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212 条记录 (耗时 0.025 秒)

    Fiber-management solution for an optical-network node
    122.
    发明授权
    Fiber-management solution for an optical-network node 有权

    公开(公告)号：US10281659B2

    公开(公告)日：2019-05-07

    申请号：US15711480

    申请日：2017-09-21

    申请人： Alcatel-Lucent Canada Inc.

    发明人： Colin G. Kelly

    IPC分类号： H04J14/02 ,  G02B6/38 ,  H04B10/80 ,  G02B6/35

    摘要： We disclose a modular fiber-interconnect device that can be used in a ROADM to optically interconnect wavelength-selective switches and optical add/drop blocks thereof. An example module of the modular fiber-interconnect device has seventeen optical ports, each implemented using an MPO connector of the same type. The number of (nominally identical) modules in the modular fiber-interconnect device depends on the degree N of the ROADM and can vary, e.g., from two for N=4 to fourteen or more for N≥20. A proper set of duplex optical connections within the ROADM can be created in a relatively straightforward manner, e.g., by running MPO cables of the same type from the wavelength-selective switches and the optical add/drop blocks of the ROADM to appropriate optical ports of the various modules of the modular fiber-interconnect device.

    Enhanced authentication for provision of mobile services
    124.
    发明授权
    Enhanced authentication for provision of mobile services 有权

    公开(公告)号：US10021563B2

    公开(公告)日：2018-07-10

    申请号：US14264923

    申请日：2014-04-29

    申请人： ALCATEL-LUCENT CANADA, INC.

    发明人： Ramaswamy Subramanian ,  Tiru K. Sheth

    IPC分类号： H04W12/06 ,  H04W12/08

    CPC分类号： H04W12/06 ,  H04W12/08

    摘要： Various exemplary embodiments relate to a method, network node, and non-transitory machine-readable storage medium including one or more of the following: instructions for obtaining, by a session establishment device, a subscriber record associated with a subscriber based on the session establishment device receiving a request message for establishment of a session with respect to a user device, wherein the request message includes a received subscriber identifier associated with the subscriber and a received equipment identifier associated with the user device, and wherein the subscriber record stores a stored subscriber identifier and a stored equipment identifier; instructions for comparing the received equipment identifier to the stored equipment identifier to determine whether the user equipment is associated with the subscriber in the subscriber record; and instructions for conditionally rejecting establishment of the session based on the determination of whether the user equipment is associated with the subscriber in the subscriber record.

    Minimizing network bandwidth for TDM CES
    125.
    发明授权
    Minimizing network bandwidth for TDM CES 有权

    公开(公告)号：US09929948B2

    公开(公告)日：2018-03-27

    申请号：US14501721

    申请日：2014-09-30

    申请人： ALCATEL-LUCENT CANADA INC.

    发明人： Kin Yee Wong ,  Chad V. Mccarthy

    IPC分类号： H04L12/721 ,  H04J3/06 ,  H04L12/825 ,  H04L12/841

    CPC分类号： H04L45/68 ,  H04J3/0632 ,  H04J3/14 ,  H04L47/25 ,  H04L47/283

    摘要： A method and system are provided for reducing bandwidth usage in TDM CES systems. When a transmitting router receives a signal indicating that the access circuit is other than “normal”, and that therefore any TDM data arriving over the access circuit is not valid, the router signals a receiving router at the far end of a TDM Pseudowire that no packets will be sent and does not send any packets. When the receiving router receives such a signal it starts generating its own packets for placing in its jitter buffer. In this way, the jitter buffer maintains its fill level even when no packets are being sent. When the transmitting router receives notification indicating that its access circuit has returned to normal the router signals the receiving router that status has returned to normal, and begins sending packets again.

    METHOD FOR HANDLING NETWORK PARTITION IN CLOUD COMPUTING
    126.
    发明申请
    METHOD FOR HANDLING NETWORK PARTITION IN CLOUD COMPUTING 审中-公开

    公开(公告)号：US20180048487A1

    公开(公告)日：2018-02-15

    申请号：US15237342

    申请日：2016-08-15

    申请人： ALCATEL-LUCENT CANADA INC.

    发明人： Qiuping Q. LI

    IPC分类号： H04L12/437 ,  H04L29/06 ,  H04L29/08

    CPC分类号： H04L12/437 ,  H04L41/0668

    摘要： Various embodiments relate to a method, an active management node and a standby management node configured to detect and recover from a network partition the method including determining whether the active management node sees the standby management node on less than all of the plurality of token rings, then restarting the standby management node, determining whether a first active management node with a lower node index sees a second active management node with a higher node index on one or more than one of the plurality of token rings, then restarting the second active management node with a higher node index and determining whether the second active management node with a higher node index sees the second active management node with a lower node index on one or more than one of the plurality of token rings, then restarting the active management node with a higher node index.

    HYBRID SEMICONDUCTOR LASERS
    128.
    发明申请
    HYBRID SEMICONDUCTOR LASERS 审中-公开

    公开(公告)号：US20170214216A1

    公开(公告)日：2017-07-27

    申请号：US14315970

    申请日：2014-06-26

    申请人： Alcatel Lucent USA, Inc. ,  ALCATEL-LUCENT CANADA, INC.

    发明人： Po Dong ,  Young-Kai Chen

    IPC分类号： H01S5/10 ,  H01S5/30 ,  H01S5/02

    CPC分类号： H01S5/026 ,  H01S3/0637 ,  H01S5/021 ,  H01S5/0215 ,  H01S5/1014 ,  H01S5/1032 ,  H01S5/3013

    摘要： Various exemplary embodiments relate to an apparatus including: a first substrate including a planar dielectric layer on a semiconducting layer, and a silicon layer located directly on a planar surface of the dielectric layer, adjacent first and second segments of the silicon layer being optically end-coupled, the first segment being thicker than the second segment; and a second substrate including a III-V semiconductor layer segment on a top surface thereof, the first and second substrates being bonded together such that the III-V semiconductor layer segment is in direct contact with a portion of the first segment of the silicon layer.