公开(公告)号：US07863399B2

公开(公告)日：2011-01-04

申请号：US10584655

申请日：2004-12-20

申请人： Yoshitsugu Morita ,  Minoru Isshiki ,  Hiroshi Ueki ,  Hiroji Enami

发明人： Yoshitsugu Morita ,  Minoru Isshiki ,  Hiroshi Ueki ,  Hiroji Enami

IPC分类号： C08G77/00

CPC分类号： C08L63/00 ,  C08G59/306 ,  C08G59/3254 ,  C08L83/06 ,  C08L83/00

摘要： A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.

摘要翻译： 一种可固化有机硅组合物，其包含：（A）具有支链分子结构并在一个分子中含有至少两个具有酚羟基的一价烃基的有机聚硅氧烷; （B）具有至少两个不含芳环的环氧基的单价羟基的直链有机聚硅氧烷; 和（C）固化促进剂。

公开(公告)号：US07863392B2

公开(公告)日：2011-01-04

申请号：US11994092

申请日：2006-06-22

申请人： Koji Nakanishi ,  Makoto Yoshitake ,  Takashi Sagawa ,  Kasumi Takeuchi ,  Masashi Murakami

发明人： Koji Nakanishi ,  Makoto Yoshitake ,  Takashi Sagawa ,  Kasumi Takeuchi ,  Masashi Murakami

IPC分类号： C08L83/00

CPC分类号： C08L83/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  G02B1/04 ,  H01L33/56 ,  H01L2224/48091 ,  C08L83/00 ,  H01L2924/00014

摘要： A curable organopolysiloxane resin composition having a viscosity at 25° C. in the range of 0.001 to 5,000 Pa·s, a total acid number as specified by JIS K 2501 (1992) in the range of 0.0001 to 0.2 mg/g, and light transmittance in a cured state equal to or greater than 80%; an optical part comprised of a cured body of the aforementioned composition. The curable organopolysiloxane resin composition of the invention is characterized by good transparency, low decrease in transmittance when exposed to high temperatures, and excellent adhesion when required.

摘要翻译： 在25℃下的粘度为0.001〜5000Pa·s，JIS K2501（1992）规定的总酸值为0.0001〜0.2mg / g的可固化的有机聚硅氧烷树脂组合物，以及光 在固化状态下的透光率等于或大于80％; 由上述组合物的固化体构成的光学部件。 本发明的可固化的有机基聚硅氧烷树脂组合物的特征在于透明度高，当暴露于高温时透射率的降低低，当需要时粘合性优异。

公开(公告)号：US07847116B2

公开(公告)日：2010-12-07

申请号：US11576571

申请日：2005-10-04

申请人： Keiji Wakita ,  Yasushi Sugiura

发明人： Keiji Wakita ,  Yasushi Sugiura

IPC分类号： C07F7/10

CPC分类号： C07F7/0816 ,  Y02P20/55

摘要： To provide an aminoaryl containing organosilicon compound with high efficiency, after protecting amino groups of a haloaniline compound with a specific compound, to form a Grignard reagent and to deprotect the aforementioned groups by reacting the Grignard reagent with a silicon compound.

摘要翻译： 为了提供具有高效率的含氨基芳基的有机硅化合物，在用特定化合物保护卤代苯胺化合物的氨基后，形成格氏试剂，并通过使格利雅试剂与硅化合物反应来使上述组脱保护。

公开(公告)号：US07771794B2

公开(公告)日：2010-08-10

申请号：US10582154

申请日：2004-12-10

申请人： Toshinori Watanabe ,  Takuya Ogawa ,  Kasumi Takeuchi ,  Makoto Yoshitake ,  Shedric O. Glover ,  Mary Kay Tomalia

发明人： Toshinori Watanabe ,  Takuya Ogawa ,  Kasumi Takeuchi ,  Makoto Yoshitake ,  Shedric O. Glover ,  Mary Kay Tomalia

IPC分类号： C08G77/04 ,  G02B6/028 ,  C08J7/04

CPC分类号： C08L83/06 ,  C08L2666/28

摘要： The present invention relates to an active energy ray-curable organopolysiloxane resin composition that comprises an organopolysiloxane resin having an epoxy group and an aromatic hydrocarbon group and a photopolymerization initiator, as well as to a light-transmitting component that comprises cured bodies produced by irradiating the aforementioned organopolysiloxane resin with active-energy rays in the presence of the aforementioned photopolymerization initiator, and to a method for manufacturing the aforementioned light-transmitting component.

摘要翻译： 本发明涉及包含具有环氧基和芳族烃基的有机聚硅氧烷树脂和光聚合引发剂的活性能量射线固化型有机聚硅氧烷树脂组合物，以及包含通过照射 在上述光聚合引发剂的存在下，具有活性能量射线的上述有机聚硅氧烷树脂，以及上述光透射性成分的制造方法。

公开(公告)号：US20100155653A1

公开(公告)日：2010-06-24

申请号：US12714174

申请日：2010-02-26

申请人： Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

发明人： Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

IPC分类号： C09K5/00 ,  H01B1/22

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08K9/04 ,  C09J183/04 ,  H05K3/321

摘要： A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.

摘要翻译： 通过机械化学反应用氧化抑制剂对银基粉末进行表面处理。 制备银基粉末的方法包括使用氧化抑制剂的有机溶液作为润滑剂，向银基粉末施加机械能，并用所述氧化抑制剂对银基粉末进行表面处理 的机械化学反应。

公开(公告)号：US07659419B2

公开(公告)日：2010-02-09

申请号：US10566027

申请日：2004-07-30

申请人： Makoto Iwai ,  Stephen P. Ferguson

发明人： Makoto Iwai ,  Stephen P. Ferguson

IPC分类号： C07F7/02

CPC分类号： C07F7/025 ,  C07F7/20

摘要： A stabilizing agent for a hydroalkoxysilane such as triethoxysilane and trimethoxysilane characterized by comprising a carboxylate such as an alkali metal salt or an alkali earth metal salt of a carboxylic acid having 1 to 18 carbon atoms; a method for stabilizing a hydroalkoxysilane by combining it with a carboxylate; and a hydroalkoxysilane stabilized with a carboxylate.

摘要翻译： 其特征在于包含羧酸盐如具有1至18个碳原子的羧酸的碱金属盐或碱土金属盐的氢化烷氧基硅烷如三乙氧基硅烷和三甲氧基硅烷的稳定剂; 一种通过将其与羧酸酯组合来稳定氢烷氧基硅烷的方法; 和用羧酸酯稳定的氢烷氧基硅烷。

公开(公告)号：US07651958B2

公开(公告)日：2010-01-26

申请号：US10584032

申请日：2004-12-07

申请人： Yoshitsuga Morita ,  Katsutoshi Mine ,  Junji Nakanishi ,  Hiroji Enami

发明人： Yoshitsuga Morita ,  Katsutoshi Mine ,  Junji Nakanishi ,  Hiroji Enami

IPC分类号： H01L21/31

CPC分类号： H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08L83/04 ,  H01L21/566 ,  H01L23/3128 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/181 ,  C08L83/00 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/85

摘要： A method of manufacturing a semiconductor device sealed in a cured silicone body by placing a semiconductor device into a mold and subjecting a curable silicone composition that fills the spaces between said mold and said semiconductor device to compression molding, wherein the curable silicone composition comprises the following components: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) a platinum-type catalyst; and (D) a filler, wherein either at least one of components (A) and (B) contains a T-unit siloxane and/or Q-unit siloxane. By the utilization this method, a sealed semiconductor device is free of voids in the sealing material, and a thickness of the cured silicone body can be controlled.

摘要翻译： 一种制造半导体器件的方法，其通过将半导体器件放置在模具中并对填充所述模具和所述半导体器件之间的空间的可固化硅氧烷组合物进行压塑而密封在固化的硅氧烷体中，其中所述可固化有机硅组合物包含以下 组分：（A）每分子具有至少两个烯基的有机聚硅氧烷; （B）每分子具有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）铂型催化剂; 和（D）填料，其中组分（A）和（B）中的至少一种含有T单元硅氧烷和/或Q-单元硅氧烷。 通过利用该方法，密封半导体器件在密封材料中没有空隙，并且可以控制固化的硅氧烷体的厚度。

公开(公告)号：US07625986B2

公开(公告)日：2009-12-01

申请号：US10581422

申请日：2004-11-29

申请人： Makoto Yoshitake ,  Koji Nakanishi ,  Hisataka Nakashima ,  Hideki Kobayashi ,  Masashi Murakami ,  Kasumi Takeuchi

发明人： Makoto Yoshitake ,  Koji Nakanishi ,  Hisataka Nakashima ,  Hideki Kobayashi ,  Masashi Murakami ,  Kasumi Takeuchi

IPC分类号： C08G77/12

CPC分类号： C08L83/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08L83/00

摘要： An addition-curable organopolysiloxane resin composition having, in a state of cued body, a hardness of 60 to 100 at 25 degree C. and 40 to 100 at 150 degree C. as measured in accordance with the provisions of ASTM D2240-86, said composition comprising: (A) 100 parts by weight of an organopolysiloxane resin comprised of at least alkenyl groups and phenyl groups; (B) 10 to 50 parts by weight of an organooligosiloxane comprised of at least alkeyl groups and phenyl groups; (C) 20 to 100 parts by weight of an organohydrogenoligosiloxane of organohydrogenpolysiloxane; and (D) an addition-reaction catalyst in a catalytic quantity; an optical material that is comprised of a cured body produced from aforementioned components (A), (B), and (C) and possesses the aforementioned characteristics.

摘要翻译： 一种可加成固化的有机基聚硅氧烷树脂组合物，其具有在保证身体状态下在25℃下的硬度为60至100，在150℃下为40至100，根据ASTM D2240-86的规定测量， 组合物，其包含：（A）100重量份至少包含烯基和苯基的有机聚硅氧烷树脂; （B）10至50重量份至少包含烷基和苯基的有机低聚硅氧烷; （C）20〜100重量份的有机氢聚硅氧烷的有机氢聚硅氧烷; 和（D）催化剂的加成反应催化剂; 由上述（A），（B）和（C）成分制成的固化体构成的光学材料，具有上述特性。

公开(公告)号：US07582697B2

公开(公告)日：2009-09-01

申请号：US11311216

申请日：2005-12-19

申请人： Kazuo Hirai ,  Hideo Miyazaki ,  Hiroaki Yoshida ,  Noriyuki Suganuma

发明人： Kazuo Hirai ,  Hideo Miyazaki ,  Hiroaki Yoshida ,  Noriyuki Suganuma

IPC分类号： C08K3/34 ,  C08K5/5425

CPC分类号： C08K3/36 ,  C08L83/00 ,  C09J183/04 ,  C08L83/04

摘要： A silicone rubber adhesive film comprising a composition formed from; (A) organopolysiloxane gum that has at least two alkenyl groups in each molecule; (B) wet-method hydrophobic reinforcing silica that has a specific surface area of at least 200 m2/g; (C) organohydrogenpolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule; (D) mixture or reaction mixture from: (a) organopolysiloxane that has a branched molecular chain structure and that contains at least one silicon-bonded alkenyl group in each molecule and at least one silicon-bonded hydrolyzable group in each molecule, and (b) a silicon-containing compound that contains at least one silicon-bonded epoxy-functional hydrocarbon group and at least one silicon-bonded hydrolyzable group; and (E) curing accelerator.

摘要翻译： 一种硅橡胶粘合膜，其包含由下列物质形成的组合物： （A）在每个分子中具有至少两个烯基的有机聚硅氧烷胶; （B）具有至少200m 2 / g的比表面积的湿法疏水性增强二氧化硅; （C）在每个分子中含有至少两个与硅键合的氢原子的有机氢聚硅氧烷; （D）混合物或反应混合物：（a）具有支链分子链结构并且在每个分子中含有至少一个与硅键合的烯基和每个分子中至少一个硅键合的可水解基团的有机聚硅氧烷，和（b ）含有至少一个与硅键合的环氧官能烃基和至少一个硅键合的可水解基团的含硅化合物; 和（E）固化促进剂。

公开(公告)号：US07550548B2

公开(公告)日：2009-06-23

申请号：US11765811

申请日：2007-06-20

申请人： Hidekatsu Hatanaka ,  Harumi Kodama ,  Masayuki Onishi ,  Hiroji Enami ,  Koji Nakanishi

发明人： Hidekatsu Hatanaka ,  Harumi Kodama ,  Masayuki Onishi ,  Hiroji Enami ,  Koji Nakanishi

IPC分类号： C08G77/04

CPC分类号： C08K5/0025 ,  C08G77/045 ,  C08G77/06 ,  C08G77/12 ,  C08G77/16 ,  C08G77/18 ,  C08G77/24 ,  C08G77/70 ,  C08K3/016 ,  C08K5/0066 ,  C08K9/10 ,  C08L83/04 ,  Y10S528/901 ,  C08L83/00 ,  C08L2666/54 ,  C08L2666/52 ,  C08L2666/44

摘要： A room-temperature-curable organopolysiloxane composition comprising: (A) 100 parts by weight of an organopolysiloxane having a viscosity of from 100 to 500,000 mPa·s at 25° C. and having in one molecule 1.5 or more end groups represented by the general formula: (X)aR13-aSi—, where each X is independently a hydroxyl group or a hydrolyzable group, each R1 is independently a monovalent hydrocarbon group or a halogen-substituted monovalent hydrocarbon group, and a is 1, 2, or 3; (B) 0.01 to 40 parts by weight of a cross-linking agent selected from a silane or a siloxane oligomer where the cross-linking agent has three or more silicon-bonded hydrolyzable groups per molecule; and (C) microparticles of thermoplastic resin containing a platinum compound in such an amount that the content of metallic platinum in component (C) is within the range of 0.01 to 5 wt. %, where the microparticles have an average diameter from 0.1 to 20 μm, component (C) is present in an amount sufficient to provide 1 to 2,000 ppm of metallic platinum in the composition; and (D) 5 to 300 parts by weight of an inorganic powder.

摘要翻译： 一种室温可固化的有机基聚硅氧烷组合物，其包含：（A）100重量份在25℃下粘度为100至500,000mPa.s并且在一个分子中具有由一般分子表示的1.5个或更多个端基的有机聚硅氧烷 公式：<？in-line-formula description =“In-line Formulas”end =“lead”？>（X）aR13-aSi-，其中<？in-line-formula description =“In-line Formulas”end = “尾”→“X”各自独立地为羟基或可水解基团，每个R 1独立地为一价烃基或卤素取代的一价烃基，a为1,2或3; （B）0.01〜40重量份选自硅烷或硅氧烷低聚物的交联剂，其中交联剂每分子具有三个或更多个硅键合的可水解基团; 和（C）含有铂化合物的热塑性树脂微粒的量使得组分（C）中金属铂的含量在0.01至5重量％的范围内。 ％，其中微粒的平均直径为0.1-20μm，组分（C）的存在量足以在组合物中提供1至2,000ppm的金属铂; 和（D）5〜300重量份的无机粉末。