公开(公告)号：US20170062242A1

公开(公告)日：2017-03-02

申请号：US15172740

申请日：2016-06-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNG-HOO KIM ,  IL-SANG LEE ,  IN-GI KIM ,  KYOUNG-HWAN KIM ,  HYO-SAN LEE ,  SANG-WON BAE ,  TAE-HONG KIM ,  YONG-JUN CHOI

IPC: H01L21/67

CPC classification number: H01L21/6708 ,  H01L21/67017

Abstract: A chemical liquid supply apparatus includes a nozzle unit including a nozzle arm and an injection nozzle mounted in an end of the nozzle arm, a chemical liquid supply unit including a first chemical liquid tank accommodating a first chemical liquid and a second chemical liquid tank accommodating a second chemical liquid, and supplying the first chemical liquid and the second chemical liquid to the nozzle unit, and a mixer unit provided in the nozzle unit and discharging a process fluid by mixing the first chemical liquid and the second chemical liquid, wherein the mixer unit includes an in-line mixer mixing the first chemical liquid and the second chemical liquid that are continually injected from the chemical liquid supply unit, and a mixer pipe extending from the in-line mixer to the injection nozzle.

Abstract translation: 一种药液供给装置包括：喷嘴单元，包括喷嘴臂和安装在喷嘴臂的端部的喷嘴;药液供给单元，包括容纳第一药液的第一药液槽和容纳第一药液的第二药液箱， 第二化学液体，并且将第一化学液体和第二化学液体供给到喷嘴单元;以及混合器单元，其设置在喷嘴单元中，并且通过混合第一化学液体和第二化学液体来排出处理流体，其中混合器单元 包括混合从化学液体供应单元连续注入的第一化学液体和第二化学液体的串联混合器，以及从在线混合器延伸到喷嘴的混合管。

公开(公告)号：US20220189765A1

公开(公告)日：2022-06-16

申请号：US17357632

申请日：2021-06-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JI HOON JEONG ,  SEO HYUN KIM ,  SANG JINE PARK ,  YOUNG-HOO KIM ,  KUN TACK LEE

IPC: H01L21/02

Abstract: A substrate drying apparatus includes; a drying chamber configured to load a substrate and including a lower chamber and an upper chamber above the lower chamber, a supply port configured to supply a supercritical fluid into the drying chamber and including a main supply port and a sub-supply port horizontally spaced apart from the main supply port, wherein the main supply port penetrates a center portion of the upper chamber, and a first buffer member coupled to the upper chamber, vertically separated from the sub-supply port, and vertically overlapping the sub-supply port, such that supercritical fluid vertically introduced into the drying chamber through the sub-supply port is impeded by the first buffer member to change a flow direction for the supercritical fluid.

公开(公告)号：US20230046060A1

公开(公告)日：2023-02-16

申请号：US17706336

申请日：2022-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： SANGJINE PARK ,  SEUNGMIN SHIN ,  JIHOON JEONG ,  YOUNG-HOO KIM ,  KUNTACK LEE

IPC: G03F7/30 ,  H01L21/687 ,  H01L21/68 ,  H02J7/00 ,  H02J50/20 ,  H01M10/46 ,  H01M10/44

Abstract: A substrate rotating apparatus may include a spin chuck supporting a substrate and a stage rotating the spin chuck about an axis parallel to a first direction. The spin chuck may include a first magnetic element and a substrate supporting member thereon. The stage may include a stage housing, a rotating part rotating about the axis, an inner control unit controlling rotation of the rotating part, a power supplying part supplying a power to the rotating part, and a wireless communication part receiving a control signal from an outside and transmitting the control signal to the inner control unit. The rotating part may include a second magnetic element spaced apart from the first magnetic element and a rotation driver rotating the second magnetic element. The rotating part, the inner control unit, the power supplying part, and the wireless communication part may be placed in the stage housing.

公开(公告)号：US20220406623A1

公开(公告)日：2022-12-22

申请号：US17590263

申请日：2022-02-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SANGJINE PARK ,  JIHOON JEONG ,  YOUNG-HOO KIM ,  KUNTACK LEE

IPC: H01L21/67 ,  H01L21/02

Abstract: A wafer drying apparatus is disclosed. The wafer drying apparatus may include a drying chamber housing providing a drying space, in which a wafer is disposed, a supercritical fluid supplying part configured to supply a supercritical fluid into the drying space, a wafer heating part configured to heat the wafer disposed in the drying space, and a wafer cooling part configured to cool the wafer disposed in the drying space. The wafer cooling part may include a cooling plate disposed below a place, on which the wafer is loaded, and a cooling conduit inserted in the cooling plate.