公开(公告)号：US09239295B2

公开(公告)日：2016-01-19

申请号：US13857744

申请日：2013-04-05

Applicant: KLA-Tencor Corporation

Inventor： Xianzhao Peng ,  Mark Shi Wang ,  Grace Hsiu-Ling Chen

IPC: G01N21/88 ,  G01N21/21 ,  G01N21/95

CPC classification number: G01N21/8806 ,  G01N21/21 ,  G01N21/9501 ,  G01N2021/8848

Abstract: Methods and systems for variable polarization wafer inspection are provided. One system includes one or more polarizing components position in one or more paths of light scattered from a wafer and detected by one or more channels of an inspection system. The polarizing component(s) are configured to have detection polarization(s) that are selected from two or more polarization settings for the polarizing component(s).

Abstract translation: 提供了用于可变偏振晶片检查的方法和系统。 一个系统包括一个或多个偏振组件，位于从晶片散射的光的一个或多个路径中，并由检查系统的一个或多个通道检测。 偏振分量被配置为具有从偏振分量的两个或更多个偏振设置中选择的检测极化。

公开(公告)号：US09171364B2

公开(公告)日：2015-10-27

申请号：US14168011

申请日：2014-01-30

Applicant: KLA-Tencor Corporation

Inventor： Kenong Wu ,  Tao Luo ,  Lisheng Gao ,  Eugene Shifrin ,  Aravindh Balaji

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes determining characteristics of care areas for a wafer based on wafer patterns. Determining the characteristics includes determining locations of care areas, identifying at least one pattern of interest (POI) in the wafer patterns for each of the care areas, allowing any of the care areas to have a free-form shape, allowing the care areas to be larger than frame images and selecting two or more POIs for at least one of the care areas. The method also includes searching for POIs in images generated for the wafer using an inspection system. In addition, the method includes detecting defects on the wafer by determining positions of the care areas in the images and applying one or more defect detection methods to the images based on the positions of the care areas in the images.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括基于晶片图案确定晶片护理区域的特征。 确定特征包括确定护理区域的位置，为每个护理区域确定晶片图案中的至少一个感兴趣模式（POI），允许任何护理区域具有自由形状，允许护理区域 大于框架图像并且为至少一个护理区域选择两个或更多个POI。 该方法还包括使用检查系统搜索为晶片生成的图像中的POI。 此外，该方法包括通过确定图像中的护理区域的位置并基于图像中的护理区域的位置将一个或多个缺陷检测方法应用于图像来检测晶片上的缺陷。

公开(公告)号：US09098891B2

公开(公告)日：2015-08-04

申请号：US14228023

申请日：2014-03-27

Applicant: KLA-Tencor Corporation

Inventor： Ashok V. Kulkarni ,  Saibal Banerjee

IPC: G06K9/00 ,  G06T7/00

CPC classification number: G06T7/0004 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods and systems for adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology are provided. The embodiments provide image processing and pattern recognition algorithms and an adaptive sampling method for extracting critical areas from SEM image patches for use in a wafer inspection system when design data for a semiconductor chip is not available. The embodiments also provide image processing and pattern recognition algorithms for efficiently discovering critical defects and significant deviations in the normal manufacturing process, using the output from a wafer inspection system and an adaptive sampling method to select wafer locations to be examined on a high resolution review or metrology tool.

Abstract translation: 提供了用于半导体检测配方创建，缺陷检查和计量的自适应采样的方法和系统。 实施例提供了图像处理和模式识别算法以及用于在半导体芯片的设计数据不可用时从用于晶片检查系统的SEM图像补片提取临界区域的自适应采样方法。 实施例还提供图像处理和模式识别算法，用于在正常制造过程中有效地发现关键缺陷和显着偏差，使用晶片检查系统的输出和自适应采样方法来选择要在高分辨率检查中检查的晶片位置， 计量工具

公开(公告)号：US09080990B2

公开(公告)日：2015-07-14

申请号：US13061936

申请日：2009-09-29

Applicant: Yung-Ho (Alex) Chuang ,  Vladimir Levinski ,  Xuefeng Liu

Inventor： Yung-Ho (Alex) Chuang ,  Vladimir Levinski ,  Xuefeng Liu

IPC: G01N21/55 ,  G01N21/95 ,  G01N21/47

CPC classification number: G01N21/9501 ,  G01N2021/479

Abstract: Illumination subsystems of a metrology system, metrology systems, and methods for illuminating a specimen for metrology measurements are provided. One illumination subsystem includes a light source configured to generate coherent pulses of light and a dispersive element positioned in the path of the coherent pulses of light, which is configured to reduce coherence of the pulses of light by mixing spatial and temporal characteristics of light distribution in the pulses of light. The illumination subsystem also includes an electro-optic modulator positioned in the path of the pulses of light exiting the dispersive element and which is configured to reduce the coherence of the pulses of light by temporally modulating the light distribution in the pulses of light. The illumination subsystem is configured to direct the pulses of light from the electro-optic modulator to a specimen positioned in the metrology system.

Abstract translation: 提供了计量系统的照明子系统，计量系统和用于度量测量的照明样本的方法。 一个照明子系统包括被配置为产生相干的光脉冲的光源和位于相干脉冲光的路径中的色散元件，该色散元件被配置为通过将光分布的空间和时间特征混合在一起来减小光脉冲的相干性 光的脉冲。 照明子系统还包括位于离开色散元件的光的脉冲的路径中的电光调制器，其被配置为通过暂时调制光脉冲中的光分布来减小光脉冲的相干性。 照明子系统被配置为将来自电光调制器的光的脉冲引导到位于计量系统中的样本。

公开(公告)号：US09053527B2

公开(公告)日：2015-06-09

申请号：US13733133

申请日：2013-01-02

Applicant: KLA-Tencor Corporation

Inventor： Jun Lang ,  Kan Chen ,  Lisheng Gao ,  Junqing Huang

IPC: G06K9/00 ,  G06T7/00 ,  G03F7/20 ,  G01N21/88 ,  G01N21/95

CPC classification number: G06T7/0004 ,  G01N21/8851 ,  G01N21/9501 ,  G01N2021/8867 ,  G03F7/70616 ,  G03F7/7065 ,  G06T7/0008 ,  G06T2207/10152 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes identifying one or more characteristics of first raw output generated for a wafer that correspond to one or more geometrical characteristics of patterned features formed on the wafer and assigning individual output in second raw output generated for the wafer to different segments based on the identified one or more characteristics of the first raw output and based on the individual output in the second raw output and individual output in the first raw output that were generated at substantially the same locations on the wafer such that the one or more geometrical characteristics of the patterned features that correspond to each of the different segments in the second raw output are different.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括识别对应于晶片上形成的图案化特征的一个或多个几何特征的晶片产生的第一原始输出的一个或多个特征，并且基于所识别的将针对晶片生成的第二原始输出中的各个输出分配给不同的段 第一原始输出的一个或多个特征，并且基于第二原始输出中的单独输出和在第一原始输出中在晶片上的基本相同位置处产生的单独输出，使得图案化的一个或多个几何特征 对应于第二原始输出中的每个不同段的特征是不同的。

公开(公告)号：US08873050B1

公开(公告)日：2014-10-28

申请号：US13969470

申请日：2013-08-16

Applicant: KLA-Tencor Corporation

Inventor： Klaus Flock

IPC: G01J3/28

CPC classification number: G01J3/36 ,  G01J3/18

Abstract: Systems and methods for determining information for a wafer are provided. One system includes a first grating that diffracts light from a wafer having wavelengths in a first portion of a broadband range and does not diffract the light from the wafer having wavelengths in a second portion of the broadband range. The system also includes a second grating positioned in the path of the light that is not diffracted by the first grating. The second grating diffracts the light from the wafer having the wavelengths in the second portion of the broadband range. The system further includes a first detector configured to generate first output responsive to the light diffracted by the first grating and a second detector configured to generate second output responsive to the light diffracted by the second grating.

Abstract translation: 提供了用于确定晶片信息的系统和方法。 一个系统包括第一光栅，其衍射来自具有在宽带范围的第一部分中的波长的晶片的光，并且不衍射具有在宽带范围的第二部分中的波长的晶片的光。 该系统还包括位于不被第一光栅衍射的光的路径中的第二光栅。 第二光栅衍射具有宽带范围第二部分波长的晶片的光。 该系统还包括第一检测器，其被配置为响应于由第一光栅衍射的光产生第一输出，以及第二检测器，被配置为响应于由第二光栅衍射的光产生第二输出。

公开(公告)号：US08204296B2

公开(公告)日：2012-06-19

申请号：US12881669

申请日：2010-09-14

Applicant: Kris Bhaskar ,  Mark McCord ,  Santosh Bhattacharyya ,  Ardis Liang ,  Richard Wallingford ,  Hubert Altendorfer ,  Kais Maayah

Inventor： Kris Bhaskar ,  Mark McCord ,  Santosh Bhattacharyya ,  Ardis Liang ,  Richard Wallingford ,  Hubert Altendorfer ,  Kais Maayah

IPC: G06K9/00

CPC classification number: G03F7/7065 ,  G01N21/93 ,  G01N21/95607 ,  G03F1/84 ,  G06T7/001 ,  G06T2207/30148

Abstract: Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step.

Abstract translation: 提供了用于生产用于模具的标准参考模具用于标准参考模具检验的方法和用于检查晶片的方法。 一种计算机实现的用于生产用于模具中的标准参考模具用于标准参考模具检查的方法包括获取用于晶片上的位于中心的管芯和位于晶片上的一个或多个管芯的检查系统的输出。 该方法还包括基于输出的管芯位置组合用于位于中心的管芯和一个或多个管芯的输出。 此外，该方法包括基于组合步骤的结果生成标准参考管芯。

公开(公告)号：US08073240B2

公开(公告)日：2011-12-06

申请号：US12115832

申请日：2008-05-06

Applicant: Verlyn Fischer ,  Chris Maher ,  Harish Hiriyannaiah ,  Younus Vora ,  Ping Ding ,  Andrew Hill

Inventor： Verlyn Fischer ,  Chris Maher ,  Harish Hiriyannaiah ,  Younus Vora ,  Ping Ding ,  Andrew Hill

IPC: G06K9/00

CPC classification number: G01N21/9501 ,  G03F1/84

Abstract: Computer-implemented methods, computer-readable media, and systems for identifying one or more optical modes of an inspection system as candidates for use in inspection of a layer of a wafer are provided. One method includes determining one or more characteristics of images of the layer of the wafer acquired using the inspection system and different optical modes available on the inspection system. The method also includes identifying a first portion of the different optical modes as not candidates for use in the inspection of the layer of the wafer based on the one or more characteristics of the images. In addition, the method includes generating output by eliminating the first portion of the different optical modes from the different optical modes at which the images were acquired such that the output includes a second portion of the different optical modes indicated as the candidates for use in the inspection.

Abstract translation: 提供了计算机实现的方法，计算机可读介质和用于将检查系统的一个或多个光学模式识别为用于检查晶片层的候选的系统。 一种方法包括确定使用检查系统获取的晶片层的图像的一个或多个特性以及在检查系统上可用的不同光学模式。 该方法还包括基于图像的一个或多个特性，将不同光学模式的第一部分识别为不用于检查晶片层的候选。 此外，该方法包括通过从获取图像的不同光学模式中消除不同光学模式的第一部分来产生输出，使得输出包括不同光学模式的第二部分，其被指示为用于 检查。

公开(公告)号：US08041106B2

公开(公告)日：2011-10-18

申请号：US12328862

申请日：2008-12-05

Applicant: Patrick Tung-Sing Pak ,  Wee-Teck Chia ,  Aaron Geurdon Chin ,  Irfan Malik ,  Brian Duffy

Inventor： Patrick Tung-Sing Pak ,  Wee-Teck Chia ,  Aaron Geurdon Chin ,  Irfan Malik ,  Brian Duffy

IPC: G01K9/00

CPC classification number: G01N21/956 ,  G01N2021/95676 ,  G06T7/001 ,  G06T2207/30148

Abstract: Methods and systems for detecting defects on a reticle are provided. One method includes printing a single die reticle in first areas of a wafer using different values of a parameter of a lithography process and at least one second area using a nominal value of the parameter. The method also includes acquiring first images of the first areas and second image(s) of the at least one second area. In addition, the method includes separately comparing the first images acquired for different first areas to at least one of the second image(s). The method further includes detecting defects on the reticle based on first portions of the first images in which variations in the first images compared to the at least one second image are greater than second portions of the first images and the first portions that are common to two or more of the first images.

Abstract translation: 提供了用于检测光罩上的缺陷的方法和系统。 一种方法包括使用光刻工艺的参数的不同值和使用参数的标称值的至少一个第二区域在晶片的第一区域中印刷单个模具掩模版。 该方法还包括获取至少一个第二区域的第一区域和第二图像的第一图像。 此外，该方法包括将对于不同的第一区域获取的第一图像分别与第二图像中的至少一个进行比较。 该方法还包括基于第一图像的第一部分来检测标线上的缺陷，其中与至少一个第二图像相比的第一图像的变化大于第一图像的第二部分和第二图像的两个共同的第一部分 或更多的第一图像。

公开(公告)号：US07912658B2

公开(公告)日：2011-03-22

申请号：US12128426

申请日：2008-05-28

Applicant: Stephen Biellak ,  Daniel Kavaldjiev

Inventor： Stephen Biellak ,  Daniel Kavaldjiev

IPC: G06F19/00

CPC classification number: H01L22/12 ,  G01N21/9501 ,  G01N2021/8825 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Systems and methods for determining two or more characteristics of a wafer are provided. The two or more characteristics include a characteristic of the wafer that is spatially localized in at least one dimension and a characteristic of the wafer that is not spatially localized in two dimensions.

Abstract translation: 提供了用于确定晶片的两个或多个特性的系统和方法。 两个或更多个特征包括在至少一个维度上空间定位的晶片的特性和晶片在两维空间上不局限的特征。