发明授权
- 专利标题: Copper fuse for integrated circuit
- 专利标题(中): 铜保险丝用于集成电路
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申请号: US09495625申请日: 2000-01-31
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公开(公告)号: US06455913B2公开(公告)日: 2002-09-24
- 发明人: Wen-Kuan Yeh , Chih-Yung Lin
- 申请人: Wen-Kuan Yeh , Chih-Yung Lin
- 主分类号: H01L2900
- IPC分类号: H01L2900
摘要:
A copper fuse structure for integrated circuit employs two copper pads formed over a semiconductor substrate. The two copper pads are electrically insulated by dielectrics. An aluminum line is utilized to cover and electrically connect the two copper pads.
公开/授权文献
- US20010042897A1 Copper fuse for integrated circuit 公开/授权日:2001-11-22
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