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公开(公告)号：US20180057390A1
公开(公告)日：2018-03-01
申请号：US15560390
申请日：2016-03-23
Applicant: Corning Incorporated
Inventor： Thomas Hackert , Xinghua Li , Sasha Marjanovic , Moussa N'Gom , David Andrew Pastel , Garrett Andrew Piech , Daniel Schnitzler , Robert Stephen Wagner , James Joseph Watkins
IPC: C03B33/02 , B23K26/364 , C03C3/093
CPC classification number: C03B33/0222 , B23K26/364 , B23K26/53 , B23K2103/54 , C03B33/0215 , C03C3/093 , Y02P40/57
Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (
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公开(公告)号：US20170335466A1
公开(公告)日：2017-11-23
申请号：US15672599
申请日：2017-08-09
Applicant: CORNING INCORPORATED
Inventor： Jeffrey John Domey , John Tyler Keech , Xinghua Li , Garrett Andrew Piech , Arie Bruce Shorey , Paul John Shustack , John Christopher Thomas
IPC: C23F4/04 , C03B33/10 , C03B33/02 , B23K26/386 , B23K26/18 , B23K26/0622 , B23K26/382 , H05K3/00 , B23K26/40 , B23K103/00
CPC classification number: C23F4/04 , B23K26/0622 , B23K26/18 , B23K26/386 , B23K26/389 , B23K26/40 , B23K2103/50 , B23K2103/54 , C03B33/0222 , C03B33/102 , H05K3/0026 , Y10T428/24322
Abstract: A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.
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公开(公告)号：US09815730B2
公开(公告)日：2017-11-14
申请号：US14530379
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
IPC: C03B33/09 , C03B33/02 , C03B33/08 , C03B33/10 , C03B23/02 , C03B33/033 , C03B23/023 , C03B23/025 , B23K26/00 , B23K26/402 , B23K26/0622 , B23K26/53 , B23K26/08 , C03B33/023 , C03B33/04 , B23K103/16 , B23K103/00
CPC classification number: C03B33/091 , B23K26/0622 , B23K26/0624 , B23K26/0884 , B23K26/359 , B23K26/402 , B23K26/53 , B23K2103/172 , B23K2103/50 , B23K2103/54 , B65G2249/04 , C03B23/02 , C03B23/023 , C03B23/025 , C03B33/0222 , C03B33/023 , C03B33/033 , C03B33/04 , C03B33/082 , C03B33/102 , Y02P40/57 , Y10T428/15 , Y10T428/24777
Abstract: Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO2 laser for fully automated separation.
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公开(公告)号：US20170291844A1
公开(公告)日：2017-10-12
申请号：US15585305
申请日：2017-05-03
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
IPC: C03B33/02 , B32B17/06 , B23K26/0622 , B23K26/40 , B23K26/00 , B23K26/073
CPC classification number: C03B33/0222 , B23K26/0006 , B23K26/0613 , B23K26/0624 , B23K26/0738 , B23K26/40 , B23K26/53 , B23K26/55 , B23K2103/50 , B32B17/06 , B32B2250/02 , B32B2315/02 , Y02P40/57 , Y10T428/21 , Y10T428/24273 , Y10T428/24355
Abstract: A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.
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公开(公告)号：US20170189999A1
公开(公告)日：2017-07-06
申请号：US15325893
申请日：2015-07-14
Applicant: Corning Incorporated
Inventor： Dana Craig Bookbinder , Stephan Lvovich Logunov , Albert Roth Nieber , Garrett Andrew Piech , Pushkar Tandon , Sergio Tsuda
IPC: B23K26/402 , B23K26/0622 , B23K26/064 , C03B33/07 , B23K26/08 , B23K26/359 , B23K26/57 , C03B33/02 , B23K26/53 , B23K26/073
CPC classification number: B23K26/402 , B23K26/0624 , B23K26/064 , B23K26/0738 , B23K26/08 , B23K26/359 , B23K26/53 , B23K26/57 , B23K2103/50 , B23K2103/54 , C03B33/0222 , C03B33/076 , Y02P40/57
Abstract: A method of arresting propagation of an incident crack through a transparent material includes focusing pulsed laser beams into a laser beam focal line directed into the transparent material a series of locations corresponding to a predetermined pattern that is designed to arrest an incident crack that propagates through the transparent material, and generating, with the laser beam focal line (1460), an induced absorption within the transparent material in order to produce a defect (1440) in the transparent material.
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Patent Agency Ranking
96.发明申请公开(公告)号：US20170189991A1
公开(公告)日：2017-07-06
申请号：US15325905
申请日：2015-07-14
Applicant: Corning Incorporated
Inventor： Jacques Gollier , Garrett Andrew Piech
IPC: B23K26/00 , B23K26/073 , G02B7/10 , C03B33/02 , G02B5/00 , G02B27/09 , B23K26/067 , B23K26/06
Abstract: A system for and a method of processing a transparent material, such as glass, using an adjustable laser beam line focus are disclosed. The system for processing a transparent material includes a laser source operable to emit a pulsed laser beam, and an optical assembly (6′) disposed within an optical path of the pulsed laser beam. The optical assembly (6′) is configured to transform the pulsed laser beam into a laser beam focal line having an adjustable length and an adjustable diameter. At least a portion of the laser beam focal line is operable to be positioned within a bulk of the transparent material such that the laser beam focal line produces a material modification along the laser beam focal line. Method of laser processing a transparent material by adjusting at least one of the length of the laser beam focal line and the diameter of the laser beam focal line is also disclosed.
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公开(公告)号：US09687936B2
公开(公告)日：2017-06-27
申请号：US14529801
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
IPC: C03B33/02 , B23K26/00 , B23K26/382 , B23K26/0622
CPC classification number: B23K26/53 , B23K26/0624 , B23K26/382 , C03B33/0222 , Y02P40/57
Abstract: A system for laser drilling of a material includes a pulsed laser configured to produce a pulsed laser beam having a wavelength less than or equal to about 850 nm, the wavelength selected such that the material is substantially transparent at this wavelength. The system further includes an optical assembly positioned in the beam path of the laser, configured to transform the laser beam into a laser beam focal line oriented along the beam propagation direction, on a beam emergence side of the optical assembly.
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98.发明申请公开(公告)号：US20150166395A1
公开(公告)日：2015-06-18
申请号：US14535754
申请日：2014-11-07
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Shyamala Shanmugam , Carlos Alberto Pons Siepermann , Sergio Tsuda , Zsigmond Varga , Robert Stephen Wagner
CPC classification number: B23K26/384 , B23K26/04 , B23K26/0613 , B23K26/0617 , B23K26/0624 , B23K26/38 , B23K26/402 , B23K26/53 , B23K26/55 , B23K2103/50 , B32B17/064 , C03B33/0222 , C03B33/091 , C03C15/00 , C03C17/00 , C03C2217/70 , C09K13/00 , Y02P40/57 , Y10T428/24273 , Y10T428/24322
Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
Abstract translation: 在材料中形成的孔包括将脉冲激光束聚焦到沿着光束传播方向定向的激光束焦线并被引导到材料中，激光束焦线在材料内产生诱导吸收，诱导吸收产生沿着 材料内的激光束焦线，并且相对于彼此平移材料和激光束，从而在材料中形成多条缺陷线，并在酸溶液中蚀刻材料以产生直径大于1微米的孔 通过扩大材料中的缺陷线。 玻璃制品包括一叠玻璃基底，其具有延伸穿过该叠层的1-100微米直径的形成的孔。
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公开(公告)号：US20150166394A1
公开(公告)日：2015-06-18
申请号：US14530379
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/091 , B23K26/0622 , B23K26/0624 , B23K26/0884 , B23K26/359 , B23K26/402 , B23K26/53 , B23K2103/172 , B23K2103/50 , B23K2103/54 , B65G2249/04 , C03B23/02 , C03B23/023 , C03B23/025 , C03B33/0222 , C03B33/023 , C03B33/033 , C03B33/04 , C03B33/082 , C03B33/102 , Y02P40/57 , Y10T428/15 , Y10T428/24777
Abstract: Methods are provided for laser processing arbitrary shapes of molded 3D thin transparent brittle parts from substrates with particular interest in substrates formed from strengthened or non-strengthened Corning Gorilla® glass (all codes). The developed laser methods can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. Methods can be used to form 3D surfaces with small radii of curvature. The method involves the utilization of an ultra-short pulse laser that may be optionally followed by a CO2 laser for fully automated separation.
Abstract translation: 提供了激光加工任意形状的模制3D薄透明脆性部件的特殊感兴趣的基板，由强化或非强化CorningGorilla®玻璃（所有代码）形成。 开发的激光方法可以定制为从面板手动分离部件或通过热应力所需的轮廓进行全激光分离。 方法可用于形成具有小曲率半径的三维表面。 该方法涉及利用超短脉冲激光器，其可以任选地跟随有二氧化碳激光器进行全自动分离。
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公开(公告)号：US20150166393A1
公开(公告)日：2015-06-18
申请号：US14529697
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Garrett Andrew Piech , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/091 , B23K26/0622 , B23K26/0624 , B23K26/359 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2103/172 , B23K2103/50 , B23K2103/54 , C03B33/0222 , C03B33/07 , C03C23/0025 , Y02P40/57 , Y10T428/24273
Abstract: This laser cutting process makes use of a short pulse laser in combination with optics that generate a focal line to fully perforate the body of a range of ion-exchangeable glass compositions. The glass is moved relative to the laser beam to create perforated lines that trace out the shape of any desired parts. The glass may be cut pre-ion exchange, or may be cut post-ion exchange. The laser creates hole-like defect zones that penetrate the full depth the glass, of approximately 1 micron in diameter. These perforations or defect regions are generally spaced from 1 to 15 microns apart.
Abstract translation: 该激光切割工艺利用短脉冲激光器与光学元件组合，其产生焦线以完全穿透一系列可离子交换的玻璃组合物的主体。 玻璃相对于激光束移动，以产生可以追踪任何所需部件形状的穿孔线。 玻璃可以进行切割前离子交换，也可以在离子交换后切割。 激光产生穿透直径约1微米的玻璃的全深度的孔状缺陷区。 这些穿孔或缺陷区域通常间隔开1至15微米。
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