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    Method and system for patterning a mask layer
    112.
    发明授权
    Method and system for patterning a mask layer 有权
    图案化掩模层的方法和系统

    公开(公告)号：US08968985B2

    公开(公告)日：2015-03-03

    申请号：US11731689

    申请日：2007-03-30

    Applicant: Scott Jong Ho Limb ,  Eric J. Shrader ,  Uma Srinivasan

    Inventor： Scott Jong Ho Limb ,  Eric J. Shrader ,  Uma Srinivasan

    IPC: G03F7/20 ,  H05K3/00 ,  H05K3/28

    CPC classification number: G03F7/2018 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/28 ,  H05K2203/0551

    Abstract: The presently described embodiments use a printing process, e.g. a wax printing technique, to pattern a mask layer (such as a soldermask layer) of, for example, a printed circuit. Substantially all other conventional processes in developing soldermask and exposure processes can be maintained. According to the presently described embodiments, each printed circuit will have a unique pattern that matches uniform and non-uniform runout. In one form, the pattern is comprised of wax single drops having a specified gap to make the process transparent to the current industry practice. Furthermore, the single drops can be used for both large and small areas without any development time differences. In at least one form, the wax pattern and the soldermask in the gap are removed during development.

    Abstract translation: 目前描述的实施例使用打印过程，例如。 蜡印刷技术，用于对例如印刷电路的掩模层（例如焊接掩模层）进行图案化。 可以维持开发焊接掩模和曝光工艺中的所有其他常规工艺。 根据目前描述的实施例，每个印刷电路将具有匹配均匀和非均匀跳动的独特图案。 在一种形式中，图案由具有特定间隙的蜡单滴组成，以使得该过程对于当前行业实践是透明的。 此外，单滴可以用于大小区域，而没有任何显影时间差。 在至少一种形式中，间隙中的蜡图案和焊接掩模在显影期间被去除。

    Printable Laminates for Flexo Plates, Methods of Making, and Methods of Using
    115.
    发明申请
    Printable Laminates for Flexo Plates, Methods of Making, and Methods of Using 有权
    柔版印刷层压板，制作方法和使用方法

    公开(公告)号：US20140080042A1

    公开(公告)日：2014-03-20

    申请号：US14027760

    申请日：2013-09-16

    Applicant: John P. MANEIRA

    Inventor： John P. MANEIRA

    IPC: G03F1/50 ,  G03F7/20

    CPC classification number: G03F1/50 ,  G03F7/20 ,  G03F7/2018 ,  G03F7/2032

    Abstract: Negatives and laminates containing negatives for exposing liquid photopolymers in UV flexographic plate making are created by printing opaque images directly onto the protective or release cover films used in plate making processes. Combining negatives and cover films in this way eliminates two layers and two interfaces in the exposure process, reducing cost and improving quality.

    Abstract translation: 通过将不透明图像直接印刷在制版工艺中使用的保护性或释放覆盖膜上，可以产生含有用于在UV柔版印版制备中暴露液体光聚合物的负片的底片和层压片。 以这种方式组合底片和覆膜在曝光过程中消除了两层和两层界面，降低了成本，提高了质量。

    Resist for printing and patterning method using the same
    118.
    发明授权
    Resist for printing and patterning method using the same 有权
    抗印刷和图案化方法使用它

    公开(公告)号：US08007980B2

    公开(公告)日：2011-08-30

    申请号：US11790464

    申请日：2007-04-25

    Applicant: Jin Wuk Kim

    Inventor： Jin Wuk Kim

    IPC: G03F7/00 ,  G03F7/004 ,  G03F7/20

    CPC classification number: G03F7/2018 ,  G03F7/161

    Abstract: A resist for printing that is coated on a printing roll and is then sequentially transcribed on a printing plate and a substrate including: a material wherein a cohesive energy between the resist and the printing plate is larger than a cohesive energy between the resist and a blanket formed on the surface of printing roll, and wherein a cohesive energy between the resist and the substrate is larger than the cohesive energy between the resist and the blanket formed on the surface of printing roll.

    Abstract translation: 一种用于印刷的抗蚀剂，其被涂布在印刷辊上，然后在印刷板和基材上顺序地转录，包括：其中抗蚀剂和印刷版之间的内聚能量大于抗蚀剂和橡皮布之间的内聚能的材料 形成在印刷辊的表面上，并且其中抗蚀剂和基材之间的内聚能大于抗蚀剂和形成在印刷辊表面上的橡皮布之间的内聚能。

    Ink receptive photosensitive laminate
    119.
    发明授权
    Ink receptive photosensitive laminate 有权
    吸墨感光层压板

    公开(公告)号：US07964335B2

    公开(公告)日：2011-06-21

    申请号：US10060753

    申请日：2002-01-30

    Applicant: Toshifumi Komatsu ,  Kyle Johnson ,  William Charles Ulland

    Inventor： Toshifumi Komatsu ,  Kyle Johnson ,  William Charles Ulland

    IPC: G03F7/00 ,  G03F7/26 ,  G03F7/32

    CPC classification number: G03F7/2018

    Abstract: The present invention is directed to an ink receptive film and methods of using the ink receptive film. The ink receptive film is generally suitable for etching patterns into substrates, and typically includes a photosensitive laminate structure containing at least an ink receptive, radiation transmissive layer; and at least one photosensitive resist layer.

    Abstract translation: 本发明涉及一种油墨接受膜和使用该油墨接收膜的方法。 油墨接受膜通常适用于将图案刻蚀成衬底，并且通常包括至少含有可接受油墨的辐射透射层的感光层压结构; 和至少一个光敏抗蚀剂层。

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    120.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20100055605A1

    公开(公告)日：2010-03-04

    申请号：US12435002

    申请日：2009-05-04

    Applicant: Shang-Hoon SEO ,  Jae-Woo Joung ,  Kyoung-Jin Jeong ,  Kwan-Soo Yun

    Inventor： Shang-Hoon SEO ,  Jae-Woo Joung ,  Kyoung-Jin Jeong ,  Kwan-Soo Yun

    IPC: G03F7/004 ,  G03F7/20

    CPC classification number: H05K3/28 ,  G03F7/2018 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/1241 ,  H05K2201/0108 ,  H05K2203/0551

    Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing the printed circuit board in accordance with an embodiment of the present invention can include: forming an opaque conductive pattern on one side of a transparent insulation layer; forming a photosensitive insulation layer on the transparent insulation layer such that the conductive pattern is covered; hardening the photosensitive insulation layer excluding an area covering the conductive pattern by irradiating light on the other side of the transparent insulation layer; and forming an opening on the photosensitive insulation layer by removing the area of the photosensitive insulation layer covering the conductive pattern such that the conductive pattern is exposed.

    Abstract translation: 公开了印刷电路板和印刷电路板的制造方法。 根据本发明的实施例的制造印刷电路板的方法可以包括：在透明绝缘层的一侧上形成不透明导电图案; 在所述透明绝缘层上形成感光绝缘层，使得所述导电图案被覆盖; 通过在透明绝缘层的另一侧上照射光而使覆盖导电图案的区域除去感光绝缘层; 以及通过去除覆盖导电图案的感光绝缘层的面积使得导电图案露出而在感光绝缘层上形成开口。

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