公开(公告)号：US06542364B2

公开(公告)日：2003-04-01

申请号：US09951814

申请日：2001-09-12

申请人： Cheng Tien Lai ,  Shuai Jiang

发明人： Cheng Tien Lai ,  Shuai Jiang

IPC分类号： H05K720

CPC分类号： H01L23/427 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipating assembly (1) includes a pair of concertinaed heat pipes (10), a plurality of fins (20), a shell (30), a heat-conductive block (40) and a fan (50). The fins are spaced and stacked one above the other. A plurality of channels (22) is defined through opposite sides of the fins, for insertion of the heat pipes thereinto. The shell includes a frame (32) and a cover (34) mounted to a top side of the frame, thereby defining a space for accommodating the fins and the heat pipes therein. A plurality of openings (362, 342) is defined in a bottom plate (36) of the frame and in the cover, for extension of bottommost and topmost portions of the heat pipes therethrough. A horizontal end portion (12) of each heat pipe extends over the cover and engages with the block. The fan is mounted to one end of the shell.

摘要翻译： 散热组件（1）包括一对夹心热管（10），多个翅片（20），壳体（30），导热块（40）和风扇（50）。 翅片间隔开并叠放在另一个之上。 多个通道（22）通过翅片的相对侧限定，用于将热管插入其中。 壳体包括安装在框架顶侧的框架（32）和盖（34），从而限定用于容纳翅片和热管的空间。 多个开口（362,342）被限定在框架的底板（36）和盖子中，用于将热管的最底部和最上部分延伸通过其中。 每个热管的水平端部（12）在盖上延伸并与块接合。 风扇安装在外壳的一端。

公开(公告)号：US06480388B1

公开(公告)日：2002-11-12

申请号：US10103004

申请日：2002-03-20

申请人： Tsung-Lung Lee ,  Cheng-Tien Lai ,  Zili Zhang

发明人： Tsung-Lung Lee ,  Cheng-Tien Lai ,  Zili Zhang

IPC分类号： H05K720

CPC分类号： H01L23/36 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K3/301 ,  H05K7/1007 ,  H01L2924/00

摘要： A back plate assembly includes a back plate (40) for being attached to an underside of a motherboard (20), a plurality of posts (60), and a plurality of clips (80). The motherboard defines a plurality of through apertures (22). The back plate defines a plurality of through holes (48). Each clip defines a star-shaped cutout (82) in a middle of a round base (82) thereof, to thereby form a plurality of inwardly extending resilient teeth (84). The teeth slant upwardly from a periphery of the base toward a middle of the cutout. In assembly, the posts are extended through the corresponding through holes and through apertures. The clips are then placed on top ends of the posts and downwardly pushed until the clips abut the motherboard. The teeth are elastically deformed to thereby securely retain the posts in the motherboard. The back plate is thus securely attached to the motherboard.

摘要翻译： 背板组件包括用于附接到母板（20）的下侧的后板（40），多个柱（60）和多个夹子（80）。 主板限定多个通孔（22）。 后板限定多个通孔（48）。 每个夹子在其圆形基部（82）的中间限定了星形切口（82），从而形成多个向内延伸的弹性齿（84）。 齿从基部的周边朝切口的中间向上倾斜。 在组装中，柱通过相应的通孔延伸穿过孔。 然后将夹子放置在柱的顶端并向下推动直到夹子抵靠主板。 牙齿弹性变形，从而可靠地将柱固定在母板上。 因此，背板牢固地附接到母板。

公开(公告)号：US07891845B2

公开(公告)日：2011-02-22

申请号：US12396475

申请日：2009-03-03

申请人： Yi Zhang ,  Cheng-Tien Lai ,  Jin-Song Feng

发明人： Yi Zhang ,  Cheng-Tien Lai ,  Jin-Song Feng

IPC分类号： F21V29/00

CPC分类号： F21V29/763 ,  F21K9/00 ,  F21V19/003 ,  F21V29/51 ,  F21V29/75 ,  F21V29/76 ,  F21Y2115/10

摘要： An LED lamp includes a heat sink having a base and a plurality of LED module assemblies mounted on a top surface of the base of the heat sink. Each of the LED module assemblies includes a fixing bracket secured to the top surface of the base, an LED module mounted on a top surface of the fixing bracket and two heat pipes engaging with the fixing bracket and the heat sink. The fixing bracket includes a bottom plate attached on the top surface of the base, a top plate on which the LED module is attached and a connecting plate interconnecting the bottom plate with the top plate. The heat pipes thermally connect the bottom plate and the heat sink with the top plate.

摘要翻译： LED灯包括具有基座的散热器和安装在散热器的基座的顶表面上的多个LED模块组件。 每个LED模块组件包括固定到基座顶面的固定支架，安装在固定支架顶表面上的LED模块和与固定支架和散热片相接合的两个热管。 固定支架包括安装在基座顶表面上的底板，安装有LED模块的顶板和将底板与顶板互连的连接板。 热管将顶板和散热器与顶板热连接。

公开(公告)号：US07726851B2

公开(公告)日：2010-06-01

申请号：US12017311

申请日：2008-01-21

申请人： Chun-Jiang Shuai ,  Guang Yu ,  Cheng-Tien Lai

发明人： Chun-Jiang Shuai ,  Guang Yu ,  Cheng-Tien Lai

IPC分类号： F21V29/00 ,  H01L23/34

CPC分类号： F21V29/763 ,  F21K9/00 ,  F21V29/004 ,  F21V29/60 ,  F21V29/75 ,  F21V29/76 ,  F21Y2115/10

摘要： An LED lamp includes a heat sink, a plurality of vapor chambers mounted on the heat sink and an LED module mounted on the vapor chambers. The heat sink includes a base, a plurality of fins extending from a first surface of the base and a triangular ridge formed on a second surface opposite to the first surface of the base. The vapor chambers are mounted on the ridge of the base. The LEDs over two slopes of the ridge are oriented slantwise outwardly, thereby increasing an irradiation angle and area of the LED lamp.

摘要翻译： LED灯包括散热器，安装在散热器上的多个蒸气室和安装在蒸气室上的LED模块。 散热器包括基座，从基座的第一表面延伸的多个翅片和形成在与基座的第一表面相对的第二表面上的三角形脊。 蒸汽室安装在基座的脊上。 脊的两个斜坡上的LED被向外倾斜定向，从而增加了LED灯的照射角度和面积。

公开(公告)号：US20100097766A1

公开(公告)日：2010-04-22

申请号：US12417605

申请日：2009-04-02

申请人： WEI-LE WU ,  JIN-SONG FENG ,  CHENG-TIEN LAI

发明人： WEI-LE WU ,  JIN-SONG FENG ,  CHENG-TIEN LAI

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L23/4006 ,  H01L23/467 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

摘要： A fixing device fastens a heat sink having a base on one of motherboards with different specifications. Each motherboard with a corresponding specification defines a plurality of extending holes therethrough. The fixing device comprises a plurality of slats each having an end thereof pivotally connecting to the base of the heat sink and the other end thereof defining an elongated slot for corresponding to one of the extending holes of the one of the motherboards, a back plate defining a plurality of mounting holes corresponding to the extending holes of the motherboards, and a plurality of fixing units extending through the slots of the slats, the extending holes of the one of the motherboards and corresponding mounting holes of the back plate to mount the heat sink on the one of the motherboards.

摘要翻译： 定影装置将具有基座的散热器固定在具有不同规格的主板之一上。 具有相应规格的每个主板限定了穿过其中的多个延伸的孔。 定影装置包括多个板条，每个板条的端部枢转地连接到散热器的底部，并且其另一端限定用于对应于一个主板的一个延伸孔的细长槽，限定 与主板的延伸孔相对应的多个安装孔，以及延伸穿过板条槽的多个固定单元，一个主板的延伸孔和背板的相应安装孔，以安装散热片 在主板之一上。

公开(公告)号：US07695161B2

公开(公告)日：2010-04-13

申请号：US11937413

申请日：2007-11-08

申请人： Wen-Xiang Zhang ,  Guang Yu ,  Cheng-Tien Lai

发明人： Wen-Xiang Zhang ,  Guang Yu ,  Cheng-Tien Lai

IPC分类号： F21V29/00

CPC分类号： F21V29/004 ,  F21K9/00 ,  F21S2/005 ,  F21V29/75 ,  F21V29/763 ,  F21V29/83 ,  F21Y2103/10 ,  F21Y2115/10

摘要： A heat dissipation device includes a heat sink and an LED module attached to the heat sink. The heat sink includes a base and a plurality of fins mounted on the base. A plurality of channels is defined between the fins of the heat sink and slits are defined in two opposite side edges of the base. The slits extend through the base and corresponding fins and cross with corresponding channels. A plurality of grooves is defined in the fins opposite to the LED module. Each of the grooves interconnects corresponding two aligned slits.

摘要翻译： 散热装置包括散热器和连接到散热器的LED模块。 散热器包括底座和安装在基座上的多个翅片。 在散热片的翅片之间限定多个通道，并且狭缝被限定在基座的两个相对的侧边缘中。 狭缝延伸通过基部和相应的翅片并与相应的通道交叉。 在与LED模块相对的翅片中限定多个凹槽。 每个槽互相对应的两个排列的狭缝。

公开(公告)号：US07694721B2

公开(公告)日：2010-04-13

申请号：US11309612

申请日：2006-08-31

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： H01L23/473 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A miniature liquid cooling device includes a casing (10) having a base (16) attached on a heat-generating electronic component for absorbing heat generated by the electronic component. The casing includes an outer wall (12) mounted on the base and a top cover (15) mounted on the outer wall. A receiving space is enclosed by the casing. A heat-absorbing member (40) is attached on the base and received in the receiving space for exchanging heat with liquid in the casing. An impeller (21) is rotatably mounted in the receiving space and above the heat-absorbing member. When the impeller rotates the liquid is driven to flow into the liquid cooling device via a liquid inlet (122) and then flow through the heat-absorbing member and finally flow out of the liquid cooling device via a liquid outlet (124).

摘要翻译： 微型液体冷却装置包括壳体（10），其具有附接在发热电子部件上的基部（16），用于吸收由电子部件产生的热量。 壳体包括安装在基座上的外壁（12）和安装在外壁上的顶盖（15）。 收容空间由外壳封闭。 吸热构件（40）安装在基座上并被容纳在容纳空间中以与壳体内的液体进行热交换。 叶轮（21）可旋转地安装在容纳空间中并且在吸热构件上方。 当叶轮旋转时，驱动液体经由液体入口（122）流入液体冷却装置，然后流过吸热构件，并最终经由液体出口（124）从液体冷却装置流出。

公开(公告)号：US07654701B2

公开(公告)日：2010-02-02

申请号：US12200880

申请日：2008-08-28

申请人： Yu Zhang ,  Guang Yu ,  Cheng-Tien Lai

发明人： Yu Zhang ,  Guang Yu ,  Cheng-Tien Lai

IPC分类号： F21V29/00

CPC分类号： F21V29/74 ,  F21S8/086 ,  F21V19/001 ,  F21V29/75 ,  F21V29/76 ,  F21W2131/103 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： An LED lamp includes a lamp frame, a plurality of LED modules, an envelope and a heat sink made of metal. The envelope and the heat sink are mounted on top and bottom sides of the lamp frame. A frame body of the lamp frame is attached to a top face of a base of the heat sink. A heat absorbing member made of metal and provided with a plurality of heat absorbing portions is attached on the top face of the base. The LED modules are attached on top boards of the heat absorbing portions. The envelope engages with the lamp frame and receives the heat absorbing member and the LED modules therein. The top boards are inclined downwards from a middle toward an outside of the heat absorbing member.

摘要翻译： LED灯包括灯框架，多个LED模块，外壳和由金属制成的散热器。 信封和散热器安装在灯架的顶部和底部。 灯架的框体连接到散热器的基座的顶面。 由金属制成并具有多个吸热部分的吸热件安装在基座的顶面上。 LED模块附接在吸热部分的顶板上。 信封与灯框架接合，并在其中容纳吸热件和LED组件。 顶板从吸热件的中间向外倾斜。

公开(公告)号：US07584781B2

公开(公告)日：2009-09-08

申请号：US11309491

申请日：2006-08-11

申请人： Cheng-Tien Lai ,  Zhi-Yong Zhou

发明人： Cheng-Tien Lai ,  Zhi-Yong Zhou

IPC分类号： F28F7/00 ,  F28F3/12 ,  H05K7/20

CPC分类号： F28F3/086 ,  F28F3/12 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid cooling device includes a base, a housing and a heat exchanger. The base and the housing enclose a chamber which receives the heat exchanger therein. Inlet and outlet for liquid are provided at the housing. The heat exchanger includes stacked flakes. Each flake includes parallel and alternately arranged first and second strips each having a void defined therein. The flakes are stacked in a manner such that each first strip overlays and abuts against a corresponding second strip of an adjacent flake and that the void in each first strip and the void in the corresponding second strip of the adjacent flake are in fluid communication with each other to thereby form a channel between the inlet and the outlet.

摘要翻译： 液体冷却装置包括基座，壳体和热交换器。 基座和壳体包围容纳热交换器的腔室。 在壳体处设有用于液体的入口和出口。 热交换器包括堆积的薄片。 每个薄片包括平行且交替布置的第一和第二条带，每个带有限定在其中的空隙。 薄片以这样的方式堆叠，使得每个第一条覆盖并邻接相邻片状物的对应的第二条带，并且每个第一条带中的空隙和相邻片状物的相应第二条带中的空隙与每个 从而在入口和出口之间形成通道。

公开(公告)号：US20090166005A1

公开(公告)日：2009-07-02

申请号：US11967069

申请日：2007-12-29

申请人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

发明人： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC分类号： F28D15/04 ,  H01L23/427

CPC分类号： F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A vapor chamber includes a base (100) and a cover (200). The cover is mounted on the base with a hermetically sealed cavity (102) defined between the base and the cover. A working fluid is contained in the cavity. A first wick structure (220) is spread on an inner surface (201) of the cover. A second wick structure (221) is disposed in the cavity. A third wick structure (110) is spread on an inner surface (101) of the base, and the second wick structure extends between the first wick structure and the third wick structure. A first vapor space (300) is defined in the cavity and surrounds the second wick structure. A second vapor space (400) is defined in the second wick structure and communicated with the first vapor space.

摘要翻译： 蒸气室包括基座（100）和盖子（200）。 盖子安装在基座上，并具有限定在基座和盖子之间的气密密封腔（102）。 工作流体包含在空腔中。 第一芯结构（220）分散在盖的内表面（201）上。 第二芯结构（221）设置在空腔中。 第三芯结构（110）分散在基座的内表面（101）上，第二芯结构在第一芯结构和第三芯结构之间延伸。 第一蒸气空间（300）被限定在空腔中并且围绕第二芯结构。 第二蒸汽空间（400）被限定在第二吸芯结构中并且与第一蒸气空间连通。