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公开(公告)号：US20150153407A1
公开(公告)日：2015-06-04
申请号：US14095389
申请日：2013-12-03
Inventor： Bo-Jr Huang , Nan-Hsin Tseng , Yen-Ling Liu
IPC: G01R31/307 , G01R1/04 , G01R1/07
CPC classification number: G01R31/307 , G01R1/07 , G01R31/3025
Abstract: A method for performing contactless signal testing includes receiving, with a testing pad of an integrated circuit, a signal within an electron beam, converting an electrical current created by the e-beam to a voltage with a number of diodes connected to a positive voltage supply, extracting a digital test signal from the voltage signal with a digital inverter, and passing the test signal to digital circuitry within the integrated circuit.
Abstract translation: 用于执行非接触信号测试的方法包括：利用集成电路的测试焊盘接收电子束内的信号，将由电子束产生的电流转换为具有连接到正电压源的多个二极管的电压 用数字逆变器从电压信号提取数字测试信号，并将测试信号传递到集成电路内的数字电路。
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Patent Agency Ranking
公开(公告)号：US20210335668A1
公开(公告)日：2021-10-28
申请号：US17371438
申请日：2021-07-09
Inventor： Bo-Jr Huang , William Wu Shen , Chin-Her Chien , Chin-Chou Liu , Yun-Han Lee
IPC: H01L21/768 , H01Q1/22 , H01Q9/04 , H01Q1/48 , H01L23/498 , H01L23/66 , H01L21/48 , H01L23/48 , H01L23/00
Abstract: The present disclosure relates to a semiconductor module. The semiconductor module includes an excitable element located on a first side of a substrate. A first ground structure is disposed between the first side of the substrate and the excitable element. The first ground structure includes a conductive via extending through the substrate and an interconnect disposed over a topmost surface of the conductive via facing away from the substrate. A second ground structure is located on a second side of the substrate, opposing the first side, and electrically coupled to the first ground structure.
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公开(公告)号：US09423452B2
公开(公告)日：2016-08-23
申请号：US14095389
申请日：2013-12-03
Inventor： Bo-Jr Huang , Nan-Hsin Tseng , Yen-Ling Liu
IPC: G01R31/305 , G01R31/307 , G01R31/302 , G01R1/07
CPC classification number: G01R31/307 , G01R1/07 , G01R31/3025
Abstract: A method for performing contactless signal testing includes receiving, with a testing pad of an integrated circuit, a signal within an electron beam, converting an electrical current created by the e-beam to a voltage with a number of diodes connected to a positive voltage supply, extracting a digital test signal from the voltage signal with a digital inverter, and passing the test signal to digital circuitry within the integrated circuit.
Abstract translation: 用于执行非接触信号测试的方法包括：利用集成电路的测试焊盘接收电子束内的信号，将由电子束产生的电流转换为具有连接到正电压源的多个二极管的电压 用数字逆变器从电压信号提取数字测试信号，并将测试信号传递到集成电路内的数字电路。
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公开(公告)号：US11715668B2
公开(公告)日：2023-08-01
申请号：US17371438
申请日：2021-07-09
Inventor： Bo-Jr Huang , William Wu Shen , Chin-Her Chien , Chin-Chou Liu , Yun-Han Lee
IPC: H01Q1/48 , H01L21/768 , H01L23/498 , H01L21/48 , H01L23/66 , H01Q1/22 , H01Q9/04 , H01L23/48 , H01L23/00
CPC classification number: H01L21/76898 , H01L21/486 , H01L23/49827 , H01L23/66 , H01Q1/2283 , H01Q1/48 , H01Q9/0407 , H01L23/481 , H01L24/13 , H01L24/16 , H01L2223/6677 , H01L2224/131 , H01L2224/16225 , H01L2924/1423 , H01L2924/157 , H01L2924/15311 , H01L2924/15788 , H01L2224/131 , H01L2924/014
Abstract: The present disclosure relates to a semiconductor module. The semiconductor module includes an excitable element located on a first side of a substrate. A first ground structure is disposed between the first side of the substrate and the excitable element. The first ground structure includes a conductive via extending through the substrate and an interconnect disposed over a topmost surface of the conductive via facing away from the substrate. A second ground structure is located on a second side of the substrate, opposing the first side, and electrically coupled to the first ground structure.
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公开(公告)号：US09714979B2
公开(公告)日：2017-07-25
申请号：US15243521
申请日：2016-08-22
Inventor： Bo-Jr Huang , Nan-Hsin Tseng , Yen-Ling Liu
IPC: G01R31/305 , G01R31/307 , G01R1/07 , G01R31/302
CPC classification number: G01R31/307 , G01R1/07 , G01R31/3025
Abstract: A method for performing contactless signal testing includes receiving, with a testing pad of an integrated circuit, a signal within a beam. The method further includes converting, with a number of diodes connected to a positive voltage supply, an electrical current signal created by the electron beam to a voltage signal, wherein the number of diodes includes a diode stack of multiple diodes. The method further includes extracting, with a digital inverter, a test signal from the voltage signal.
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公开(公告)号：US20160356845A1
公开(公告)日：2016-12-08
申请号：US15243521
申请日：2016-08-22
Inventor： Bo-Jr Huang , Nan-Hsin Tseng , Yen-Ling Liu
IPC: G01R31/307 , G01R1/07
CPC classification number: G01R31/307 , G01R1/07 , G01R31/3025
Abstract: A method for performing contactless signal testing includes receiving, with a testing pad of an integrated circuit, a signal within a beam. The method further includes converting, with a number of diodes connected to a positive voltage supply, an electrical current signal created by the electron beam to a voltage signal, wherein the number of diodes includes a diode stack of multiple diodes. The method further includes extracting, with a digital inverter, a test signal from the voltage signal.
Abstract translation: 用于执行非接触式信号测试的方法包括使用集成电路的测试焊盘接收波束内的信号。 该方法还包括用连接到正电压源的多个二极管将由电子束产生的电流信号转换为电压信号，其中二极管的数量包括多个二极管的二极管堆叠。 该方法还包括用数字逆变器提取来自电压信号的测试信号。
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