摘要:
A digital broadcasting stream transmitting method and a digital broadcasting stream receiving method and apparatus for providing three-dimensional (3D) video services are provided. The transmitting method including: generating a plurality of elementary streams (ESs) for a plurality of pieces of video information including at least one of information about a base-view video of a 3D video, information about an additional-view video corresponding to the base-view video, and a two-dimensional (2D) video having a different view from views of the 3D video; multiplexing the plurality of ESs with link information for identifying at least one piece of video information linked with the plurality of pieces of video information, to generate at least one transport stream (TS); and transmitting the generated at least one TS via at least one channel.
摘要:
Disclosed herein is a photoresist composition which includes a norbornene copolymer having an epoxy group, an acid generator, and an organic solvent. The norbornene polymer shows superior mechanical and thermal properties, high transparency, excellent insulating properties, and particularly, improved mechanical properties due to the presence of an epoxy group. The photosensitive resin composition shows superior performance, e.g., transparence, developing properties, residual film characteristics, chemical resistance, heat resistance, and flatness. Particularly, since the photosensitive resin composition enables easy formation of a pattern as an interlayer insulating film and shows a high light transmittance even when being formed into a thin film with a relatively large thickness, it is suitable for the production of an interlayer insulating film used in the fabrication processes of LCDs.
摘要:
A solid acid including a carbon nanotube (CNT), a spacer group combined with the CNT and an ionically conductive functional group connected to the spacer group. A polymer electrolyte membrane may include the same composition, and may be used in a fuel cell. The polymer electrolyte membrane using the solid acid has excellent ionic conductivity and suppresses the cross-over of methanol. The polymer electrolyte membrane is used as an electrolyte membrane of a fuel cell, for example, a direct methanol fuel cell.
摘要:
A thermosetting oligomer or thermosetting polymer is provided. The thermosetting oligomer or thermosetting polymer contains repeating units, each of which has at least one thermosetting functional group in the side chain and is represented by Formula 1: where repeating units include X1, A1, and Y1 subunits, sidechain units include linking unit L and thermosetting functional group Z, and n is an integer from 1 to 4. The thermosetting oligomer or thermosetting polymer has a low coefficient of thermal expansion and high or no glass transition temperature, stiffness, processability, heat resistance and mechanical properties. The thermosetting oligomer or thermosetting polymer is highly soluble, wettable and dimensionally stable and is suitable for use in films, prepregs and printed circuit boards. Further provided are a thermosetting resin composition including the thermosetting oligomer or thermosetting polymer and a printed circuit board using the composition.
摘要:
A composition, including a liquid crystal polymer or oligomer having a terminal hydroxyl group, and a cross-linking agent including a bismaleimide compound, an epoxy resin or a combination thereof, wherein the liquid crystal polymer or oligomer is represented by Formula 1: Z1-(R1)m—(R2)n-Z2 (1), wherein R1 is represented by Formula 2: —X1—Ar1—Y1— (2), wherein X1 and Y1 are each independently selected from the group consisting of O, CO and NR″, in which R″ is independently selected from the group consisting of a hydrogen atom, a substituted or unsubstituted C1-C20 alkyl group, and a substituted or unsubstituted C6-C30 aryl group, and Ar1 includes at least one divalent aromatic or alicyclic organic group selected from the group consisting of Formula 3:
摘要:
A memory system is disclosed with first, second, and third connectors located on a system board, the third connector including pins connected to the pins of the first and second connectors through channels, and a memory controller connected to the pins of the third connector through channels. The memory system, as configured in a first memory capacity, comprises; dummy memory modules and a first memory module connected to the memory controller by installing the dummy memory modules in the first and second connectors and installing the first memory module in the third connector. The memory system, as alternately configured in a second memory capacity larger than the first memory capacity, comprises second memory modules connected to the memory controller by installing the second memory modules in only the first and second connectors.
摘要:
Provided is a memory system with an inductor. In the memory system, the inductor is connected to an on-die termination unit of a memory chip, thereby realizing constant gain characteristics without respect to a variation in an operating frequency. The inductor of the on-die termination unit may be embodied by connecting a wire bonding, a package line pattern, a PCB line pattern, a wire line, and/or an inductor device to pads of the memory chip.
摘要:
A memory module includes: one or more semiconductor memory devices; a plurality of module tabs configured to transmit and receive signals between the one or more semiconductor memory devices and external devices; a data bus configured to transfer signals between data input/output pins of the one or more semiconductor memory devices and the plurality of module tabs; and impedance-matching capacitive elements, each coupled between a line of the data bus and a reference voltage. Accordingly, the memory module and a memory system employing such a module can achieve improved impedance matching, thereby also improving signal integrity.
摘要:
A buffered memory module includes a buffer circuit mounted and a plurality of memory devices mounted on the first surface of the board, the memory devices being electrically connected to the buffer circuit. The memory module also includes a plurality of test pads located on a second surface of the board and electrically connected to the buffer circuit.
摘要:
An impedance adjustment circuit for controlling an impedance of a variable impedance circuit includes a calibration circuit including a replica of the variable impedance circuit and configured to generate an impedance control signal for the variable impedance circuit based on a voltage generated at the replica of the variable impedance circuit in response to a reference current. The calibration circuit may be configured to generate the reference current based on a reference resistor coupled thereto. In particular, the calibration circuit may be configured to match a current in the replica of the variable impedance circuit and a current in the reference resistor to generate the voltage at the replica of the variable impedance circuit.