PORTABLE ELECTRONIC DEVICES WITH INTEGRATED IMAGING CAPABILITIES
    103.
    发明申请
    PORTABLE ELECTRONIC DEVICES WITH INTEGRATED IMAGING CAPABILITIES 有权
    具有集成成像能力的便携式电子设备

    公开(公告)号:US20140300720A1

    公开(公告)日:2014-10-09

    申请号:US13856252

    申请日:2013-04-03

    IPC分类号: H04N5/30

    摘要: A portable electronic device (e.g., smart phone or tablet computer) is provided for generating and displaying images (e.g., 2-dimensional or 3-dimensional images) of an imaging target such as a human body. The portable electronic device may include imaging elements configured to receive radiation signals transmitted through and/or reflected by the imaging target, an imaging interface, and one or more processors. The portable electronic device may display what appears to be a window into the imaging target (e.g., a human body), and/or an exploded view (e.g., 3-dimensional, upwardly projected image) of the target. The generated image may be a real-time continuous image of the internal features of the target (e.g., a human body) that is updated to track movements of the target (e.g., breathing patterns) and the relative position of the portable electronic device as the portable electronic device moves relative to a surface of the target.

    摘要翻译: 提供便携式电子设备(例如,智能电话或平板计算机),用于生成和显示诸如人体的成像目标的图像(例如,2维或3维图像)。 便携式电子设备可以包括被配置为接收通过成像目标,成像接口和一个或多个处理器传输和/或反射的辐射信号的成像元件。 便携式电子设备可以将目标中显示的窗口显示在成像目标(例如,人体)和/或目标的分解视图(例如,三维,向上投影的图像)中。 生成的图像可以是目标(例如,人体)的内部特征的实时连续图像,其被更新以跟踪目标的移动(例如呼吸模式)和便携式电子设备的相对位置为 便携式电子设备相对于目标的表面移动。

    METHODS AND APPARATUSES FOR PACKAGING AN ULTRASOUND-ON-A-CHIP

    公开(公告)号:US20210296195A1

    公开(公告)日:2021-09-23

    申请号:US17191829

    申请日:2021-03-04

    摘要: Described herein are methods and apparatuses for packaging an ultrasound-on-a-chip. An ultrasound-on-a-chip may be coupled to a redistribution layer and to an interposer layer. Encapsulation may encapsulate the ultrasound-on-a-chip device and first metal pillars may extend through the encapsulation and electrically couple to the redistribution layer. Second metal pillars may extend through the interposer layer. The interposer layer may include aluminum nitride. The first metal pillars may be electrically coupled to the second metal pillars. A printed circuit board may be coupled to the interposer layer.