Electronic Devices Having Antennas that Radiate Through Three-Dimensionally Curved Cover Layers

    公开(公告)号:US20220384941A1

    公开(公告)日:2022-12-01

    申请号:US17865241

    申请日:2022-07-14

    Applicant: Apple Inc.

    Abstract: An electronic device may have a cover layer and an antenna. A dielectric adapter may have a first surface coupled to the antenna and a second surface pressed against the cover layer. The cover layer may have a three-dimensional curvature. The second surface may have a curvature that matches the curvature of the cover layer. Biasing structures may exert a biasing force that presses the antenna against the dielectric adapter and that presses the dielectric adapter against the cover layer. The biasing force may be oriented in a direction normal to the cover layer at each point across dielectric adapter. This may serve to ensure that a uniform and reliable impedance transition is provided between the antenna and free space through the cover layer over time, thereby maximizing the efficiency of the antenna.

    Electronic Device With Millimeter Wave Antennas

    公开(公告)号:US20220278702A1

    公开(公告)日:2022-09-01

    申请号:US17744213

    申请日:2022-05-13

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas. The antennas may include phased antenna arrays each of which includes multiple antenna elements. Phased antenna arrays may be mounted along edges of a housing for the electronic device, behind a dielectric window such as a dielectric logo window in the housing, in alignment with dielectric housing portions at corners of the housing, or elsewhere in the electronic device. A phased antenna array may include arrays of patch antenna elements on dielectric layers separated by a ground layer. A baseband processor may distribute wireless signals to the phased antenna arrays at intermediate frequencies over intermediate frequency signal paths. Transceiver circuits at the phased antenna arrays may include upconverters and downconverters coupled to the intermediate frequency signal paths.

    Electronic devices having antennas that radiate through three-dimensionally curved cover layers

    公开(公告)号:US11417951B2

    公开(公告)日:2022-08-16

    申请号:US17008862

    申请日:2020-09-01

    Applicant: Apple Inc.

    Abstract: An electronic device may have a cover layer and an antenna. A dielectric adapter may have a first surface coupled to the antenna and a second surface pressed against the cover layer. The cover layer may have a three-dimensional curvature. The second surface may have a curvature that matches the curvature of the cover layer. Biasing structures may exert a biasing force that presses the antenna against the dielectric adapter and that presses the dielectric adapter against the cover layer. The biasing force may be oriented in a direction normal to the cover layer at each point across dielectric adapter. This may serve to ensure that a uniform and reliable impedance transition is provided between the antenna and free space through the cover layer over time, thereby maximizing the efficiency of the antenna.

    Electronic devices having multilayer millimeter wave antennas

    公开(公告)号:US11349204B2

    公开(公告)日:2022-05-31

    申请号:US17028864

    申请日:2020-09-22

    Applicant: Apple Inc.

    Abstract: An electronic device may have a phased antenna array. An antenna in the array may include a rectangular patch element with diagonal axes. The antenna may have first and second antenna feeds coupled to the patch element along the diagonal axes. The antenna may be rotated at a forty-five degree angle relative to other antennas in the array. The antenna may have one or two layers of parasitic elements overlapping the patch element. For example, the antenna may have a layer of coplanar parasitic patches separated by a gap. The antenna may also have an additional parasitic patch that is located farther from the patch element than the layer of coplanar parasitic patches. The additional parasitic patch may overlap the patch element and the gap in the coplanar parasitic patches. The antenna may exhibit a relatively small footprint and minimal mutual coupling with other antennas in the array.

    Integrated millimeter wave antenna modules

    公开(公告)号:US11335992B2

    公开(公告)日:2022-05-17

    申请号:US16990879

    申请日:2020-08-11

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with an antenna module and a phased antenna array on the module. The module may include a logic board, an antenna board surface-mounted to the logic board, and a radio-frequency integrated circuit (RFIC) mounted surface-mounted to the logic board. The phased antenna array may include antennas embedded in the antenna board. The antennas may radiate at centimeter and/or millimeter wave frequencies. The logic board may form a radio-frequency interface between the RFIC and the antennas. Transmission lines in the logic board and the antenna board may include impedance matching segments that help to match the impedance of the RFIC to the impedance of the antennas. The module may efficiently utilize space within the device without sacrificing radio-frequency performance.

    Dielectric Covers for Antennas
    97.
    发明申请

    公开(公告)号:US20210376443A1

    公开(公告)日:2021-12-02

    申请号:US17400710

    申请日:2021-08-12

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with wireless communications circuitry and control circuitry. The wireless communications circuitry may include centimeter and millimeter wave transceiver circuitry and a phased antenna array. A dielectric cover may be formed over the phased antenna array. The phased antenna array may transmit and receive wireless radio-frequency signals through the dielectric cover. The dielectric cover may have first and second opposing surfaces. The second surface may face the phased antenna array and may have a curvature. The curvature of the second surface may include one or more recessed regions of the dielectric cover. The one or more recessed regions of the second surface may serve to maximize and broaden the coverage area for the phased antenna array. The first surface may be conformal to other structures in the electronic device.

    Electronic Devices Having Wideband Antennas

    公开(公告)号:US20210328346A1

    公开(公告)日:2021-10-21

    申请号:US16851812

    申请日:2020-04-17

    Applicant: Apple Inc.

    Abstract: An electronic device may include a curved cover layer and an antenna. The antenna may include a ground and a resonating element on a curved surface of a substrate. The curved surface may have a curvature that matches that of the cover layer. The resonating element may include first, second, and third arms fed by a feed. The first arm and a portion of the ground may form a loop antenna resonating element. The second arm and the first arm may form an inverted-F antenna resonating element, where a portion of the first arm forms a return path to the antenna ground for the inverted-F antenna resonating element. A gap between the first and second arms may form a distributed capacitance. The third arm may form an L-shaped antenna resonating element. The antenna may have a wide bandwidth from below 2.4 GHz to greater than 9.0 GHz.

    Electronic devices having multi-band satellite navigation capabilities

    公开(公告)号:US11089562B2

    公开(公告)日:2021-08-10

    申请号:US16292129

    申请日:2019-03-04

    Applicant: Apple Inc.

    Inventor: Mattia Pascolini

    Abstract: An electronic device may be provided with first and second antennas and satellite navigation receiver circuitry. The first antenna may receive first satellite navigation signals in a first satellite navigation frequency band such as the L5 band. The second antenna may receive second satellite navigation signals in a second satellite navigation frequency band such as the L1 band. Control circuitry may process the satellite navigation signals received in the first and second satellite navigation frequency bands to identify a geographic location of the electronic device with a high degree of precision and accuracy. The first and second antennas may transmit radio-frequency signals in non-satellite frequency bands such as cellular telephone bands using a multiple-input and multiple-output scheme. The antennas may include antenna resonating elements formed from segments of peripheral conductive housing structures for the electronic device.

    Electronic device with millimeter wave antennas

    公开(公告)号:US11025285B2

    公开(公告)日:2021-06-01

    申请号:US16854771

    申请日:2020-04-21

    Applicant: Apple Inc.

    Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas. The antennas may include phased antenna arrays each of which includes multiple antenna elements. Phased antenna arrays may be mounted along edges of a housing for the electronic device, behind a dielectric window such as a dielectric logo window in the housing, in alignment with dielectric housing portions at corners of the housing, or elsewhere in the electronic device. A phased antenna array may include arrays of patch antenna elements on dielectric layers separated by a ground layer. A baseband processor may distribute wireless signals to the phased antenna arrays at intermediate frequencies over intermediate frequency signal paths. Transceiver circuits at the phased antenna arrays may include upconverters and downconverters coupled to the intermediate frequency signal paths.

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