29375804
申请日:2010-09-28
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公开(公告)号:USD642545S1
公开(公告)日:2011-08-02
申请号:US29375806
申请日:2010-09-28
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公开(公告)号:USD640212S1
公开(公告)日:2011-06-21
申请号:US29375807
申请日:2010-09-28
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