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公开(公告)号：USRE48474E1
公开(公告)日：2021-03-16
申请号：US16168198
申请日：2018-10-23
申请人： LUMENS CO., LTD.
发明人： Seung Hyun Oh , Pyoung Gug Kim , Seung Hoon Lee , Chun Ki Min , Jung A Lim , Jun Hyung Lim , Cheol Hun Jung , Bo Hyun Chung
摘要： Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.
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公开(公告)号：US09930750B2
公开(公告)日：2018-03-27
申请号：US14830032
申请日：2015-08-19
申请人： LUMENS CO., LTD.
发明人： Seung Hyun Oh , Seung Hoon Lee , Sung Yole Yun , Jung A Lim , Sung Sik Jo , In Soo Kim , Tae Kyung Yoo
摘要： A method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.
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3.发明授权公开(公告)号：US09142747B2
公开(公告)日：2015-09-22
申请号：US14358994
申请日：2012-11-16
申请人： LUMENS CO., LTD.
发明人： Seung Hyun Oh , Pyoung Gug Kim , Seung Hoon Lee , Chun Ki Min , Jung A Lim , Jun Hyung Lim , Cheol Hun Jung , Bo Hyun Chung
CPC分类号： H01L33/62 , G02B6/0031 , G02B6/0073 , G02B6/0085 , G02F1/133615 , G02F2001/133614 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.
摘要翻译： 公开了具有优异的散热性能和高亮度的发光元件封装，以及包括该发光元件封装的背光单元。 发光元件封装包括包括引线框架，设置在引线框架上的发光元件和与引线框架组合的模制材料并具有用于发射由发光元件产生的光的开口的封装以及反射结构 具有对应于模制材料的开口的开口，并使模制材料接触。
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公开(公告)号：US20140328083A1
公开(公告)日：2014-11-06
申请号：US14358994
申请日：2012-11-16
申请人： LUMENS CO., LTD.
发明人： Seung Hyun Oh , Pyoung Gug Kim , Seung Hoon Lee , Chun Ki Min , Jung A Lim , Jun Hyung Lim , Cheol Hun Jung , Bo Hyun Chung
CPC分类号： H01L33/62 , G02B6/0031 , G02B6/0073 , G02B6/0085 , G02F1/133615 , G02F2001/133614 , H01L33/486 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.
摘要翻译： 公开了具有优异的散热性能和高亮度的发光元件封装，以及包括该发光元件封装的背光单元。 发光元件封装包括包括引线框架，设置在引线框架上的发光元件和与引线框架组合的模制材料并具有用于发射由发光元件产生的光的开口的封装以及反射结构 具有对应于模制材料的开口的开口，并使模制材料接触。
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公开(公告)号：US09690030B2
公开(公告)日：2017-06-27
申请号：US14650119
申请日：2013-11-29
申请人： LUMENS CO., LTD.
发明人： Seung Hyun Oh , Pyoung Gug Kim , Seung Hoon Lee
CPC分类号： G02B6/003 , G02B6/0031 , G02B6/0073 , G02B6/009 , G02B6/4206 , G02B7/022 , G02B7/025 , G02B19/0061
摘要： A light emitting device capable of bonding a lens at a preset accurate position, and a backlight unit comprising the same are provided. The light emitting device includes a molded material having an opening through which light generated from a light emitting element disposed in the molded material is emitted, a projecting support disposed along at least part of a circumference of the opening of the molded material, and a lens having an inner surface that defines an internal surface on which light emitted from the light emitting element is incident, an outer surface that defines an external surface from which the incident light is emitted to the outside, and a bottom surface that connects the inner surface and the outer surface, wherein a boundary between the inner surface and the bottom surface, a lower part of the inner surface, or the bottom surface contacts the projecting support.
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公开(公告)号：US10667345B2
公开(公告)日：2020-05-26
申请号：US15896706
申请日：2018-02-14
申请人： LUMENS CO., LTD.
发明人： Seung Hyun Oh , Seung Hoon Lee , Sung Yole Yun , Jung A Lim , Sung Sik Jo , In Soo Kim , Tae Kyung Yoo
摘要： Disclosed is a method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.
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公开(公告)号：USRE47444E1
公开(公告)日：2019-06-18
申请号：US15147351
申请日：2016-05-05
申请人： LUMENS CO., LTD.
发明人： Seung Hyun Oh , Pyoung Gug Kim , Seung Hoon Lee , Chun Ki Min , Jung A Lim , Jun Hyung Lim , Cheol Hun Jung , Bo Hyun Chung
摘要： Disclosed is a light emitting element package having excellent heat radiation performance and high luminance, and a backlight unit including the same. The light emitting element package includes a package including a lead frame, a light emitting element provided on the lead frame, and a molded material combined with the lead frame and having an opening for emitting light generated by the light emitting element, and a reflection structure having an opening corresponding to the opening of the molded material, and contacting the molded material.
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