Imaging apparatus and method thereof
    161.
    发明授权
    Imaging apparatus and method thereof 有权
    成像装置及其方法

    公开(公告)号:US08638445B2

    公开(公告)日:2014-01-28

    申请号:US13163862

    申请日:2011-06-20

    CPC classification number: G01B11/24 G01B11/2441

    Abstract: An imaging apparatus includes a light source; a first beam splitter for reflecting a projection beam emitted by the light source; an objective lens unit including a reflection reference surface for reproducing the projection beam into a measurement beam projected onto an object to generate a first reflection beam and a reference beam projected onto the reflection reference surface to generate a second reflection beam mixing with the first reflection beam and passing through the first splitter and forming an operating beam; a second beam splitter for modulating the operating beam into first and second sub-beams; a monochrome image detection device for passage of the first sub-beam to obtain an interferometric image with monochrome from a first interference region; and an image detection device for permitting passage of the second sub-beam in order to obtain a non-interferometric image from a second interference region.

    Abstract translation: 一种成像装置,包括光源; 用于反射由光源发射的投影光束的第一分束器; 物镜单元,包括用于将投影光束再现成投射到物体上的测量光束以产生第一反射光束的反射参考表面和投影到反射参考表面上的参考光束,以产生与第一反射光束混合的第二反射光束 并穿过第一分流器并形成操作梁; 第二分束器,用于将操作光束调制成第一和第二子光束; 用于通过第一子光束以从第一干涉区域获得具有单色的干涉图像的单色图像检测装置; 以及用于允许第二子光束通过以从第二干涉区域获得非干涉图像的图像检测装置。

    TEST DEVICE FOR TESTING A POP STACKED-CHIP
    162.
    发明申请
    TEST DEVICE FOR TESTING A POP STACKED-CHIP 有权
    用于测试POP堆叠芯片的测试设备

    公开(公告)号:US20130293254A1

    公开(公告)日:2013-11-07

    申请号:US13875660

    申请日:2013-05-02

    CPC classification number: G01R31/2887 G01R31/2896

    Abstract: A test device is provided for testing a bottom chip of a package-on-package (PoP) stacked-chip. An upper surface of the bottom chip has a plurality of soldering points for electrically connecting a plurality of corresponding soldering points of a top chip of the PoP stacked-chip. The test device includes a test head and a plurality of test contacts. The test head has the top chip installed inside. The plurality of test contacts is installed on a lower surface of the test head and electrically connected to the plurality of corresponding soldering points of the top chip inside the test head. When the lower surface of the test head contacts the upper surface of the bottom chip, the plurality of test contacts is electrically connected to the plurality of soldering points for testing the bottom chip.

    Abstract translation: 提供了一种用于测试封装封装(PoP)堆叠芯片的底部芯片的测试设备。 底部芯片的上表面具有用于电连接PoP堆叠芯片的顶部芯片的多个对应焊接点的多个焊接点。 测试装置包括测试头和多个测试触点。 测试头内部安装了顶部芯片。 多个测试触点安装在测试头的下表面上并电连接到测试头内的顶部芯片的多个对应焊接点。 当测试头的下表面接触底部芯片的上表面时,多个测试触点电连接到多个焊接点以测试底部芯片。

    Testing system for Testing Semiconductor Package stacking Chips and Semiconductor Automatic Tester thereof
    163.
    发明申请
    Testing system for Testing Semiconductor Package stacking Chips and Semiconductor Automatic Tester thereof 有权
    半导体封装堆芯芯片和半导体自动测试仪测试系统

    公开(公告)号:US20130293252A1

    公开(公告)日:2013-11-07

    申请号:US13854372

    申请日:2013-04-01

    Inventor: Chien-Ming CHEN

    CPC classification number: G01R31/2896 G01R31/2887

    Abstract: A testing system for testing semiconductor package stacking chips is disclosed. The system includes a testing socket, a testing arm, and a testing mechanism. The testing mechanism includes a probe testing device. The probe testing device has a testing chip inside and a plurality of testing probes electrically connected to the testing chip. The plurality of testing probes extends toward the testing socket for contacting a chip-under-test loaded on the testing socket. When the testing mechanism moves to an upper position between the testing socket and the testing arm, the testing arm moves downward in the vertical direction and presses down the testing mechanism thereby coercing the plurality of testing probes in the testing mechanism to closely abut against the chip-under-test, so that the testing chip inside the testing mechanism can electrically connect to the chip-under-test for forming a test loop.

    Abstract translation: 公开了一种用于测试半导体封装堆叠芯片的测试系统。 该系统包括测试插座,测试臂和测试机构。 测试机构包括探针测试装置。 探针测试装置内部具有测试芯片,并且多个测试探针电连接到测试芯片。 多个测试探针延伸到测试插座,用于接触加载在测试插座上的芯片下测试。 当测试机构移动到测试插座和测试臂之间的上部位置时,测试臂沿垂直方向向下移动并按压测试机构,从而迫使测试机构中的多个测试探针紧紧靠在芯片上 - 测试,使测试机构内的测试芯片可以电连接到芯片下测试以形成测试回路。

    SOLAR CELL INSPECTION METHOD AND APPARATUS THEREOF
    164.
    发明申请
    SOLAR CELL INSPECTION METHOD AND APPARATUS THEREOF 审中-公开
    太阳能电池检测方法及其装置

    公开(公告)号:US20130114072A1

    公开(公告)日:2013-05-09

    申请号:US13288941

    申请日:2011-11-03

    CPC classification number: H02S50/00 H02S50/10

    Abstract: A solar cell inspection method and apparatus are disclosed. An embodiment of the solar cell inspection method includes the steps of: charging a diffusion capacitance of a solar cell; after charging the diffusion capacitance, discharging the diffusion capacitance; and detecting light emitted by the solar cell during the discharging step.

    Abstract translation: 公开了一种太阳能电池检查方法和装置。 太阳能电池检查方法的一个实施例包括以下步骤:对太阳能电池的扩散电容进行充电; 在对扩散电容进行充电之后,对扩散电容进行放电; 以及在放电步骤期间检测太阳能电池发出的光。

    BURN-IN TESTING APPARATUS
    165.
    发明申请
    BURN-IN TESTING APPARATUS 有权
    煲仔测试仪

    公开(公告)号:US20120326740A1

    公开(公告)日:2012-12-27

    申请号:US13340758

    申请日:2011-12-30

    CPC classification number: G01R31/2849 G01R31/2817 G09G3/006

    Abstract: A testing apparatus includes a thermal control chamber including a test room, which temperature is controlled within a testing temperature range; a carrier frame including a direction guiding unit installed securely within the test room and formed with one guiding groove and a carrier rod extending through the guiding groove in the direction guiding unit; and a clamping unit mounted on the carrier rod for clamping a display-panel module securely, wherein, movement of the carrier rod transversely within the guiding groove relative to the direction guiding unit results in disposing the display-panel module to extend along one of several testing directions for undergoing a burn-in test.

    Abstract translation: 测试装置包括一个包括测试室的热控制室,该温度控制在测试温度范围内; 载体框架,其包括方向引导单元,所述方向引导单元牢固地安装在所述测试室内并且形成有一个引导槽和沿所述方向引导单元延伸穿过所述引导槽的承载杆; 以及安装在所述承载杆上以用于可靠地夹持显示面板模块的夹紧单元,其中,所述承载杆相对于所述方向引导单元横向地在所述引导槽内的运动导致将所述显示面板模块布置成沿着多个 测试方向进行老化测试。

    OPTICAL MEASUREMENT SYSTEM AND THE DEVICE THEREOF
    166.
    发明申请
    OPTICAL MEASUREMENT SYSTEM AND THE DEVICE THEREOF 审中-公开
    光学测量系统及其设备

    公开(公告)号:US20120320369A1

    公开(公告)日:2012-12-20

    申请号:US13252425

    申请日:2011-10-04

    Abstract: The invention discloses an optical measurement system for measuring the optical properties of a device under test (DUT). The optical measurement system includes a DUT, a light measuring module, a light guiding module and an analyzing module. The present invention utilizes the light guiding module to receive an axial ray of the rays emitted by the DUT so as to analyze the optical properties thereof. Thus, the present invention is not only capable of measuring the light intensity of the rays emitted by the DUT, but also capable of obtaining the properties of the axial ray emitted by the DUT.

    Abstract translation: 本发明公开了一种用于测量待测器件(DUT)的光学特性的光学测量系统。 光学测量系统包括DUT,光测量模块,导光模块和分析模块。 本发明利用光导模块来接收由DUT发射的射线的轴向光线,以分析其光学特性。 因此,本发明不仅能够测量由DUT发射的光线的光强度,而且能够获得由DUT发射的轴向射线的特性。

    TRAY
    167.
    发明申请
    TRAY 有权
    托盘

    公开(公告)号:US20120312719A1

    公开(公告)日:2012-12-13

    申请号:US13492472

    申请日:2012-06-08

    CPC classification number: H01M2/1077 H01M2/0207 H01M2/1061

    Abstract: A tray for placing a plurality of pouch-type batteries is provided. The tray includes a frame, at least a drive shaft, a plurality of fixed plates and a plurality of movable plates. The drive shaft is slidably fixed to the frame along a drive axis, where the drive shaft has a positioning device for fixing a relative position of the drive shaft with respect to the frame. The fixed plates are perpendicular to the drive axis, and are arranged in order along the drive axis and fixed within the frame. The movable plates are also perpendicular to the drive axis, and are arranged in order along the drive axis within the frame, and the movable plates are interlaced with the fixed plates. The movable plates are moved together with the drive shaft, and each of the movable plates and each of the fixed plates define a receiving space for receiving the pouch-type battery, and are used for clamping each of the pouch-type batteries.

    Abstract translation: 提供了一种用于放置多个袋型电池的托盘。 托盘包括框架,至少驱动轴,多个固定板和多个可动板。 驱动轴沿着驱动轴线可滑动地固定到框架上,其中驱动轴具有用于固定驱动轴相对于框架的相对位置的定位装置。 固定板垂直于驱动轴,沿着驱动轴依次布置并固定在框架内。 可移动板也垂直于驱动轴线,并且沿框架内的驱动轴依次布置,并且可移动板与固定板交错。 可移动板与驱动轴一起移动,并且每个可移动板和每个固定板限定用于接收袋型电池的容纳空间,并用于夹持每个袋型电池。

    TEST FIXTURE FOR TESTING SEMICONDUCTOR DIE WITH ITS LOADING MEMBER MAINTAINED FLAT THROUGHOUT THE TEST
    168.
    发明申请
    TEST FIXTURE FOR TESTING SEMICONDUCTOR DIE WITH ITS LOADING MEMBER MAINTAINED FLAT THROUGHOUT THE TEST 审中-公开
    用于测试半导体器件的测试夹具及其加载构件通过测试保持平面

    公开(公告)号:US20120013348A1

    公开(公告)日:2012-01-19

    申请号:US12896899

    申请日:2010-10-03

    CPC classification number: G01R1/0408

    Abstract: A test fixture for testing a semiconductor die with its loading member maintained flat throughout the test is disclosed. The test fixture includes a loading member and a frame. The loading member includes a base film having a melting point higher than a thermal equilibrium temperature thereof, wherein the thermal equilibrium temperature is achieved due to heat transfer from the semiconductor die under test to the base film via the adhesive layer. The loading member further includes an adhesive layer made of electrically conductive adhesive material. The loading member is adapted for securing diced LED dies in position and maintained flat throughout the die testing process, thereby ensuring the accuracy of testing for optical and electrical properties of the dies.

    Abstract translation: 公开了一种用于测试半导体管芯的测试固定件,其装载构件在整个测试中保持平坦。 测试夹具包括加载构件和框架。 加载构件包括熔点高于其热平衡温度的基膜,其中由于通过粘合剂层从被测半导体模具到基底膜的热传递,实现了热平衡温度。 装载构件还包括由导电粘合剂材料制成的粘合剂层。 加载构件适用于将切割的LED管芯固定在适当位置并且在整个模头测试过程中保持平坦,从而确保了对模具的光学和电学性能的测试的准确性。

    Device for simulating rectified constant impedance load and method thereof
    169.
    发明授权
    Device for simulating rectified constant impedance load and method thereof 有权
    用于模拟整流恒定阻抗负载的装置及其方法

    公开(公告)号:US08044678B2

    公开(公告)日:2011-10-25

    申请号:US12244346

    申请日:2008-10-02

    CPC classification number: G01R31/42 G01R31/2848

    Abstract: The device for simulating a rectified constant impedance load provide by the present invention is to test a power product and comprises an analog-digital converter, a digital signal processor, a digital-analog converter, and an active electrical load module in order to replacing the passive components of a traditional rectified passive load. method for simulating a rectified constant impedance load being applied to test a power product and comprising the steps of: (S1) replacing the plurality of passive components of the rectified constant impedance load with a digital control module and an active electrical load module; (S2) establishing a passive load model function in order to represent the application relationships of the plurality of the passive components; (S3) executing the operation of the passive load model function by the digital control module in order to gain a load current value, and transferring the load current value to an analog control signal via the digital control module; and (S4) controlling the active electrical load module via the analog control signal so as to draw currents from the power product.

    Abstract translation: 本发明提供的用于模拟整流恒定阻抗负载的装置是测试功率产品,并且包括模拟数字转换器,数字信号处理器,数模转换器和有源电负载模块,以便更换 被动元件的传统整流被动负载。 用于模拟整流的恒定阻抗负载的方法,用于测试电力产品,并且包括以下步骤:(S1)用数字控制模块和有源电负载模块代替整流的恒定阻抗负载的多个无源部件; (S2)建立无源负载模型功能,以便表示多个无源组件的应用关系; (S3)通过数字控制模块执行无源负载模型功能的操作,以获得负载电流值,并通过数字控制模块将负载电流值传递给模拟控制信号; 和(S4)经由模拟控制信号控制有源电负载模块,以便从电力产品中抽取电流。

    Test circuits of an apparatus for testing micro SD devices
    170.
    发明授权
    Test circuits of an apparatus for testing micro SD devices 失效
    用于测试微型SD设备的设备的测试电路

    公开(公告)号:US07518357B2

    公开(公告)日:2009-04-14

    申请号:US11786768

    申请日:2007-04-12

    CPC classification number: G01R31/2893 G01R31/2887

    Abstract: Apparatus for testing micro SD devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time. The apparatus comprises a test hive comprising: a plurality of test circuits corresponding in number to at least a predetermined number of cells in the tray; and a plurality of groups of test contacts, each group is coupled to one of the test circuits and is oriented to engage the plurality of electrical contacts of a micro SD device disposed in a corresponding one of the cells. The test hive is operable to simultaneously, electrically test at least a predetermined number of the number of the micro SD devices in each tray engaged by the hive without removing the micro SD devices that did pass electrical testing until a tray of electrically tested micro SD devices is fully populated with micro SD devices that did pass electrical testing.

    Abstract translation: 描述了用于测试每个具有多个电引线的微型SD设备的装置。 该设备采用行业标准的JEDEC托盘,同时对这些托盘中的所有设备进行测试。 该装置包括测试蜂巢,其包括:多个测试电路,其数量对应于托盘中的至少预定数量的单元; 以及多组测试触点,每个组耦合到一个测试电路,并且被定向成接合设置在相应的一个单元中的微型SD器件的多个电触头。 测试配置单元可同时操作,电测试由蜂巢接合的每个托盘中至少预定数量的微型SD设备,而不需要移除通过电测试的微型SD设备,直到经过电测试的微型SD设备 完全填充了通过电气测试的微型SD设备。

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