公开(公告)号：US20230147978A1

公开(公告)日：2023-05-11

申请号：US18095636

申请日：2023-01-11

申请人： Osaka Gas Co., Ltd.

发明人： Mitsuaki Echigo ,  Hisao Ohnishi ,  Yuji Tsuda ,  Kyohei Manabe ,  Kazuyuki Minami

IPC分类号： H01M8/1246

CPC分类号： H01M8/1246 ,  H01M2008/1293

摘要： Provided is a low-cost electrochemical element that has excellent performance, reliability, and durability. Also, provided is a manufacturing method for an electrochemical element including a metal substrate (metal support) and an electrode layer formed on/over the metal substrate. The method includes an electrode layer forming step of forming an electrode layer having a region with a surface roughness of 1.0 μm or less on/over the metal substrate, and an electrolyte layer forming step of forming an electrolyte layer by spraying aerosolized metal oxide powder onto the electrode layer.

公开(公告)号：US11369915B2

公开(公告)日：2022-06-28

申请号：US16493048

申请日：2018-03-15

申请人： Osaka Gas Co., Ltd.

发明人： Hidaka Asonuma ,  Tsubasa Shimizu

IPC分类号： C01B3/56 ,  B01D53/047

摘要： A pressure swing adsorption type hydrogen manufacturing apparatus includes a process control unit that controls operation of adsorption towers that generate a product gas by adsorbing, using adsorbents, adsorption target components other than hydrogen components from a source gas, in a state where an adsorption process, a pressure-equalization discharge process, a desorption process, and a pressure-restoration process are successively repeated. The process control unit is configured to control operation of the adsorption towers in such a manner that a prior pressure-equalization process is performed in an initial stage of a unit processing period, a subsequent pressure-equalization process is performed in a final stage of the unit processing period, a pressurization process of introducing a product gas to perform pressurization is performed, as the pressure-restoration process, subsequently to the prior pressure-equalization process, and the pressurization process is performed while overlapping with the subsequent pressure-equalization process.

公开(公告)号：US20220181651A1

公开(公告)日：2022-06-09

申请号：US17599372

申请日：2020-03-27

申请人： Osaka Gas Co., Ltd.

发明人： Mitsuaki Echigo ,  Norihisa Shinke ,  Kazuyuki Minami

IPC分类号： H01M8/0273 ,  H01M8/247 ,  H01M8/04746

摘要： An electrochemical module including: a stack obtained by stacking, in a predetermined stacking direction, a plurality of electrochemical elements having a configuration in which an electrode layer, an electrolyte layer, and a counter electrode layer are formed along a substrate, via an annular sealing portion through which first gas that is one of reducing component gas and oxidative component gas flows; a container that includes an upper cover for pressing a first flat face in the stacking direction of the stack and a lower cover for pressing a second flat face on a side opposite to the first flat face, the stack being sandwiched between the upper cover and the lower cover; and a pressing mechanism that presses a portion to which the annular sealing portion is attached against the container in the stacking direction.

公开(公告)号：US20220181648A1

公开(公告)日：2022-06-09

申请号：US17599346

申请日：2020-03-27

申请人： Osaka Gas Co., Ltd.

发明人： Hisao Ohnishi ,  Tetsuya Mori ,  Mitsuaki Echigo

IPC分类号： H01M8/0258 ,  H01M8/2483 ,  H01M8/2484 ,  C01B3/34

摘要： In the electrochemical element, a plate-like support includes an internal passage through which a first gas flows, a gas-permeable portion, and an electrochemical reaction portion in which a film-like electrode layer, a film-like electrolyte layer, and a film-like counter electrode layer are stacked so as to entirely or partially cover the gas-permeable portion. The internal passage includes a plurality of auxiliary passages through which the first gas flows in a predetermined flowing direction, and a distribution portion provided on the upstream side of the plurality of auxiliary passages in the flowing direction of the first gas. The plate-like support includes a supply structure that is located between the distribution portion and the auxiliary passages in the flowing direction. The first gas is temporarily stored in the distribution portion and supply of the first gas from the distribution portion to the plurality of auxiliary passages is limited.

公开(公告)号：US20220122859A1

公开(公告)日：2022-04-21

申请号：US17563475

申请日：2021-12-28

申请人： KOKUSAI ELECTRIC CORPORATION ,  OSAKA GAS CO., LTD.

发明人： Hitoshi MURATA ,  Yasuo KUNII ,  Masaaki UENO ,  Masahiro SUEMITSU

IPC分类号： H01L21/67 ,  H01L21/324

摘要： There is provided a technique that includes a quartz container in which an object to be processed, which contains a semiconductor, is arranged; a heater configured to emit heat; and a radiation control body arranged between the quartz container and the heater, wherein the radiation control body is configured to radiate a radiant wave of a wavelength transmittable through the quartz container by heating from the heater such that the radiant wave reaches the object to be processed in the quartz container.

公开(公告)号：US11233262B2

公开(公告)日：2022-01-25

申请号：US16497470

申请日：2018-03-30

申请人： Osaka Gas Co., Ltd.

发明人： Mitsuaki Echigo ,  Hisao Ohnishi

IPC分类号： H01M8/1226 ,  H01M8/04007 ,  H01M8/243

摘要： Provided are an electrochemical element and the like that have both durability and high performance as well as excellent reliability. The electrochemical element includes a metal support, and an electrode layer formed on/over the metal support. The metal support is made of any one of a Fe—Cr based alloy that contains Ti in an amount of 0.15 mass % or more and 1.0 mass % or less, a Fe—Cr based alloy that contains Zr in an amount of 0.15 mass % or more and 1.0 mass % or less, and a Fe—Cr based alloy that contains Ti and Zr, a total content of Ti and Zr being 0.15 mass % or more and 1.0 mass % or less.

公开(公告)号：US11189838B2

公开(公告)日：2021-11-30

申请号：US16910161

申请日：2020-06-24

申请人： Osaka Gas Co., Ltd.

发明人： Mitsuaki Echigo ,  Hisao Ohnishi ,  Kyohei Manabe ,  Osamu Yamazaki ,  Kazuyuki Minami ,  Yuji Tsuda

IPC分类号： H01M4/86 ,  H01M8/0232 ,  H01M8/1213 ,  H01M8/1253 ,  H01M8/126 ,  H01M4/88 ,  H01M8/12 ,  H01M8/02 ,  H01M8/124 ,  H01M4/90

摘要： Realized is an element having an electrolyte layer that is dense and has high gas barrier characteristics. A metal-supported electrochemical element includes at least a metal substrate as a support, an electrode layer formed on/over the metal substrate, a buffer layer formed on the electrode layer, and an electrolyte layer formed on the buffer layer. The electrode layer is porous and the electrolyte layer is dense. The buffer layer has density higher than density of the electrode layer and lower than density of the electrolyte layer.

公开(公告)号：US20210262745A1

公开(公告)日：2021-08-26

申请号：US17260742

申请日：2020-03-09

申请人： Osaka Gas Co., Ltd.

发明人： Masahiro Suemitsu ,  Tadashi Saito

IPC分类号： F28F21/08 ,  G02B5/26 ,  G02B5/20 ,  G02B1/04 ,  B32B7/12 ,  B32B7/027 ,  B32B7/023 ,  B32B27/36

摘要： A radiative cooling device having high flexibility that can be retrofitted to an existing outdoor facility.
An infrared radiative layer for radiating infrared light from a radiative surface and a light reflective layer disposed on the side opposite to the presence side of the radiative surface of the infrared radiative layer are provided. The infrared radiative layer is a resin material layer whose thickness is adjusted to discharge a greater thermal radiation energy than absorbed solar light energy in a wavelength band ranging from 8 μm to 14 μm.

公开(公告)号：US20210154723A1

公开(公告)日：2021-05-27

申请号：US17044022

申请日：2019-03-29

申请人： Osaka Gas Co., Ltd.

发明人： Norihisa Shinke ,  Mitsuaki Echigo ,  Yuji Tsuda

IPC分类号： B21D28/26 ,  B21D28/34 ,  B21D37/01 ,  B21D37/16 ,  B21D45/00

摘要： A punch hole forming method and a punch hole forming device that can suppress a decrease in the temperature of a workpiece due to a machining tool when a hole is formed by punching the workpiece using the machining tool. In the punch hole forming method, when a workpiece that is a plate-like member having a thickness of 0.01 mm or more and 1 mm or less is placed on a die, and a hole is formed by punching the workpiece in the thickness direction using a punch, the workpiece is kept at a temperature at which the workpiece can be punched at least during formation of the hole.

公开(公告)号：US20210151774A1

公开(公告)日：2021-05-20

申请号：US17043798

申请日：2019-03-29

申请人： OSAKA GAS CO., LTD.

发明人： Mitsuaki ECHIGO ,  Hisao OHNISHI

IPC分类号： H01M4/88 ,  H01M4/90 ,  H01M8/12 ,  H01M8/04828 ,  H01M8/04014

摘要： A metal plate configured such that sufficient strength and performance are ensured and the workability and cost of mass production are improved, and a metal-supported electrochemical element and the like including the metal plate. Also, a method for manufacturing a metal plate including a rolling step for rolling a metal material provided with a penetration space passing through the metal material in a thickness direction to reduce the thickness of the metal material and reduce the area of a surface opening formed in the surface of the metal material by the penetration space, thereby producing a plate-like metal plate.