公开(公告)号：US07495805B1

公开(公告)日：2009-02-24

申请号：US09512378

申请日：2000-02-25

申请人： Oscar Chi-Lim Au ,  Ming Sun Fu

发明人： Oscar Chi-Lim Au ,  Ming Sun Fu

IPC分类号： G06K15/00 ,  G06T5/00 ,  H04N1/405 ,  H04N1/407 ,  H04N1/409

CPC分类号： H04N1/40075

摘要： A method is proposed for converting an image in which each pixel takes one of two binary values, into an image in which each pixel can take continuous values. The method is iterative and works in the space domain. For each pixel, a neighborhood of the image is defined containing that pixel and other pixels. In a first iteration, the method obtains a continuous value for each pixel as a weighted sum of the binary values of the pixels in its neighborhood. In further iterations, the method obtains a continuous value for each pixel as a weighted sum of the values of the pixels in its neighborhood at the previous iteration.

摘要翻译： 提出一种将每个像素取两个二进制值之一的图像转换成每个像素可以获得连续值的图像的方法。 该方法是迭代的，并且在空间域中起作用。 对于每个像素，定义图像的邻域包含该像素和其他像素。 在第一次迭代中，该方法获得每个像素的连续值作为其邻域中像素的二进制值的加权和。 在进一步迭代中，该方法获得每个像素的连续值，作为其前一次迭代中其邻域中的像素的值的加权和。

公开(公告)号：US07466014B2

公开(公告)日：2008-12-16

申请号：US11786045

申请日：2007-04-09

申请人： Ming Sun ,  Demei Gong

发明人： Ming Sun ,  Demei Gong

IPC分类号： H01L23/495

CPC分类号： H01L23/4951 ,  H01L23/3114 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/83851 ,  H01L2224/05599

摘要： A flip chip mounted semiconductor device package having a dimpled leadframe is disclosed. The semiconductor device package includes a leadframe having a plurality of source dimples and a gate dimple, and a semiconductor die having a plurality of source contact areas and a gate contact area corresponding to the leadframe source dimples and gate dimple respectively, the semiconductor die being flipped onto the leadframe such that cured conductive epoxy provides electrical and mechanical contact between the plurality of source contact areas and the plurality of source dimples, and the gate contact area and the gate dimple.

摘要翻译： 公开了一种具有凹陷引线框的倒装芯片安装的半导体器件封装。 半导体器件封装包括具有多个源极凹坑和栅极凹坑的引线框架，以及分别具有多个源极接触区域和对应于引线框源极凹坑和栅极凹坑的栅极接触区域的半导体管芯，半导体管芯被翻转 引导框架上，使得固化的导电环氧树脂在多个源极接触区域和多个源极凹坑以及栅极接触区域和栅极凹坑之间提供电和机械接触。

公开(公告)号：US20080299627A1

公开(公告)日：2008-12-04

申请号：US12122551

申请日：2008-05-16

申请人： Shih-Hsu Kang ,  Yi-Ming Sun ,  Chih-Ching Chien ,  Shih-Chen Tang ,  Chang-Chieh Chen

发明人： Shih-Hsu Kang ,  Yi-Ming Sun ,  Chih-Ching Chien ,  Shih-Chen Tang ,  Chang-Chieh Chen

IPC分类号： C12P7/62 ,  C07C69/66

CPC分类号： C12P7/625

摘要： The present invention relates to a method of producing polyhydroxyalkanoates (PHAs) using Bacillus sp. with succinate as a carbon source. The PHAs comprise more than 95% of poly(3-hydroxyvalerate-co-4-hydroxyvalerate) (P3HV-co-P4HV).

摘要翻译： 本发明涉及使用芽孢杆菌属（Bacillus sp。）生产聚羟基链烷酸酯（PHA）的方法。 以琥珀酸为碳源。 PHA包含95％以上的聚（3-羟基戊酸酯 - 共-4-羟基戊酸酯）（P3HV-co-P4HV）。

公开(公告)号：US20080247693A1

公开(公告)日：2008-10-09

申请号：US11696601

申请日：2007-04-04

申请人： Jonathan R. Schroeder ,  Ming Sun

发明人： Jonathan R. Schroeder ,  Ming Sun

IPC分类号： F16C33/02

CPC分类号： F16C33/08 ,  F16C33/107 ,  F16C33/201 ,  F16C2300/02 ,  Y10T29/49636

摘要： An improved sliding bearing apparatus and method utilize a snap-in polymer bearing insert having one or more identically shaped locking lugs, each of which are configured for locking engagement with a corresponding depression in a bearing housing, to thereby lock the bearing insert in place against relative movement either radially or axially with respect to the bearing housing. In a free-standing state, the insert may have a variety of shapes including cylindrical, non-cylindrical, or be flat and planar. An insert for a closed bearing is configured such that it may be trimmed to form an insert for an open bearing.

摘要翻译： 改进的滑动轴承装置和方法利用具有一个或多个相同形状的锁定凸耳的卡入式聚合物支承插入件，每个锁定凸耳被构造成与轴承壳体中的相应凹部锁定接合，从而将轴承插入件锁定在适当的位置，以抵抗 相对于轴承座径向或轴向相对运动。 在独立状态下，插入件可以具有各种形状，包括圆柱形，非圆柱形或扁平和平面。 用于封闭轴承的插入件构造成使得其可以被修整以形成用于开放轴承的插入件。

公开(公告)号：US20080233679A1

公开(公告)日：2008-09-25

申请号：US12154537

申请日：2008-05-22

申请人： Leeshawn Luo ,  Kai Liu ,  Ming Sun ,  Xiao Tian Zhang

发明人： Leeshawn Luo ,  Kai Liu ,  Ming Sun ,  Xiao Tian Zhang

IPC分类号： H01L21/58

CPC分类号： H01L21/568 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49524 ,  H01L24/40 ,  H01L24/73 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/37099 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor package and method for making a semiconductor package are disclosed. The semiconductor package has a top surface and a mounting surface and includes a die, a conducting connecting material, a plating material and an insulating material. The die has a processed surface facing towards the mounting surface of the semiconductor package. Exposed metal connections are at the processed surface of the die. The conducting connecting material is disposed on the exposed metal connections. The plating material is in contact with the conducting connecting material. The insulating material is formed around the conducting connecting material, and the plating material extends to the exterior of the insulating material.

摘要翻译： 公开了半导体封装和制造半导体封装的方法。 半导体封装具有顶表面和安装表面，并且包括管芯，导电连接材料，电镀材料和绝缘材料。 模具具有朝向半导体封装的安装表面的处理表面。 暴露的金属连接处于模具的加工表面。 导电连接材料设置在暴露的金属连接上。 电镀材料与导电连接材料接触。 绝缘材料围绕导电连接材料形成，电镀材料延伸到绝缘材料的外部。

公开(公告)号：US20080211070A1

公开(公告)日：2008-09-04

申请号：US11894240

申请日：2008-03-31

申请人： Ming Sun ,  Kai Liu ,  Xiao Tian Zhang ,  Yueh Se Ho ,  Leeshawn Luo

发明人： Ming Sun ,  Kai Liu ,  Xiao Tian Zhang ,  Yueh Se Ho ,  Leeshawn Luo

IPC分类号： H01L23/495

CPC分类号： H01L29/7813 ,  H01L24/33 ,  H01L29/045 ,  H01L29/4236 ,  H01L29/66734 ,  H01L29/7811 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： This invention discloses a power device package for containing, protecting and providing electrical contacts for a power transistor. The power device package includes a top and bottom lead frames for directly no-bump attaching to the power transistor. The power transistor is attached to the bottom lead frame as a flip-chip with a source contact and a gate contact directly no-bumping attaching to the bottom lead frame. The power transistor has a bottom drain contact attaching to the top lead frame. The top lead frame further includes an extension for providing a bottom drain electrode substantially on a same side with the bottom lead frame. In a preferred embodiment, the power device package further includes a joint layer between device metal of source, gate or drain and top or bottom lead frame, through applying ultrasonic energy. In another embodiment, a layer of conductive epoxy or adhesive, a solder paste, a carbon paste, or other types of attachment agents for direct no-bumping attaching the power transistor to one of the top and bottom lead frames.

摘要翻译： 本发明公开了一种功率器件封装，用于容纳，保护和提供功率晶体管的电触头。 功率器件封装包括用于直接不连接到功率晶体管的顶部和底部引线框架。 功率晶体管作为具有源极接触的倒装芯片附接到底部引线框架，并且栅极接触件直接地不连接到底部引线框架上。 功率晶体管具有附接到顶部引线框架的底部漏极接触。 顶部引线框架还包括用于提供与底部引线框架基本上在同一侧上的底部漏极电极的延伸部分。 在优选实施例中，功率器件封装还包括通过施加超声波能量的源极，栅极或漏极以及顶部或底部引线框架的器件金属之间的接合层。 在另一个实施方案中，导电环氧树脂或粘合剂层，焊膏，碳糊或其它类型的附着剂用于将功率晶体管附接到顶引线框架和底引线框架之一的直接无凸起。

公开(公告)号：US07412888B2

公开(公告)日：2008-08-19

申请号：US11591617

申请日：2006-11-02

申请人： Chia-Yi Chu ,  Heng-Chung Chang ,  Chuan-Wei Wang ,  Chih-Ming Sun ,  Wei-Leun Fang ,  Shiang-Cheng Lu ,  Hsieh-Shen Hsieh ,  Horng-Jou Wang ,  Tai-Kang Shing ,  Huang-Kun Chen

发明人： Chia-Yi Chu ,  Heng-Chung Chang ,  Chuan-Wei Wang ,  Chih-Ming Sun ,  Wei-Leun Fang ,  Shiang-Cheng Lu ,  Hsieh-Shen Hsieh ,  Horng-Jou Wang ,  Tai-Kang Shing ,  Huang-Kun Chen

IPC分类号： G01P15/125

CPC分类号： G01P15/125 ,  G01P2015/0814

摘要： An accelerometer includes a fixing unit and a movable unit. The fixing unit has a plurality of first electrode parts and a plurality of second electrode parts. The movable unit is connected with the fixing unit and includes a body having an opening, a plurality of third electrode parts and a plurality of fourth electrode parts. The third electrode parts are disposed at an outer side of the body with respect to the first electrode parts, respectively. The fourth electrode parts are disposed at the inner side of the body in the opening, and are disposed respectively with respect to the second electrode parts, respectively.

摘要翻译： 加速度计包括固定单元和可移动单元。 固定单元具有多个第一电极部分和多个第二电极部分。 可移动单元与固定单元连接，并且包括具有开口的主体，多个第三电极部分和多个第四电极部分。 第三电极部分分别相对于第一电极部分设置在主体的外侧。 第四电极部分设置在开口内的主体的内侧，分别相对于第二电极部分设置。

公开(公告)号：US20080184385A1

公开(公告)日：2008-07-31

申请号：US11904906

申请日：2007-09-28

申请人： Hon-Ming Lam ,  Samuel Sai Ming Sun ,  Gui Hua Shao

发明人： Hon-Ming Lam ,  Samuel Sai Ming Sun ,  Gui Hua Shao

IPC分类号： C12N15/29 ,  A01H5/00 ,  C07K14/00 ,  C12N15/82

CPC分类号： C12N15/8271 ,  C07K14/415 ,  C12N15/821 ,  C12N15/8273

摘要： Provided herein are the protein and nucleic acid sequences of GmRD22. Further provided herein are methods for conferring abiotic stress tolerance to a plant cell or plant by introducing and expressing an isolated polynucleotide encoding a GmRD22 protein in the cells of the plant. Transgenic plants transformed with an isolated polynucleotide encoding a GmRD22 protein, as well as seeds and progeny derived from these plants, are also provided.

摘要翻译： 本文提供了GmRD22的蛋白质和核酸序列。 本文还提供了通过在植物细胞中引入和表达编码GmRD22蛋白的分离的多核苷酸来赋予对植物细胞或植物的非生物胁迫耐受性的方法。 还提供了用编码GmRD22蛋白的分离的多核苷酸转化的转基因植物，以及来自这些植物的种子和后代。

公开(公告)号：US07378513B2

公开(公告)日：2008-05-27

申请号：US11189342

申请日：2005-07-26

申请人： Linda Shiou Mei Ooi ,  Samuel Sai Ming Sun ,  Vincent Eng Choon Ooi

发明人： Linda Shiou Mei Ooi ,  Samuel Sai Ming Sun ,  Vincent Eng Choon Ooi

IPC分类号： C07H21/00 ,  C12N5/04

CPC分类号： C07K14/415 ,  A23K20/147 ,  A23L33/185 ,  A61K38/00 ,  C07K1/36 ,  C07K14/42 ,  C12N15/8257

摘要： Disclosed is an isolated protein from the Chinese medicinal herb, Yuzhu, Polygonatum odoratum (Liliaceae). The protein disclosed is an effective agent showing potent antiviral activities while demonstrating antiproliferative effect on HL-60 leukemia and MCF-7 breast cancer cell lines in vitro. A method of obtaining the target protein and use thereof are also provided.

摘要翻译： 披露了一种中药，玉竹，茯苓（百合科）的分离蛋白质。 所公开的蛋白质是显示出有效的抗病毒活性的有效试剂，同时在体外表现出对HL-60白血病和MCF-7乳腺癌细胞系的抗增殖作用。 还提供了获得靶蛋白的方法及其用途。

公开(公告)号：US20080090190A1

公开(公告)日：2008-04-17

申请号：US11973216

申请日：2007-10-09

申请人： Hui-Ming Sun

发明人： Hui-Ming Sun

IPC分类号： F23Q3/00

CPC分类号： F23Q2/285 ,  F23Q2/164

摘要： A safety control switch comprises a slide base movably mounted on the housing of a gas-fired ignition device, a push button positioned in a through hole of the slide base, a brake block fixed to the push button for inserting into a space between the slide base and the housing, and a locking piece movably mounted on the slide base and engaged with the through hole of the slide base, the locking piece being moved relative to the slide base between a first position to prevent the push button and the slide base from being operated by blocking the through hole and a second position to allow the push button and the slide base to be operated by removing the blockage of the through hole.

摘要翻译： 安全控制开关包括可移动地安装在燃气点火装置的壳体上的滑动基座，位于滑动基座的通孔中的按钮，固定到按钮的制动块，用于插入到滑块 底座和壳体，以及可移动地安装在滑动基座上并与滑动基座的通孔接合的锁定片，锁定片在第一位置之间相对于滑动基座移动，以防止按钮和滑动基座从 通过阻塞通孔和第二位置来操作以允许按钮和滑动基座通过去除通孔的阻塞来操作。