Abstract:
An imaging apparatus includes a light source; a first beam splitter for reflecting a projection beam emitted by the light source; an objective lens unit including a reflection reference surface for reproducing the projection beam into a measurement beam projected onto an object to generate a first reflection beam and a reference beam projected onto the reflection reference surface to generate a second reflection beam mixing with the first reflection beam and passing through the first splitter and forming an operating beam; a second beam splitter for modulating the operating beam into first and second sub-beams; a monochrome image detection device for passage of the first sub-beam to obtain an interferometric image with monochrome from a first interference region; and an image detection device for permitting passage of the second sub-beam in order to obtain a non-interferometric image from a second interference region.
Abstract:
A test device is provided for testing a bottom chip of a package-on-package (PoP) stacked-chip. An upper surface of the bottom chip has a plurality of soldering points for electrically connecting a plurality of corresponding soldering points of a top chip of the PoP stacked-chip. The test device includes a test head and a plurality of test contacts. The test head has the top chip installed inside. The plurality of test contacts is installed on a lower surface of the test head and electrically connected to the plurality of corresponding soldering points of the top chip inside the test head. When the lower surface of the test head contacts the upper surface of the bottom chip, the plurality of test contacts is electrically connected to the plurality of soldering points for testing the bottom chip.
Abstract:
A testing system for testing semiconductor package stacking chips is disclosed. The system includes a testing socket, a testing arm, and a testing mechanism. The testing mechanism includes a probe testing device. The probe testing device has a testing chip inside and a plurality of testing probes electrically connected to the testing chip. The plurality of testing probes extends toward the testing socket for contacting a chip-under-test loaded on the testing socket. When the testing mechanism moves to an upper position between the testing socket and the testing arm, the testing arm moves downward in the vertical direction and presses down the testing mechanism thereby coercing the plurality of testing probes in the testing mechanism to closely abut against the chip-under-test, so that the testing chip inside the testing mechanism can electrically connect to the chip-under-test for forming a test loop.
Abstract:
A solar cell inspection method and apparatus are disclosed. An embodiment of the solar cell inspection method includes the steps of: charging a diffusion capacitance of a solar cell; after charging the diffusion capacitance, discharging the diffusion capacitance; and detecting light emitted by the solar cell during the discharging step.
Abstract:
A testing apparatus includes a thermal control chamber including a test room, which temperature is controlled within a testing temperature range; a carrier frame including a direction guiding unit installed securely within the test room and formed with one guiding groove and a carrier rod extending through the guiding groove in the direction guiding unit; and a clamping unit mounted on the carrier rod for clamping a display-panel module securely, wherein, movement of the carrier rod transversely within the guiding groove relative to the direction guiding unit results in disposing the display-panel module to extend along one of several testing directions for undergoing a burn-in test.
Abstract:
The invention discloses an optical measurement system for measuring the optical properties of a device under test (DUT). The optical measurement system includes a DUT, a light measuring module, a light guiding module and an analyzing module. The present invention utilizes the light guiding module to receive an axial ray of the rays emitted by the DUT so as to analyze the optical properties thereof. Thus, the present invention is not only capable of measuring the light intensity of the rays emitted by the DUT, but also capable of obtaining the properties of the axial ray emitted by the DUT.
Abstract:
A tray for placing a plurality of pouch-type batteries is provided. The tray includes a frame, at least a drive shaft, a plurality of fixed plates and a plurality of movable plates. The drive shaft is slidably fixed to the frame along a drive axis, where the drive shaft has a positioning device for fixing a relative position of the drive shaft with respect to the frame. The fixed plates are perpendicular to the drive axis, and are arranged in order along the drive axis and fixed within the frame. The movable plates are also perpendicular to the drive axis, and are arranged in order along the drive axis within the frame, and the movable plates are interlaced with the fixed plates. The movable plates are moved together with the drive shaft, and each of the movable plates and each of the fixed plates define a receiving space for receiving the pouch-type battery, and are used for clamping each of the pouch-type batteries.
Abstract:
A test fixture for testing a semiconductor die with its loading member maintained flat throughout the test is disclosed. The test fixture includes a loading member and a frame. The loading member includes a base film having a melting point higher than a thermal equilibrium temperature thereof, wherein the thermal equilibrium temperature is achieved due to heat transfer from the semiconductor die under test to the base film via the adhesive layer. The loading member further includes an adhesive layer made of electrically conductive adhesive material. The loading member is adapted for securing diced LED dies in position and maintained flat throughout the die testing process, thereby ensuring the accuracy of testing for optical and electrical properties of the dies.
Abstract:
The device for simulating a rectified constant impedance load provide by the present invention is to test a power product and comprises an analog-digital converter, a digital signal processor, a digital-analog converter, and an active electrical load module in order to replacing the passive components of a traditional rectified passive load. method for simulating a rectified constant impedance load being applied to test a power product and comprising the steps of: (S1) replacing the plurality of passive components of the rectified constant impedance load with a digital control module and an active electrical load module; (S2) establishing a passive load model function in order to represent the application relationships of the plurality of the passive components; (S3) executing the operation of the passive load model function by the digital control module in order to gain a load current value, and transferring the load current value to an analog control signal via the digital control module; and (S4) controlling the active electrical load module via the analog control signal so as to draw currents from the power product.
Abstract:
Apparatus for testing micro SD devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time. The apparatus comprises a test hive comprising: a plurality of test circuits corresponding in number to at least a predetermined number of cells in the tray; and a plurality of groups of test contacts, each group is coupled to one of the test circuits and is oriented to engage the plurality of electrical contacts of a micro SD device disposed in a corresponding one of the cells. The test hive is operable to simultaneously, electrically test at least a predetermined number of the number of the micro SD devices in each tray engaged by the hive without removing the micro SD devices that did pass electrical testing until a tray of electrically tested micro SD devices is fully populated with micro SD devices that did pass electrical testing.