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181.发明申请公开(公告)号：US20250126626A1
公开(公告)日：2025-04-17
申请号：US18904335
申请日：2024-10-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Juhyuk IM
Abstract: An operation method of a wireless communication device for performing sidelink-based vehicle-to-everything (V2X) communication includes decoding first sidelink control information (SCI) to obtain a first decoding result, the first SCI being contained in a received physical sidelink control channel (PSCCH), decoding second SCI including obtaining a plurality of log likelihood ratio (LLR) values by demodulating the second SCI, storing the plurality of LLR values in a plurality of deinterleaving buffers such that the plurality of LLR values are deinterleaved, and decoding the plurality of LLR values stored in the plurality of deinterleaving buffers to obtain a second decoding result, the second SCI being contained in a physical sidelink shared channel (PSSCH), and the PSSCH being received based on the first decoding result, and decoding the PSSCH based on the second decoding result.
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公开(公告)号：US20250126512A1
公开(公告)日：2025-04-17
申请号：US18909089
申请日：2024-10-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Chadi KHIRALLAH , Mahmoud WATFA , Erik GUTTMAN
Abstract: The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transmission rate. A method performed by a network entity in a wireless communications network is provided. The method includes obtaining energy information associated with the wireless communications network and determining, based on the energy information, at least one of a quality of service (QoS) profile associated with a QoS flow of the wireless communications network and a QoS profile associated with a user equipment (UE).
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公开(公告)号：US20250126465A1
公开(公告)日：2025-04-17
申请号：US18568499
申请日：2022-07-05
Applicant: Samsung Electronics Co., Ltd.
IPC: H04W12/02 , H04L67/306 , H04L67/52
Abstract: The disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. The present subject matter refers to method and apparatus for managing provision (or, dissemination) of a location information of a client device. The method includes instructing a client device for sharing the location information; receiving the location information and a request for managing dissemination of the location information; receiving a list for managing dissemination of the location information from the client device. The method includes determining if the client device is authorized to request managing dissemination of the location information based on a client profile and managing dissemination of the location information to the one or more MCX service user in accordance with the list based on determination that the client device is authorized to request managing dissemination of the location information.
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公开(公告)号：US20250126355A1
公开(公告)日：2025-04-17
申请号：US18990192
申请日：2024-12-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Daehee PARK , Chonghwa SEO , Jongwon LEE
Abstract: An embodiment of the disclosure provides a method and a device configured to: in a state in which transmission power of a communication module is cut off, obtain a reference image using a camera module; store the obtained reference image in a memory; in a state in which a designated transmission power related to malfunction of the camera module is configured in the communication module, obtain a comparison image using the camera module; compare the reference image and the comparison image to determine an error in the comparison image; and determine, based on a result of the determination, the maximum transmission power of the communication module at the time of using the camera module.
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公开(公告)号：US20250126237A1
公开(公告)日：2025-04-17
申请号：US18999455
申请日：2024-12-23
Applicant: SAMSUNG ELECTRONICS CO.,LTD.
Inventor： Kisung LEE , Bonseuk GOO , Youngtae KIM , Byungseok SOH , Sangki YOON , Youngchol LEE , Weonhee LEE
IPC: H04N9/31
Abstract: Provided is an electronic device including a projector, a communication interface configured to communicate with an external device, and at least one processor configured to, based on receiving a user input for projecting a first content from the electronic device and projecting a second content from the external device, obtain a difference value between a first luminance value corresponding to the first content and a second luminance value corresponding to the second content, obtain a projection interval of the first content and the second content based on the difference value, control the projector to project the first content based on the projection interval, and transmit the second content and a control signal for projecting the second content to the external device through the communication interface.
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Patent Agency Ranking
公开(公告)号：US20250125998A1
公开(公告)日：2025-04-17
申请号：US18401971
申请日：2024-01-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Minsoo CHOI , Hiep PHAM , Chih-Wei YAO , Hyojun KIM
IPC: H04L25/02
Abstract: A wireline transceiver system includes a predriver configured to generate a signal; a source-series termination (SST) driver configured to receive the generated signal; and a replica driver configured to continuously generate bias voltages in real time to modulate current of a push-pull current source of the SST driver based on a voltage of the received signal across a process, voltage, and temperature (PVT) range.
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公开(公告)号：US20250125302A1
公开(公告)日：2025-04-17
申请号：US18808869
申请日：2024-08-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jing Cheng LIN , Youngkun Jee
Abstract: A semiconductor package includes a first semiconductor chip including a plurality of upper pads, a non-conductive support layer on a top surface of the first semiconductor chip and including a plurality of openings, a second semiconductor chip on the first semiconductor chip and including a plurality of lower pads, a plurality of chip connecting terminals extending between the plurality of upper pads and the plurality of lower pads, and an insulation adhesive layer between the first semiconductor chip and the second semiconductor chip and at least partially covering the plurality of chip connecting terminals and the non-conductive support layer. A top surface of the non-conductive support layer is disposed closer to a bottom surface of the second semiconductor chip than top surfaces of the plurality of upper pads are disposed to the bottom surface of the second semiconductor chip.
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公开(公告)号：US20250125247A1
公开(公告)日：2025-04-17
申请号：US18779913
申请日：2024-07-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaeean Lee , Dongwon Kang , Jieun Park , Changyeon Song , Sunguk Lee
IPC: H01L23/498 , H01L21/48 , H01L21/683 , H01L23/00 , H01L23/31 , H01L25/10
Abstract: An IC package includes a lower redistribution structure, a connection structure (with cavity) on the lower redistribution structure, a semiconductor chip in the cavity, a molding layer filling the cavity, covering the connection structure and the semiconductor chip, and having an upper through hole therein. An upper redistribution structure is provided that includes: an upper insulating layer on the molding layer, a first protrusion inside the upper through hole, and an upper redistribution pattern, which includes a first upper via pattern, inside the first protrusion. The upper through hole of the molding layer is located above the via structure of the connection structure, the first upper via pattern is electrically connected to the via structure of the connection structure, and a portion of the first upper line pattern of the upper redistribution structure is buried in the upper insulating layer.
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公开(公告)号：US20250125245A1
公开(公告)日：2025-04-17
申请号：US18628890
申请日：2024-04-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hansae Lim
IPC: H01L23/498 , H01L23/00 , H01L23/31
Abstract: A semiconductor package includes a wiring substrate including a wiring pattern, a solder resist layer disposed on the wiring pattern and including an opening region, and a first penetrating contact disposed in the opening region of the solder resist layer. The semiconductor chip disposed in the opening region and connected to the wiring substrate. The molding portion includes a first portion covering the semiconductor chip and a second portion disposed below the semiconductor chip. The second portion includes a penetrating molding portion disposed in the first penetrating contact.
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公开(公告)号：US20250125182A1
公开(公告)日：2025-04-17
申请号：US18628404
申请日：2024-04-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： HYUN HO CHOI , JAEHWAN KIM , YONG-HO BAEK , HYEOK-JIN JEONG , HO YUNG CHONG
IPC: H01L21/687 , H01L21/673
Abstract: Disclosed are substrate rotating apparatuses, substrate processing systems, and substrate processing methods. The substrate rotating apparatus comprises vertically arranged stages and a rotary driver that turns the stages upside down. The stage includes a lower support assembly and an upper support assembly adjacent to the lower support assembly. The lower support assembly includes a lower support member having a lower support surface that supports one surface of a substrate. The upper support assembly includes upper support members. The upper support members are spaced apart from each other in a horizontal direction. A substrate placement space is between the upper support members. The upper support member includes an upper support surface that supports another surface of the substrate. The upper support surface is inclined toward the substrate placement space and makes an acute angle with the horizontal direction.
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