摘要:
A transparent panel including a plurality of microholes, which has improved shock resistance by distributing external shocks and allows distortion-free audio data to pass through the same while preventing or substantially preventing infiltration of foreign materials, a method for manufacturing the same, and a mobile device using the same. A transparent panel including a panel having a thickness and a plurality of microholes formed at a side of the panel, a diameter of each of the microholes being 50 to 500 μm.
摘要:
Composite forming screens comprise a layer of hard rubber with a Shore D hardness of 12-90, preferably 33-90 and most preferably 46-60 and in preferred embodiments, comprise a support layer of plastic or metal bonded to the hard rubber to form a composite. The forming screens may be planar or cylindrical and are provided with a plurality of apertures or through holes and a pattern of fine scale structures. Methods of making the forming screens are also disclosed.
摘要:
A cushion sheet including a cushion film defining a first surface of the cushion sheet; and an adhesive layer on a surface of the cushion film and defining a second surface of the cushion sheet, the cushion film and adhesive layer including a plurality of bubble discharge members inclined with respect to the first and second surfaces and openings extending through the cushion film and the adhesive layer for removing bubbles generated at adhesion, the openings having a first end in the adhesive layer and a second end in the cushion film; and each of the bubble discharge members are inclined at a penetrating angle within the cushion sheet between a respective one of the bubble discharge members and a line perpendicular to a plane of the cushion sheet, the line extending from the first end of the bubble discharge member to the first surface of the cushion sheet.
摘要:
Composite elements have the following layer structure: (i) from 2 to 20 mm of metal, (ii) from 10 to 300 mm of plastic, and (iii) from 2 to 20 mm of metal, where (i) and/or (iii) have an opening which may, if desired, be sealable.
摘要:
An uncured acoustic absorbing member for cavity sealing comprises a thermally inert carrier (8, 28) and a thermally expandable material (6, 26) applied to the carrier (8, 28). The carrier (8, 28) contains openings (3) which become covered when the thermally expandable material (6, 26) is expanded to seal the cavity. The thermally expandable material (6, 26) may be in the form of substantially discontinuous segments (25) having an area in the range of 0.25 to 400 mm2. The substantially discontinuous segments (25) provide a highly uniform expansion of the material when it is thermally expanded. The acoustic absorbing members are particularly useful for sealing automotive cavities to provide acoustical abatement and to prevent the entry of fluids into the cavity.
摘要:
A removable fastener insulating device comprising a heat resistant cover configured for insulating a fastener. The heat resistant cover may comprise a first portion with a hole formed therein for the fastener to be inserted through and a second portion with a cavity formed therein. The cavity may be lined with an insulating portion made of material resistant to heat transfer. In use, a portion of the fastener may be inserted into the hole of the heat resistant cover and the second portion may be actuated into the closed position. In the closed position, an end portion of the fastener may reside within the cavity between the first portion and the second portion. The heat resistant cover may also comprise attachment elements for holding the second portion in the closed position against the first portion.
摘要:
The present invention relates to a solder resist composition including: 1 to 10 parts by weight of a triazene curing agent; 1 to 10 parts by weight of a curing accelerator; and 10 to 50 parts by weight of a diluent, with respect to 100 parts by weight of an epoxy base, a board for a package comprising a solder resist opening using the same, and a method for preparing the board for a package.According to the present invention, it is possible to form a small solder resist opening of less than about 50 μm through laser ablation and improve laser processability of the thermosetting solder resist composition.
摘要:
A heat insulator that generates no smoke when incinerated, has a low calorific value, and achieves a desired dimension and heat insulation performance is provided. A heat insulator 1 is formed by heat-mixing, in an extruder 11, a paper pellet 7 that is a mixture of a fine paper powder having a particle diameter of 30 to 200 μm and starch, a container recycle pellet 8 that is a mixture of polypropylene, polyethylene, and polystyrene, foamable polypropylene 9, and water 10 to obtain a plate-like foamed product 2, and orthogonally overlaying a plurality of plate-like foamed products 2. A weight distribution is set so that the paper pellet 7 is 50 to 65% by weight, the container recycle pellet 8 is 13 to 25% by weight, the foamable polypropylene 9 is 10 to 30% by weight, and the water 10 is 10 to 20% by weight to these resins and other materials.
摘要:
A composite structure comprises stacked sets of laminated fiber reinforced resin plies and metal sheets. Edges of the resin plies and metal sheets are interleaved to form a composite-to-metal joint connecting the resin plies with the metal sheets.
摘要:
A label for a product rolled about a core has an outer profile configured to extend beyond an outer diameter of the core, a front surface having alignment indicia configured to align the label with respect to an inner diameter of the core, and a rear surface having adhesive thereon and being contactable with an inner surface of the core. The outer profile defines a tabular segment and an arcuate portion, the tabular segment being formable and bendable about the inner diameter of the core and adherable to an inner surface of the core, the tabular segment having a first portion and a second portion, the arcuate portion being configured to extend beyond the outer diameter of the core. Reference indicia is disposed on the first portion of the tabular segment inboard of the alignment indicia such that the second portion of the tabular segment is absent the reference indicia.