公开(公告)号：US20120013348A1

公开(公告)日：2012-01-19

申请号：US12896899

申请日：2010-10-03

Applicant: Cheng-Huiung Chen ,  Chia-Bin Tseng

Inventor： Cheng-Huiung Chen ,  Chia-Bin Tseng

IPC: G01R31/26

CPC classification number: G01R1/0408

Abstract: A test fixture for testing a semiconductor die with its loading member maintained flat throughout the test is disclosed. The test fixture includes a loading member and a frame. The loading member includes a base film having a melting point higher than a thermal equilibrium temperature thereof, wherein the thermal equilibrium temperature is achieved due to heat transfer from the semiconductor die under test to the base film via the adhesive layer. The loading member further includes an adhesive layer made of electrically conductive adhesive material. The loading member is adapted for securing diced LED dies in position and maintained flat throughout the die testing process, thereby ensuring the accuracy of testing for optical and electrical properties of the dies.

Abstract translation: 公开了一种用于测试半导体管芯的测试固定件，其装载构件在整个测试中保持平坦。 测试夹具包括加载构件和框架。 加载构件包括熔点高于其热平衡温度的基膜，其中由于通过粘合剂层从被测半导体模具到基底膜的热传递，实现了热平衡温度。 装载构件还包括由导电粘合剂材料制成的粘合剂层。 加载构件适用于将切割的LED管芯固定在适当位置并且在整个模头测试过程中保持平坦，从而确保了对模具的光学和电学性能的测试的准确性。