公开(公告)号：US20240149314A1

公开(公告)日：2024-05-09

申请号：US18213853

申请日：2023-06-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunwoo Noh ,  Kyoungwoo Kim ,  Youngseok Jung ,  Youngjin Hong ,  Soochan Oh ,  Sungwoo Shin ,  Namhoon Lee ,  Bongju Lee

IPC: B08B13/00 ,  B08B1/00 ,  B08B1/04 ,  B08B3/02

CPC classification number: B08B13/00 ,  B08B1/002 ,  B08B1/04 ,  B08B3/02

Abstract: Provided is a substrate processing apparatus configured to process a substrate having a notch including a plurality of rollers contacting a circumference of the substrate and configured to rotate the substrate, a first sensor configured to sense an impact between the plurality of rollers and the substrate, and a signal processing unit configured to detect revolutions per unit time of the substrate, based on a first sensing signal output by the first sensor.

公开(公告)号：US11813714B2

公开(公告)日：2023-11-14

申请号：US17026554

申请日：2020-09-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hojoong Kim ,  Taesung Kim ,  Seokjun Hong ,  Junyong Kim ,  Donghyuk Jang ,  Youngjin Hong

IPC: B24B37/26

CPC classification number: B24B37/26

Abstract: A chemical mechanical polishing (CMP) apparatus and a CMP pad, the apparatus including a rotating plate; a CMP pad on an upper surface of the rotating plate; a rotating body facing the rotating plate and bringing a wafer into contact with the CMP pad to press the wafer; and a slurry supply configured to supply slurry to the CMP pad, wherein the CMP pad includes a pad body having a circular plate shape; a plurality of circular grooves on a bottom surface of the pad body, the plurality of circular grooves having a circular shape; and a connection groove connecting the plurality of circular grooves, the connection groove having a linear shape.