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    Apparatus for testing system-in-package devices
    1.
    发明授权
    Apparatus for testing system-in-package devices 失效
    用于测试系统级封装器件的装置

    公开(公告)号：US07535214B2

    公开(公告)日：2009-05-19

    申请号：US11786778

    申请日：2007-04-12

    Applicant: James E. Hopkins ,  Michael Peter Costello ,  Herbert Tsai ,  Ching-Too Chen

    Inventor： James E. Hopkins ,  Michael Peter Costello ,  Herbert Tsai ,  Ching-Too Chen

    IPC: G01R31/02

    CPC classification number: G01R31/2893 ,  G11C29/56 ,  G11C29/56016 ,  H01L21/67333

    Abstract: Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests at least a predetermined portion of all devices in such trays at the same time. The apparatus comprises a test hive comprising: a plurality of test circuits corresponding in number to at least a predetermined number of cells in the tray; and a plurality of groups of test contacts, each group is coupled to one of the test circuits and is oriented to engage the plurality of electrical contacts of a SIP device disposed in a corresponding one of the cells. The test hive is operable to simultaneously, electrically test at least a predetermined number of the number of the SIP devices in each tray engaged by the hive without removing the SIP devices from the tray. The apparatus also includes a sorter automatically operable to remove each SIP device that did not pass electrical testing with SIP devices that did pass electrical testing until a tray of electrically tested SIP devices is fully populated with SIP devices that did pass electrical testing.

    Abstract translation: 描述了具有多个电引线的用于测试系统级封装（SIP）器件的装置。 该装置利用工业标准的JEDEC托盘并且同时测试这种托盘中的所有装置的至少预定部分。 该装置包括测试蜂巢，其包括：多个测试电路，其数量对应于托盘中的至少预定数量的单元; 以及多组测试触点，每组耦合到测试电路中的一个并且被定向成与设置在相应的一个单元中的SIP设备的多个电触点接合。 测试配置单元可操作以同时电测试蜂巢接收的每个托盘中至少预定数量的SIP设备数量，而不从托盘移除SIP设备。 该设备还包括分拣机，其可自动操作以移除没有通过电测试的SIP设备，该SIP设备通过电测试，直到经过电测试的SIP设备的盘被完全填充了通过电测试的SIP设备。

    Method for testing micro SD devices using each test circuits
    3.
    发明授权
    Method for testing micro SD devices using each test circuits 失效
    使用每个测试电路测试微型SD设备的方法

    公开(公告)号：US07443190B1

    公开(公告)日：2008-10-28

    申请号：US11786746

    申请日：2007-04-12

    Applicant: James E. Hopkins ,  Michael Peter Costello ,  Herbert Tsai ,  Ching-Too Chen

    Inventor： James E. Hopkins ,  Michael Peter Costello ,  Herbert Tsai ,  Ching-Too Chen

    IPC: G01R31/26 ,  G01R31/02

    CPC classification number: G01R31/2893 ,  G01R31/31905 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602

    Abstract: A method for testing micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests at least a predetermined portion of the devices in such trays at the same time. The method of the illustrative embodiment include the steps of: providing a test hive comprising a plurality of test circuits corresponding in number to at least a predetermined portion of said cells and comprising a plurality of groups of test contacts, each group of said groups of test contacts being coupled to one of said test circuits and being oriented to engage said plurality of electrical contacts of a micro SD device disposed in a corresponding one of said cells; moving each said tray from said stack one at a time to a position proximate said test hive; causing relative movement of said tray proximate said test hive whereby said test hive engages said tray of micro SD device and said test hive such that electrical connection is made simultaneously by each of said groups of test contacts with said electrical contacts of a micro SD device disposed in said corresponding of said cells; and simultaneously, electrically testing at least a predetermined portion of said micro SD devices in each tray engaged by said hive without removing said micro SD devices from said tray.

    Abstract translation: 描述了一种用于测试每个具有多个电引线的微型SD器件的方法。 该方法使用工业标准JEDEC托盘并同时测试这些托盘中的装置的至少预定部分。 说明性实施例的方法包括以下步骤：提供包括多个测试电路的测试配置单元，其数量对应于所述单元的至少预定部分，并且包括多组测试触点，每组所述测试组 触点耦合到所述测试电路中的一个并且被定向成接合设置在相应的一个所述单元中的微型SD器件的所述多个电触头; 将每个所述托盘从所述堆叠一次移动到靠近所述测试配置单元的位置; 使得所述托盘相对运动靠近所述测试蜂巢，由此所述测试配置单元接合所述微型SD设备和所述测试配置单元的所述托盘，使得每个所述测试接触组同时由所述微型SD设备的所述电触点 在所述对应的所述细胞中; 同时，电子测试由所述蜂巢接合的每个托盘中的所述微型SD设备的至少预定部分，而不从所述托盘移除所述微型SD设备。

    Apparatus for testing system-in-package devices
    6.
    发明申请
    Apparatus for testing system-in-package devices 失效
    用于测试系统级封装器件的装置

    公开(公告)号：US20080252314A1

    公开(公告)日：2008-10-16

    申请号：US11786778

    申请日：2007-04-12

    Applicant: James E. Hopkins ,  Michael Peter Costello ,  Herbert Tsai ,  Ching-Too Chen

    Inventor： James E. Hopkins ,  Michael Peter Costello ,  Herbert Tsai ,  Ching-Too Chen

    IPC: G01R31/02

    CPC classification number: G01R31/2893 ,  G11C29/56 ,  G11C29/56016 ,  H01L21/67333

    Abstract: Apparatus for testing System-In-Package (SIP) devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests at least a predetermined portion of all devices in such trays at the same time. The apparatus comprises a test hive comprising: a plurality of test circuits corresponding in number to at least a predetermined number of cells in the tray: and a plurality of groups of test contacts, each group is coupled to one of the test circuits and is oriented to engage the plurality of electrical contacts of a SIP device disposed in a corresponding one of the cells. The lest hive is operable to simultaneously, electrically test at least a predetermined number of the number of the SIP devices in each tray engaged by the hive without removing the SIP devices from the tray. The apparatus also includes a sorter automatically operable to remove each SIP device that did not pass electrical testing with SIP devices that did pass electrical testing until a tray of electrically tested SIP devices is fully populated with SIP devices that did pass electrical testing.

    Abstract translation: 描述了具有多个电引线的用于测试系统级封装（SIP）器件的装置。 该装置利用工业标准的JEDEC托盘并且同时测试这种托盘中的所有装置的至少预定部分。 该装置包括测试蜂巢，其包括：多个对应于托盘中的至少预定数量的单元的测试电路;以及多组测试触点，每组耦合到一个测试电路并且被定向 以接合设置在相应的一个单元中的SIP设备的多个电触头。 最小蜂巢可操作以同时电测试由蜂巢接合的每个托盘中的至少预定数量的SIP设备的数量，而不从托盘移除SIP设备。 该设备还包括分拣机，其可自动操作以移除没有通过电测试的SIP设备，该SIP设备通过电测试，直到经过电测试的SIP设备的盘被完全填充了通过电测试的SIP设备。

    Apparatus for testing micro SD devices
    8.
    发明申请
    Apparatus for testing micro SD devices 失效
    用于测试微型SD设备的设备

    公开(公告)号：US20080252320A1

    公开(公告)日：2008-10-16

    申请号：US11786768

    申请日：2007-04-12

    Applicant: James E. Hopkins ,  Michael Peter Costello ,  Herbert Tsai ,  Ching-Too Chen

    Inventor： James E. Hopkins ,  Michael Peter Costello ,  Herbert Tsai ,  Ching-Too Chen

    IPC: G01R31/26

    CPC classification number: G01R31/2893 ,  G01R31/2887

    Abstract: Apparatus for testing micro SD devices each having a plurality of electrical leads is described. The apparatus utilizes industry standard JEDEC trays and tests all devices in such trays at the same time. The apparatus comprises a test hive comprising: a plurality of test circuits corresponding in number to at least a predetermined number of cells in the tray: and a plurality of groups of test contacts, each group is coupled to one of the test circuits and is oriented to engage the plurality of electrical contacts of a micro SD device disposed in a corresponding one of the cells. The test hive is operable to simultaneously, electrically test at least a predetermined number of the number of the micro SD devices in each tray engaged by the hive without removing the micro SD devices that did pass electrical testing until a tray of electrically tested micro SD devices is fully populated with micro SD devices that did pass electrical testing.

    Abstract translation: 描述了用于测试每个具有多个电引线的微型SD设备的装置。 该设备采用行业标准的JEDEC托盘，同时对这些托盘中的所有设备进行测试。 该装置包括测试蜂巢，其包括：多个对应于托盘中的至少预定数量的单元的测试电路;以及多组测试触点，每组耦合到一个测试电路并且被定向 以接合设置在相应的一个单元中的微SD设备的多个电触点。 测试配置单元可同时操作，电测试由蜂巢接合的每个托盘中至少预定数量的微型SD设备，而不需要移除通过电测试的微型SD设备，直到经过电测试的微型SD设备 完全填充了通过电气测试的微型SD设备。

    METHOD FOR TESTING MICRO SD DEVICES USING EACH TEST CIRCUITS
    10.
    发明申请
    METHOD FOR TESTING MICRO SD DEVICES USING EACH TEST CIRCUITS 失效
    使用每个测试电路测试微型SD设备的方法

    公开(公告)号：US20080252318A1

    公开(公告)日：2008-10-16

    申请号：US11786746

    申请日：2007-04-12

    Applicant: James E. Hopkins ,  Michael Peter Costello ,  Herbert Tsai ,  Ching-Too Chen

    Inventor： James E. Hopkins ,  Michael Peter Costello ,  Herbert Tsai ,  Ching-Too Chen

    IPC: G01R31/02

    CPC classification number: G01R31/2893 ,  G01R31/31905 ,  G11C29/56 ,  G11C29/56016 ,  G11C2029/5602

    Abstract: A method for testing micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests at least a predetermined portion of the devices in such trays at the same time. The method of the illustrative embodiment include the steps of: providing a test hive comprising a plurality of test circuits corresponding in number to at least a predetermined portion of said cells and comprising a plurality of groups of test contacts, each group of said groups of test contacts being coupled to one of said test circuits and being oriented to engage said plurality of electrical contacts of a micro SD device disposed in a corresponding one of said cells; moving each said tray from said stack one at a time to a position proximate said test hive; causing relative movement of said tray proximate said test hive whereby said test hive engages said tray of micro SD devices and said test hive such that electrical connection is made simultaneously by each of said groups of test contacts with said electrical contacts of a micro SD device disposed in said corresponding one of said cells; and simultaneously, electrically testing at least a predetermined portion of said micro SD devices in each tray engaged by said hive without removing said micro SD devices from said tray.

    Abstract translation: 描述了一种用于测试每个具有多个电引线的微型SD器件的方法。 该方法使用工业标准JEDEC托盘并同时测试这些托盘中的装置的至少预定部分。 说明性实施例的方法包括以下步骤：提供包括多个测试电路的测试配置单元，其数量对应于所述单元的至少预定部分，并且包括多组测试触点，每组所述测试组 触点耦合到所述测试电路中的一个并且被定向成接合设置在相应的一个所述单元中的微型SD器件的所述多个电触头; 将每个所述托盘从所述堆叠一次移动到靠近所述测试配置单元的位置; 使得所述托盘相对运动靠近所述测试蜂巢，由此所述测试配置单元接合微SD设备和所述测试配置单元的所述托盘，使得所述测试接触组中的每一个同时由所述微型SD设备的所述电触点同时进行电连接 在所述相应的一个所述细胞中; 同时，电子测试由所述蜂巢接合的每个托盘中的所述微型SD设备的至少预定部分，而不从所述托盘移除所述微型SD设备。

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