公开(公告)号：US08377214B2

公开(公告)日：2013-02-19

申请号：US12534880

申请日：2009-08-04

Applicant: Sheng-Chao Zhang ,  Zhi-Yong Zhou ,  Qiao-Li Ding

Inventor： Sheng-Chao Zhang ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC: C23C16/00

CPC classification number: F28D15/0233 ,  F28D15/046 ,  F28F2225/04 ,  F28F2240/00 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49888 ,  H01L2924/00

Abstract: A vapor chamber includes a sealed flattened casing containing working liquid therein, a wick structure arranged on an inner face of the casing, a supporting plate received in the casing and a plurality of supporting posts. The supporting plate defines a plurality of fixing holes therein. The supporting posts are engagingly received in the fixing holes of the supporting plate. Top and bottom ends of the supporting posts engage with the wick structure to reinforce a structure of the vapor chamber.

Abstract translation: 蒸气室包括容纳工作液体的密封扁平壳体，布置在壳体内表面上的芯结构，容纳在壳体中的支撑板和多个支撑柱。 支撑板在其中限定多个固定孔。 支撑柱被卡合在支撑板的固定孔中。 支撑柱的顶端和底端与油绳结构接合以加强蒸气室的结构。

公开(公告)号：US07942557B2

公开(公告)日：2011-05-17

申请号：US12238422

申请日：2008-09-25

Applicant: Zhi-Yong Zhou ,  Qiao-Li Ding

Inventor： Zhi-Yong Zhou ,  Qiao-Li Ding

IPC: F21V29/00

CPC classification number: F21V29/67 ,  F21V29/763 ,  F21Y2115/10

Abstract: An LED lamp includes a heat sink, a centrifugal blower and a plurality of LED modules. The heat sink includes a base plate defining an air intake adjacent to an end of the base plate and a plurality of fins extending downwardly from a bottom surface of the base plate, between the air intake and an opposite remote end of the base plate. The centrifugal blower is mounted on the bottom surface of the base plate and located between the air intake and the fins. The LED modules are fixed on a top surface of the base plate of the heat sink. The housing engages with the base plate to enclose the centrifugal blower and the fins therein and cooperates with the base plate to define an exhaust port between the opposite remote end of the base plate and a corresponding sidewall of the housing.

Abstract translation: LED灯包括散热器，离心鼓风机和多个LED模块。 散热器包括限定与基板的端部相邻的进气口的底板和从基板的底表面向下延伸的多个翅片，位于进气口和基板的相对的远端之间。 离心鼓风机安装在基板的底面上，位于进气口和散热片之间。 LED模块固定在散热器底板的顶面上。 壳体与基板接合以将离心鼓风机和翅片封闭在其中并与底板协作以在基板的相对的远端和壳体的相应侧壁之间限定排气口。

公开(公告)号：US20100243216A1

公开(公告)日：2010-09-30

申请号：US12475527

申请日：2009-05-31

Applicant: ZHI-YONG ZHOU ,  QIAO-LI DING ,  HAI-BING CAO

Inventor： ZHI-YONG ZHOU ,  QIAO-LI DING ,  HAI-BING CAO

IPC: F28D15/00 ,  F28F1/10

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A liquid-cooling device includes a heat exchanger defining a cavity therein and a liquid-guiding component received in the cavity. The liquid-guiding component includes a body and a fixing portion extending from the body and fixed to the heat exchanger. A first liquid passage is defined through the body and a second liquid passage is formed between the body and an inner sidewall of the heat exchanger surrounding the cavity. The first liquid passage is in fluid communication with the second liquid passage via a bottom of the cavity. An outlet and an inlet are formed at an end of the liquid-guiding component and in fluid communication with the first and second liquid passages. Liquid flows in the cavity of the heat exchanger via the first liquid passage and has a sufficient contact with the inner sidewall of the heat exchanger.

Abstract translation: 液体冷却装置包括在其中限定空腔的热交换器和容纳在空腔中的液体引导部件。 液体引导部件包括主体和从主体延伸并固定到热交换器的固定部。 第一液体通道被限定穿过主体，并且第二液体通道形成在主体与围绕空腔的热交换器的内侧壁之间。 第一液体通道经由腔的底部与第二液体通道流体连通。 出口和入口形成在液体引导部件的端部处并与第一和第二液体通道流体连通。 液体经由第一液体通道在热交换器的空腔中流动，并且与热交换器的内侧壁具有充分的接触。

公开(公告)号：US20100139894A1

公开(公告)日：2010-06-10

申请号：US12436785

申请日：2009-05-07

Applicant: ZHI-YONG ZHOU ,  QIAO-LI DING

Inventor： ZHI-YONG ZHOU ,  QIAO-LI DING

IPC: F28D15/04

CPC classification number: F28D15/046 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink includes a heat spreader for absorbing heat from a heat-generating source, a tank covering on the heat spreader and hermetically engaging with the heat spreader, a first wick layer formed on an inner face of the tank, a second wick layer formed on an inner face of the heat spreader, and a supporting member located between the tank and the heat spreader. A chamber is defined between the tank and the heat spreader and contains working fluid therein. The supporting member is arranged in a wave shape and supports the first wick layer and the second wick layer.

Abstract translation: 散热器包括用于从发热源吸收热量的散热器，覆盖在散热器上并与散热器密封接合的容器，形成在罐的内表面上的第一灯芯层，形成的第二灯芯层 在散热器的内表面上，以及位于罐和散热器之间的支撑构件。 在罐和散热器之间限定一个室，并在其中包含工作流体。 支撑构件布置成波形，并且支撑第一灯芯层和第二灯芯层。

公开(公告)号：US20090268476A1

公开(公告)日：2009-10-29

申请号：US12131111

申请日：2008-06-01

Applicant: ZHI-YONG ZHOU ,  QIAO-LI DING

Inventor： ZHI-YONG ZHOU ,  QIAO-LI DING

IPC: F21V29/00

CPC classification number: F21V29/004 ,  F21K9/00 ,  F21V29/51 ,  F21V29/763 ,  F21Y2115/10

Abstract: A heat dissipation device includes a heat conductive member, a fin unit coupled to a bottom surface of the heat conductive member and a plurality of LED modules attached to a top surface of the heat conductive member. The heat conductive member consists of a first plate, a second plate parallel to the first plate and a plurality of posts sandwiched between the first and second plates. Peripheries of the first and second plate are in a hermetical conjunction with each other to form a chamber containing a phase-changeable working fluid therein. The first and second plates therein define a plurality of through orifices. The posts each define therein a screwed orifice which is in alignment with corresponding through orifices of the first and second plates respectively and threadedly receives a screw extending through the LED module.

Abstract translation: 散热装置包括导热构件，耦合到导热构件的底表面的翅片单元和附接到导热构件的顶表面的多个LED模块。 导热构件包括第一板，平行于第一板的第二板和夹在第一板和第二板之间的多个柱。 第一和第二板的周边彼此密封结合以形成其中包含相变工作流体的室。 其中的第一和第二板限定多个通孔。 所述柱分别在其中限定有螺纹孔口，所述螺纹孔口分别对应于所述第一和第二板的对应的通孔，并且螺纹地容纳延伸穿过所述LED模块的螺钉。

公开(公告)号：US20090166008A1

公开(公告)日：2009-07-02

申请号：US11964913

申请日：2007-12-27

Applicant: CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

Inventor： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC: F28D15/04 ,  H01L23/427

CPC classification number: F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat spreader for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, a working liquid contained between the lower plate and the upper plate, and a wick structure formed between the lower plate and the upper plate. Each of the upper plate and the lower plate defines a cavity receiving a portion of the wick structure therein, and a plurality of grooves extending radially from the cavity to a periphery thereof.

Abstract translation: 用于冷却电子部件的散热器包括下板，固定在下板上的上板，容纳在下板和上板之间的工作液，以及形成在下板与上板之间的芯结构。 上板和下板中的每一个限定了容纳其中的芯结构的一部分的空腔，以及从空腔径向延伸到其周边的多个凹槽。

公开(公告)号：US20090095959A1

公开(公告)日：2009-04-16

申请号：US11964836

申请日：2007-12-27

Applicant: CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

Inventor： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC: H01L33/00 ,  F28F7/00

CPC classification number: F21K9/00 ,  F21V29/51 ,  F21V29/75 ,  F21V29/763 ,  F21Y2115/10 ,  F28D15/0233 ,  F28F3/02 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation device for removing heat from LED chips includes a heat sink and a plurality of substrates. The heat sink comprises a base plate. A plurality of fins extends upwardly from the base plate. The substrates each have a unidirectional heat transfer and are attached to a bottom face of the heat sink. Each of the substrates defines a first wall on which The LED chips are mounted and a second wall coupled to the heat sink. The substrates only transfer heat from the first wall to the second wall and restrict the heat transfer in a reverse direction. When the LED chips generate heat, the heat is transferred to the fins of the heat sink via the unidirectional substrates to lower temperature of the LED chips.

Abstract translation: 用于从LED芯片除去热量的散热装置包括散热器和多个基板。 散热器包括基板。 多个翅片从基板向上延伸。 基板各自具有单向热传递并且附接到散热器的底面。 每个基板限定了其上安装有LED芯片的第一壁和耦合到散热器的第二壁。 基板仅将热量从第一壁传递到第二壁并限制相反方向的热传递。 当LED芯片产生热量时，热量通过单向基板传递到散热器的散热片，降低LED芯片的温度。

公开(公告)号：US20090095448A1

公开(公告)日：2009-04-16

申请号：US11959434

申请日：2007-12-18

Applicant: CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

Inventor： CHENG-TIEN LAI ,  ZHI-YONG ZHOU ,  QIAO-LI DING

IPC: F28D15/00

CPC classification number: F21V29/763 ,  F21K9/00 ,  F21V29/75 ,  F21Y2113/00 ,  F21Y2115/10 ,  F28D15/0233 ,  F28F3/02 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation device for removing heat from LED chips includes a finned heat sink, a plurality of heat pipes and a plurality of heat conductive substrates. The heat sink comprises a base plate and a plurality of fins formed on the base plate. The heat pipes which transfer heat in a unidirectional manner are embedded in the base plate. Each of the heat pipes defines a first wall and a second wall coupled to the heat sink. The heat pipes only transfer heat from the first walls to the second walls and restrict a heat transfer in a reversed direction. The substrates are in contact with first walls of the heat pipes. The LED chips are mounted on the substrates. When the LED chips generate heat, the heat is transferred to the fins via the unidirectional heat pipes to lower the temperature of the LED chips.

Abstract translation: 用于从LED芯片除去热量的散热装置包括翅片式散热器，多个热管和多个导热基板。 散热器包括基板和形成在基板上的多个散热片。 将单向传热的热管嵌入基板中。 每个热管限定了耦合到散热器的第一壁和第二壁。 热管仅将热量从第一壁传递到第二壁并限制相反方向的热传递。 基板与热管的第一壁接触。 LED芯片安装在基板上。 当LED芯片产生热量时，热量通过单向热管传递到散热片，以降低LED芯片的温度。

公开(公告)号：US07457122B2

公开(公告)日：2008-11-25

申请号：US11309225

申请日：2006-07-13

Applicant: Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

Inventor： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC: H05K7/20

CPC classification number: G11C5/143 ,  H01L23/3672 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (14) thereon, and first and second heat-dissipation plates (20), (30) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook (24) extending from a side thereof and the first hook includes a resisting portion (242) extending from an end of the first heat-dissipation plate and a first engaging portion (244) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion (34) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.

Abstract translation: 存储模块组件包括其上具有发热电子部件（14）的印刷电路板（10）和安装在印刷电路板的相对侧上的第一和第二散热板（20），（30）。 第一散热板包括从其一侧延伸的第一钩（24），第一钩包括从第一散热板的端部延伸的阻挡部分（242）和从第一散热板的一端延伸的第一接合部分（244） 用于抵抗印刷电路板和第二散热板的抵抗部分的自由端。 第二散热板在其一侧限定了与第一钩接合的凹部（34）。 第一和第二散热板的另一侧彼此接合以将印刷电路板夹在第一和第二散热板之间。

公开(公告)号：US07438449B2

公开(公告)日：2008-10-21

申请号：US11621759

申请日：2007-01-10

Applicant: Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

Inventor： Cheng-Tien Lai ,  Zhi-Yong Zhou ,  Qiao-Li Ding

IPC: B60Q1/06

CPC classification number: F21V29/004 ,  F21V17/164 ,  F21V29/51 ,  F21V29/763 ,  F21Y2115/10 ,  Y10S362/80

Abstract: An LED module includes a latching component, a frame holding an LED thereon, a heat spreader located in the latching component and a heat transfer member having a heat-dissipating unit remote from the LED and a heat pipe thermally connecting with the heat spreader, the LED and the heat-dissipating unit. The latching component cooperates with the heat spreader to tightly press the frame being attached on the heat spreader. The heat transfer member thermally connects with the heat spreader and transfers heat from the LED to an ambient environment. The latching component has two spring pieces pushing the frame toward the heat spreader and the heat pipe. The spring pieces electrically engage with the frame to thereby electrically connect with the LED.

Abstract translation: LED模块包括闩锁部件，保持LED的框架，位于闩锁部件中的散热器和具有远离LED的散热单元和与散热器热连接的热管的传热部件， LED和散热单元。 闩锁部件与散热器配合，以紧紧地按压附着在散热器上的框架。 传热构件与散热器热连接并将热量从LED传递到周围环境。 闩锁部件具有两个弹簧片，将框架推向散热器和热管。 弹簧片与框架电接合，从而与LED电连接。