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101.
公开(公告)号:US09067779B1
公开(公告)日:2015-06-30
申请号:US14635197
申请日:2015-03-02
CPC分类号: G01N29/2406 , A61B8/4483 , B06B1/0292 , B81B7/007 , B81B2201/0271 , B81C1/00238 , B81C1/00301 , B81C2201/019 , B81C2203/036 , B81C2203/0792 , H01L2224/4813 , H01L2924/0002 , H01L2924/146 , H01L2924/1461
摘要: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
摘要翻译: 与互补金属氧化物半导体(CMOS)基板集成的微加工超声换能器以及制造这种装置的方法进行了描述。 制造可能涉及两个单独的晶片结合步骤。 可以使用晶片结合来制造衬底中的密封空腔。 晶片接合也可用于将衬底粘合到另一衬底,例如CMOS晶片。 至少第二晶片接合可以在低温下进行。
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公开(公告)号:US09033884B2
公开(公告)日:2015-05-19
申请号:US14191496
申请日:2014-02-27
CPC分类号: G01S7/52017 , A61B5/015 , A61B8/08 , A61B8/13 , A61B8/4209 , A61B8/4245 , A61B8/4254 , A61B8/4263 , A61B8/4477 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/56 , A61B8/565 , A61B17/320068 , A61B2090/378 , A61B2562/164 , A61N7/00 , A61N7/02 , A61N2007/0078 , G01S7/52019 , G01S7/52023
摘要: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
摘要翻译: 描述了包括超声成像装置的装置和方法,其可以在透射超声成像模式中操作,并且其可以用于检测对象的感兴趣的属性,例如折射率,密度和/或声速。 还描述了适用于执行高强度聚焦超声(HIFU)的设备,以及HIFU和超声成像。
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103.
公开(公告)号:US20140300720A1
公开(公告)日:2014-10-09
申请号:US13856252
申请日:2013-04-03
IPC分类号: H04N5/30
CPC分类号: G06T7/0012 , A61B8/4411 , A61B8/4427 , A61B8/4455 , A61B8/4477 , A61B8/4494 , A61B8/483 , G01S15/899 , G06T7/40 , G06T7/60 , G06T7/90 , G06T19/006 , G06T2207/10136 , G06T2207/30008 , G06T2207/30101 , G06T2219/016 , H04N5/30
摘要: A portable electronic device (e.g., smart phone or tablet computer) is provided for generating and displaying images (e.g., 2-dimensional or 3-dimensional images) of an imaging target such as a human body. The portable electronic device may include imaging elements configured to receive radiation signals transmitted through and/or reflected by the imaging target, an imaging interface, and one or more processors. The portable electronic device may display what appears to be a window into the imaging target (e.g., a human body), and/or an exploded view (e.g., 3-dimensional, upwardly projected image) of the target. The generated image may be a real-time continuous image of the internal features of the target (e.g., a human body) that is updated to track movements of the target (e.g., breathing patterns) and the relative position of the portable electronic device as the portable electronic device moves relative to a surface of the target.
摘要翻译: 提供便携式电子设备(例如,智能电话或平板计算机),用于生成和显示诸如人体的成像目标的图像(例如,2维或3维图像)。 便携式电子设备可以包括被配置为接收通过成像目标,成像接口和一个或多个处理器传输和/或反射的辐射信号的成像元件。 便携式电子设备可以将目标中显示的窗口显示在成像目标(例如,人体)和/或目标的分解视图(例如,三维,向上投影的图像)中。 生成的图像可以是目标(例如,人体)的内部特征的实时连续图像,其被更新以跟踪目标的移动(例如呼吸模式)和便携式电子设备的相对位置为 便携式电子设备相对于目标的表面移动。
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公开(公告)号:US20140217478A1
公开(公告)日:2014-08-07
申请号:US14172383
申请日:2014-02-04
发明人: Jonathan M. Rothberg , Kieth G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
CPC分类号: B06B1/0292 , B06B1/02 , B81B3/0021 , B81B2203/0127 , B81B2203/0315 , B81B2207/015 , B81C1/00158 , B81C2201/013 , B81C2203/0118 , B81C2203/0735 , B81C2203/0771 , G10K9/12 , G10K11/18
摘要: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
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公开(公告)号:US20140180112A1
公开(公告)日:2014-06-26
申请号:US14191496
申请日:2014-02-27
IPC分类号: A61B8/00
CPC分类号: G01S7/52017 , A61B5/015 , A61B8/08 , A61B8/13 , A61B8/4209 , A61B8/4245 , A61B8/4254 , A61B8/4263 , A61B8/4477 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/56 , A61B8/565 , A61B17/320068 , A61B2090/378 , A61B2562/164 , A61N7/00 , A61N7/02 , A61N2007/0078 , G01S7/52019 , G01S7/52023
摘要: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
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公开(公告)号:US20140180099A1
公开(公告)日:2014-06-26
申请号:US14191573
申请日:2014-02-27
CPC分类号: G01S7/52017 , A61B5/015 , A61B8/08 , A61B8/13 , A61B8/4209 , A61B8/4245 , A61B8/4254 , A61B8/4263 , A61B8/4477 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/56 , A61B8/565 , A61B17/320068 , A61B2090/378 , A61B2562/164 , A61N7/00 , A61N7/02 , A61N2007/0078 , G01S7/52019 , G01S7/52023
摘要: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
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公开(公告)号:US20140180096A1
公开(公告)日:2014-06-26
申请号:US14191596
申请日:2014-02-27
CPC分类号: A61B5/015 , A61B8/08 , A61B8/13 , A61B8/4209 , A61B8/4245 , A61B8/4254 , A61B8/4263 , A61B8/4477 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/56 , A61B8/565 , A61B2017/320069 , A61B2090/378 , A61B2562/164 , A61N7/00 , A61N7/02 , A61N2007/0078
摘要: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
摘要翻译: 描述了包括超声成像装置的装置和方法,其可以在透射超声成像模式中操作,并且其可以用于检测对象的感兴趣的属性,例如折射率,密度和/或声速。 还描述了适用于执行高强度聚焦超声(HIFU)的设备,以及HIFU和超声成像。
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公开(公告)号:US20140180094A1
公开(公告)日:2014-06-26
申请号:US14191558
申请日:2014-02-27
IPC分类号: A61B8/08
CPC分类号: G01S7/52017 , A61B5/015 , A61B8/08 , A61B8/13 , A61B8/4209 , A61B8/4245 , A61B8/4254 , A61B8/4263 , A61B8/4477 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/56 , A61B8/565 , A61B17/320068 , A61B2090/378 , A61B2562/164 , A61N7/00 , A61N7/02 , A61N2007/0078 , G01S7/52019 , G01S7/52023
摘要: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
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公开(公告)号:US11137486B2
公开(公告)日:2021-10-05
申请号:US15517211
申请日:2015-10-07
摘要: Programmable ultrasound probes and methods of operation are described. The ultrasound probe may include memory storing parameter data and may also include a parameter loader which loads the parameter data into programmable circuitry of the ultrasound probe. In some instances, the ultrasound probe may include circuitry grouped into modules which may be repeatable and which may be coupled together to allow data to be exchanged between the modules.
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公开(公告)号:US20210296195A1
公开(公告)日:2021-09-23
申请号:US17191829
申请日:2021-03-04
发明人: Jianwei Liu , Keith G. Fife
IPC分类号: H01L23/31 , H01L23/498 , H01L21/56 , H01L23/00 , A61B8/00
摘要: Described herein are methods and apparatuses for packaging an ultrasound-on-a-chip. An ultrasound-on-a-chip may be coupled to a redistribution layer and to an interposer layer. Encapsulation may encapsulate the ultrasound-on-a-chip device and first metal pillars may extend through the encapsulation and electrically couple to the redistribution layer. Second metal pillars may extend through the interposer layer. The interposer layer may include aluminum nitride. The first metal pillars may be electrically coupled to the second metal pillars. A printed circuit board may be coupled to the interposer layer.
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