公开(公告)号：US20050156279A1

公开(公告)日：2005-07-21

申请号：US11059469

申请日：2005-02-16

申请人： Takeshi Shioga ,  Kazuaki Karasawa ,  Kazuaki Kurihara

发明人： Takeshi Shioga ,  Kazuaki Karasawa ,  Kazuaki Kurihara

IPC分类号： H01L21/02 ,  H01L21/768 ,  H01L23/498 ,  H01L23/50 ,  H01L23/522 ,  H01L23/64 ,  H01L27/08 ,  H01L29/00 ,  H01L21/338

CPC分类号： H01L27/0805 ,  H01L21/76885 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5223 ,  H01L23/642 ,  H01L24/05 ,  H01L24/06 ,  H01L24/94 ,  H01L24/97 ,  H01L25/16 ,  H01L28/55 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/06051 ,  H01L2224/14051 ,  H01L2224/14181 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/32265 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/3011 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/1403

摘要： A capacitor comprises a first conducting film 12 formed on a substrate 10, a first dielectric film 14 formed on the first conducting film, a second conducting film 18 formed on the first dielectric film, a second dielectric film 22 formed above the second conducting film, covering the edge of the second conducting film, a third conducting film 34 formed above the second dielectric film, covering a part of the second dielectric film covering the edge of the second conducting film. The capacitor further comprises an insulation film 28 covering the edge of the second conducing film or the part of the second dielectric film. An effective thickness of the insulation film between the second conducting film and the third conducing film in the region near the edge of the second conducting film can be increased, whereby concentration of electric fields in the region near the edge of the second conducting film. Consequently, the capacitor can have large capacitance without lowering voltage resistance.

摘要翻译： 电容器包括形成在基板10上的第一导电膜12，形成在第一导电膜上的第一电介质膜14，形成在第一电介质膜上的第二导电膜18，形成在第二导电膜上方的第二电介质膜22， 覆盖第二导电膜的边缘，形成在第二电介质膜上方的第三导电膜34，覆盖覆盖第二导电膜边缘的第二电介质膜的一部分。 电容器还包括覆盖第二导电膜的边缘或第二电介质膜的一部分的绝缘膜28。 在第二导电膜的边缘附近的区域内的第二导电膜和第三导电膜之间的绝缘膜的有效厚度可以增加，由此在第二导电膜的边缘附近的区域中的电场浓度。 因此，电容器可以具有大的电容而不降低电阻。

公开(公告)号：US20050135041A1

公开(公告)日：2005-06-23

申请号：US10744194

申请日：2003-12-22

申请人： Jung Kang ,  Kaladhar Radhakrishnan ,  Shamala Chikamenahalli

发明人： Jung Kang ,  Kaladhar Radhakrishnan ,  Shamala Chikamenahalli

IPC分类号： H01L23/522 ,  H01L23/66 ,  H01L25/065 ,  H01L25/16 ,  H01G4/30

CPC分类号： H01L25/0657 ,  H01L23/522 ,  H01L23/66 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/04042 ,  H01L2224/16265 ,  H01L2224/32225 ,  H01L2224/32265 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

摘要： An embodiment of the present invention is a technique to integrate passive components in a die assembly. A capacitor, inductor, or resistor is integrated on a spacer between upper and lower dies in stacked dies. Conductors are attached to the capacitor, inductor or resistor to connect the capacitor, inductor, or resistor to at least one of the upper and lower dies.

摘要翻译： 本发明的一个实施例是一种在模具组件中集成无源部件的技术。 电容器，电感器或电阻器集成在堆叠模具中的上模和下模之间的间隔件上。 导体连接到电容器，电感器或电阻器，以将电容器，电感器或电阻器连接到上模具和下模具中的至少一个。