Radiative cooling device
    1.
    发明授权

    公开(公告)号:US11427500B2

    公开(公告)日:2022-08-30

    申请号:US17041059

    申请日:2019-07-17

    IPC分类号: B32B17/06 C03C17/36 F28F21/06

    摘要: Provided is a radiative cooling device that provides coloration of the radiative surface while maximally avoiding reduction in its radiative cooling performance due to absorption of solar light. An infrared radiative layer for radiating infrared light from a radiative surface and a light reflective layer disposed on the side opposite to the presence side of the radiative surface of the infrared radiative layer are provided in a mutually stacked state. The light reflective layer is arranged such that a first metal layer made of silver or silver alloy and having a thickness equal to or greater than 10 nm and equal to or less than 100 nm, a transparent dielectric layer and a second metal layer reflecting light transmitted through the first metal layer and the transparent dielectric layer are stacked in this order on the side closer to the infrared radiative layer. The transparent dielectric layer has a thickness that causes a resonance wavelength of the light reflective layer to be a wavelength included in wavelengths equal to or greater than 400 nm and equal to or less than 800 nm.

    Radiative cooling device
    2.
    发明授权

    公开(公告)号:US11274062B2

    公开(公告)日:2022-03-15

    申请号:US17041059

    申请日:2019-07-17

    IPC分类号: B32B17/06 C03C17/36 F28F21/06

    摘要: Provided is a radiative cooling device that provides coloration of the radiative surface while maximally avoiding reduction in its radiative cooling performance due to absorption of solar light. An infrared radiative layer for radiating infrared light from a radiative surface and a light reflective layer disposed on the side opposite to the presence side of the radiative surface of the infrared radiative layer are provided in a mutually stacked state. The light reflective layer is arranged such that a first metal layer made of silver or silver alloy and having a thickness equal to or greater than 10 nm and equal to or less than 100 nm, a transparent dielectric layer and a second metal layer reflecting light transmitted through the first metal layer and the transparent dielectric layer are stacked in this order on the side closer to the infrared radiative layer. The transparent dielectric layer has a thickness that causes a resonance wavelength of the light reflective layer to be a wavelength included in wavelengths equal to or greater than 400 nm and equal to or less than 800 nm.

    Radiative cooling device and radiative cooling method

    公开(公告)号:US11598592B2

    公开(公告)日:2023-03-07

    申请号:US16494389

    申请日:2018-03-01

    摘要: A radiative cooling device and a radiative cooling method that effectively suppress ultraviolet light absorption. The radiative cooling device includes an ultraviolet reflection layer that reflects ultraviolet light UV, a light reflection layer that reflects visible light and infrared light, and an infrared radiative layer that radiates infrared light IR. Infrared light IR is radiated form a radiative surface. The ultraviolet reflection layer, the infrared radiative layer and the light reflection layer are laminated in this order as viewed from the side of the radiative surface.

    Heat-Radiating Light Source
    5.
    发明申请

    公开(公告)号:US20210385908A1

    公开(公告)日:2021-12-09

    申请号:US17284116

    申请日:2019-09-03

    IPC分类号: H05B3/00 H05B3/12 H01K1/08

    摘要: A heat-radiating light source including a heat-radiating layer and a substrate laminated thereon for heating the heat-radiating layer is disclosed. A heat-radiating layer and a substrate for heating the heat-radiating layer are laminated. In the heat-radiating layer, there are provided a radiation control portion and a radiating transparent oxide layer, the radiation control portion having an MIM lamination portion including a pair of platinum layers juxtaposed along lamination direction and a resonating transparent oxide layer formed of a transparent oxide and disposed between the pair of platinum layers, the radiation control portion and the radiating transparent oxide layer are laminated with the radiation control portion and the radiating transparent oxide layer are disposed closer to the substrate in this order. The resonating transparent oxide layer R has a thickness providing a resonance wavelength equal to or smaller than 4 μm.

    Thermal emission source
    6.
    发明授权

    公开(公告)号:US11112536B2

    公开(公告)日:2021-09-07

    申请号:US16080789

    申请日:2017-02-28

    摘要: A thermal emission source is provided that has a structure capable of suppressing deterioration of an optical assembly over time. The thermal emission source includes an optical assembly (1) having an optical structure in which a member made of a semiconductor has a refractive index distribution so as to resonate with light of a wavelength shorter than a wavelength that corresponds to an absorption edge corresponding to a band gap of the semiconductor. The optical assembly (1) includes a coating structure (30) with a coating material that differs from the semiconductor of refractive portions (10) and through which light of a wavelength included in a wavelength range from visible light to far infrared rays can be transmitted.

    Radiative Cooling Device
    7.
    发明申请

    公开(公告)号:US20210024409A1

    公开(公告)日:2021-01-28

    申请号:US17041059

    申请日:2019-07-17

    IPC分类号: C03C17/36 F28F21/06

    摘要: Provided is a radiative cooling device that provides coloration of the radiative surface while maximally avoiding reduction in its radiative cooling performance due to absorption of solar light. An infrared radiative layer for radiating infrared light from a radiative surface and a light reflective layer disposed on the side opposite to the presence side of the radiative surface of the infrared radiative layer are provided in a mutually stacked state. The light reflective layer is arranged such that a first metal layer made of silver or silver alloy and having a thickness equal to or greater than 10 nm and equal to or less than 100 nm, a transparent dielectric layer and a second metal layer reflecting light transmitted through the first metal layer and the transparent dielectric layer are stacked in this order on the side closer to the infrared radiative layer. The transparent dielectric layer has a thickness that causes a resonance wavelength of the light reflective layer to be a wavelength included in wavelengths equal to or greater than 400 nm and equal to or less than 800 nm.

    Thermal Emission Source
    9.
    发明申请

    公开(公告)号:US20190064393A1

    公开(公告)日:2019-02-28

    申请号:US16080789

    申请日:2017-02-28

    IPC分类号: G02B1/00 F28F13/18

    摘要: A thermal emission source is provided that has a structure capable of suppressing deterioration of an optical assembly over time. The thermal emission source includes an optical assembly (1) having an optical structure in which a member made of a semiconductor has a refractive index distribution so as to resonate with light of a wavelength shorter than a wavelength that corresponds to an absorption edge corresponding to a band gap of the semiconductor. The optical assembly (1) includes a coating structure (30) with a coating material that differs from the semiconductor of refractive portions (10) and through which light of a wavelength included in a wavelength range from visible light to far infrared rays can be transmitted.