公开(公告)号：US20230046060A1

公开(公告)日：2023-02-16

申请号：US17706336

申请日：2022-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： SANGJINE PARK ,  SEUNGMIN SHIN ,  JIHOON JEONG ,  YOUNG-HOO KIM ,  KUNTACK LEE

IPC: G03F7/30 ,  H01L21/687 ,  H01L21/68 ,  H02J7/00 ,  H02J50/20 ,  H01M10/46 ,  H01M10/44

Abstract: A substrate rotating apparatus may include a spin chuck supporting a substrate and a stage rotating the spin chuck about an axis parallel to a first direction. The spin chuck may include a first magnetic element and a substrate supporting member thereon. The stage may include a stage housing, a rotating part rotating about the axis, an inner control unit controlling rotation of the rotating part, a power supplying part supplying a power to the rotating part, and a wireless communication part receiving a control signal from an outside and transmitting the control signal to the inner control unit. The rotating part may include a second magnetic element spaced apart from the first magnetic element and a rotation driver rotating the second magnetic element. The rotating part, the inner control unit, the power supplying part, and the wireless communication part may be placed in the stage housing.

公开(公告)号：US20220406623A1

公开(公告)日：2022-12-22

申请号：US17590263

申请日：2022-02-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SANGJINE PARK ,  JIHOON JEONG ,  YOUNG-HOO KIM ,  KUNTACK LEE

IPC: H01L21/67 ,  H01L21/02

Abstract: A wafer drying apparatus is disclosed. The wafer drying apparatus may include a drying chamber housing providing a drying space, in which a wafer is disposed, a supercritical fluid supplying part configured to supply a supercritical fluid into the drying space, a wafer heating part configured to heat the wafer disposed in the drying space, and a wafer cooling part configured to cool the wafer disposed in the drying space. The wafer cooling part may include a cooling plate disposed below a place, on which the wafer is loaded, and a cooling conduit inserted in the cooling plate.