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公开(公告)号：US20080273336A1
公开(公告)日：2008-11-06
申请号：US11797110
申请日：2007-05-01
申请人： Hua-Hsin Tsai
发明人： Hua-Hsin Tsai
CPC分类号： F21K9/64 , F21Y2103/10 , F21Y2115/10 , H01L25/075 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode includes a base board, at least one light emitting diodes fitted on an upper side of the base board, and a light shade made of either of glass and quartz, which is secured over said at least one light emitting diodes on the base board; the light shade has a fluorescent powder layer on a top thereof for changing color of light; the light shade has a reflecting layer on lateral wall portions thereof for reflecting light produced by the light emitting diodes such that light gathers at the top of the light shade to be brighter; furthermore, in manufacturing, the lateral wall portions of the light shade are soaked in and etched with hydrofluoric acid so as to have irregular depressions and lumps on the surfaces to enhance reflectivity of the reflecting layer.
摘要翻译： 发光二极管包括基板，安装在基板的上侧上的至少一个发光二极管和由玻璃和石英中的任一个制成的遮光件，其固定在所述至少一个发光二极管上 基板 光阴在其顶部具有荧光粉层，用于改变光的颜色; 光遮蔽件在其侧壁部分上具有反射层，用于反射由发光二极管产生的光，使得光在光阴的顶部聚集得更亮; 此外，在制造中，将光阴的侧壁部浸渍在氢氟酸中并用氢氟酸蚀刻，以便在表面上具有不规则的凹陷和块状以增强反射层的反射率。
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公开(公告)号：US20240222285A1
公开(公告)日：2024-07-04
申请号：US18405806
申请日：2024-01-05
发明人： Sang Youl LEE , Ki Man KANG , Eun Dk LEE
IPC分类号： H01L23/538 , H01L25/075 , H01L33/62
CPC分类号： H01L23/5386 , H01L25/075 , H01L33/62
摘要： A semiconductor device package includes a substrate; and a plurality of semiconductor structures disposed to be spaced apart from each other at a central portion of the substrate. Further, the semiconductor structure is disposed on the substrate and includes a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer disposed on the first conductivity-type semiconductor layer, and an active layer disposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer. The semiconductor device package also includes a plurality of first interconnection lines disposed between the substrate and the plurality of semiconductor structures and electrically connected to the first conductivity-type semiconductor layer; and a plurality of second interconnection lines disposed between the substrate and the plurality of semiconductor structures and electrically connected to the second conductivity-type semiconductor layer.
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公开(公告)号：US11894307B2
公开(公告)日：2024-02-06
申请号：US16979734
申请日：2019-04-05
发明人： Sang Youl Lee , Ki Man Kang , Eun Dk Lee
IPC分类号： H01L23/538 , H01L25/075 , H01L33/62
CPC分类号： H01L23/5386 , H01L25/075 , H01L33/62
摘要： Disclosed in an embodiment is a semiconductor device package comprising a substrate and a plurality of semiconductor structures arranged to be spaced apart at the center of the substrate, wherein the semiconductor structure is arranged on the substrate and includes a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer arranged between the first conductive type semiconductor layer and the second conductive type semiconductor layer, and the ratio of the maximum height of the outermost surface of the first conductive type semiconductor layer to the length of the spacing distance between the adjacent semiconductor structures is 1:3 to 1:60.
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公开(公告)号：US20230411360A1
公开(公告)日：2023-12-21
申请号：US18337336
申请日：2023-06-19
申请人： NICHIA CORPORATION
发明人： Soichiro MIURA
CPC分类号： H01L25/075 , H01L33/502 , H01L33/10 , H01L33/62 , H01L33/56 , H01L33/483
摘要： A light-emitting device includes, a base member having a placement surface, a light-emitting element disposed on the placement surface and configured to emit light from an emitting end surface, and a wavelength conversion member disposed on the placement surface along a direction in which the light emitted from the light-emitting element travels. The wavelength conversion member includes a wiring region that is a part of a current path electrically connected to the light-emitting element.
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公开(公告)号：US20230352454A1
公开(公告)日：2023-11-02
申请号：US18330495
申请日：2023-06-07
申请人： AGC Inc.
发明人： Yohei NAGAO , Takenori SOMEYA
IPC分类号： H01L33/44 , H01L33/48 , H01L25/075 , H01L33/00 , H01L33/58
CPC分类号： H01L25/075 , H01L33/0083 , H01L33/44 , H01L33/486 , H01L33/58
摘要： A bonded body includes a first base material; a second base material; an inorganic film for bonding the first base material and the second base material; and a semiconductor layer formed on a surface opposite to a bonding surface of the second base material, the bonding surface of the second base material facing the first base material, wherein the first base material is a glass with a SiO2 content of 70 mol% or less, and the inorganic film includes a silicon oxide film formed on a bonding surface of the first base material, the bonding surface of the first base material facing the second base material.
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公开(公告)号：US20190237452A1
公开(公告)日：2019-08-01
申请号：US16383680
申请日：2019-04-15
申请人： Innolux Corporation
发明人： Shu-Ming Kuo , Chih-Yung Hsieh , Kuan-Feng Lee
CPC分类号： H01L25/167 , H01L25/075 , H01L25/0753 , H01L25/0756 , H01L25/13 , H01L25/16 , H01L25/18 , H01L33/48 , H01L33/50 , H01L33/502 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2933/0083 , H01L2933/0091
摘要： The embodiment provides a display device including an array substrate, an opposite substrate, a plurality of micro light-emitting diodes and a plurality of bank structures. The opposite substrate is disposed opposite to the array substrate. The micro light-emitting diodes are arranged in an array on the array substrate, wherein the micro light-emitting diodes are electrically connected to the array substrate. The bank structures are located between the array substrate and the opposite substrate, wherein the bank structures form a plurality of accommodating regions, and one of the micro light-emitting diodes is located in one of the accommodating regions. A height of the bank structures is more than or equal to a height of the micro light-emitting diodes.
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公开(公告)号：US20180323239A1
公开(公告)日：2018-11-08
申请号：US15670120
申请日：2017-08-07
申请人： InnoLux Corporation
发明人： Kuan-Feng LEE , Yuan-Lin WU , Yu-Hsien WU
CPC分类号： H01L27/323 , G06F3/0412 , G06F3/0416 , G06F3/044 , H01L25/075 , H05K1/189
摘要： A display device is provided. The display device includes a substrate having a first edge and a second edge opposite to the first edge. There is a first distance between the first edge and the second edge. The display device also includes a plurality of light-emitting units disposed on the substrate, and a conductive line disposed on the substrate and electrically connected to at least one of the plurality of light-emitting units. The conductive line includes an undulating edge and has an extending length which is greater than or equal to half of the first distance and is less than or equal to the first distance.
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公开(公告)号：US09947835B2
公开(公告)日：2018-04-17
申请号：US15319633
申请日：2015-06-15
申请人： LG INNOTEK CO., LTD.
发明人： Jae Won Seo , Seok Beom Choi
IPC分类号： H01L29/18 , H01L33/46 , H01L27/15 , H01L33/06 , H01L33/32 , H01L33/30 , H01L33/40 , H01L33/42 , H01L33/62 , F21V8/00 , F21K9/232 , F21Y115/10
CPC分类号： H01L33/46 , F21K9/232 , F21Y2115/10 , G02B6/0073 , H01L25/075 , H01L27/153 , H01L27/156 , H01L33/06 , H01L33/30 , H01L33/32 , H01L33/382 , H01L33/405 , H01L33/42 , H01L33/44 , H01L33/62
摘要： A light emitting device includes a substrate; a plurality of light emitting cells disposed on the substrate to be spaced apart from one another, the light emitting cell having a via hole passing through the second conductive type semiconductor layer, the active layer and a part of the first conductive type semiconductor layer; a first electrode layer electrically connected to the first conductive type semiconductor layer at a bottom of the via hole; a second electrode layer disposed on the second conductive type semiconductor layer; and a first passivation layer, electrically separating the first electrode layer from the second electrode layer, wherein the first electrode layer of one light emitting cell is electrically connected to the second electrode layer of another light emitting cell adjacent to the one light emitting cell.
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公开(公告)号：US20180090469A1
公开(公告)日：2018-03-29
申请号：US15710605
申请日：2017-09-20
发明人： Akihiko HANYA
IPC分类号： H01L25/075 , H01L33/62 , H01L25/00
CPC分类号： H01L25/075 , H01L24/16 , H01L24/81 , H01L25/0756 , H01L25/50 , H01L33/62 , H01L2224/16225 , H01L2933/0066
摘要： A light-emitting device having a plurality of light-emitting elements closely adjacently disposed in spite of using only one substrate is provided.One or more light-emitting elements are flip-chip mounted on each of upper surface and lower surface of a substrate. The light-emitting elements are disposed so that the light-emitting elements on the upper surface of the substrate and the light-emitting elements on the lower surface of the substrate are closely adjacent to each other when they are seen from above the substrate. The light-emitting elements mounted on the upper surface of the substrate have light-emitting surfaces as the upper surfaces, and the light-emitting elements mounted on the lower surfaces of the substrate have light-emitting surfaces on the substrate side. The substrate transmits at least lights emitted by the light-emitting elements mounted on the lower surface of the substrate.
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公开(公告)号：US09930750B2
公开(公告)日：2018-03-27
申请号：US14830032
申请日：2015-08-19
申请人： LUMENS CO., LTD.
发明人： Seung Hyun Oh , Seung Hoon Lee , Sung Yole Yun , Jung A Lim , Sung Sik Jo , In Soo Kim , Tae Kyung Yoo
摘要： A method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.
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