公开(公告)号：US20250133850A1

公开(公告)日：2025-04-24

申请号：US18676885

申请日：2024-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanguk KIM

IPC: H01L27/146

Abstract: A semiconductor package includes a package substrate, an image sensor including a body portion on the package substrate, color filters on the body portion, microlenses respectively on the color filters, a light blocking filter pattern peripheral to the microlenses in a horizontal direction, a capping layer covering at least a portion of the light blocking filter pattern, an upper thin film covering at least a portion of the capping layer, and connection pads peripheral to the light blocking filter pattern in the horizontal direction, a glass cover on the image sensor, and an adhesive structure on the body portion spaced apart from the capping layer and the light blocking filter pattern in the horizontal direction, the adhesive structure covering at least a portion of the connection pads, between the image sensor and the glass cover.

公开(公告)号：US20240350108A1

公开(公告)日：2024-10-24

申请号：US18759422

申请日：2024-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanguk KIM

IPC: A61B6/00 ,  A61B6/42

CPC classification number: A61B6/542 ,  A61B6/4241

Abstract: Provided are an X-ray detector automatically correcting an automatic exposure control (AEC) sensing area, based on an image obtained using an AEC sensor array, and a method of operating the X-ray detector. The X-ray detector may detect, using an AEC sensor array, X-rays that have passed through an object, obtain a one-dimensional (1D) image by quantifying a dose of the detected X-rays into a signal value, identify a symmetric point from the 1D image, based on a signal value for each pixel of the 1D image, and adjust respective locations of a plurality of AEC sensing areas so that the plurality of AEC sensing areas are symmetrical to each other with respect to the identified symmetric point.

公开(公告)号：US20240341035A1

公开(公告)日：2024-10-10

申请号：US18748769

申请日：2024-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanguk KIM ,  Youngchul KIM ,  Youngwoong KIM ,  Miryeong MOON ,  Doil KU ,  Younghak PARK

IPC: H05K1/14 ,  H05K5/02

CPC classification number: H05K1/14 ,  H05K5/0217 ,  H05K2201/10356

Abstract: This electronic device is an electronic device comprising a coaxial cable connecting a first printed circuit board and a second printed circuit board, wherein a clamp is applied to the coaxial cable, the clamp and a support body are connected to the coaxial cable, and a protruding rib and a recess may be formed at the part of the support body where the clamp is positioned.

公开(公告)号：US20240395789A1

公开(公告)日：2024-11-28

申请号：US18794455

申请日：2024-08-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanguk KIM

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

Abstract: A semiconductor package includes a package substrate, first and second bumps on a lower surface of the package substrate, a semiconductor chip on an upper surface of the package substrate, first and second connection patterns on the upper surface of the package substrate, a molding on the upper surface of the package substrate and covering the semiconductor chip, a warpage control layer on the molding, an upper insulating layer on the warpage control layer, a first opening passing through the upper insulating layer and exposing an upper surface of the warpage control layer, a second opening overlapping the first opening in a top view, the second opening passing through the warpage control layer and exposing the first connection pattern, and a third opening passing through the upper insulating layer and exposing the second connection pattern.

公开(公告)号：US20220077130A1

公开(公告)日：2022-03-10

申请号：US17225375

申请日：2021-04-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanguk KIM

IPC: H01L25/18 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L23/538

Abstract: A semiconductor package includes a package substrate, first and second bumps on a lower surface of the package substrate, a semiconductor chip on an upper surface of the package substrate, first and second connection patterns on the upper surface of the package substrate, a molding on the upper surface of the package substrate and covering the semiconductor chip, a warpage control layer on the molding, an upper insulating layer on the warpage control layer, a first opening passing through the upper insulating layer and exposing an upper surface of the warpage control layer, a second opening overlapping the first opening in a top view, the second opening passing through the warpage control layer and exposing the first connection pattern, and a third opening passing through the upper insulating layer and exposing the second connection pattern.

公开(公告)号：US20180062684A1

公开(公告)日：2018-03-01

申请号：US15686509

申请日：2017-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanguk KIM

IPC: H04B1/3827 ,  H04W52/36 ,  H01Q1/24

CPC classification number: H04B1/3838 ,  H01Q1/245 ,  H04M2250/12 ,  H04W52/146 ,  H04W52/283 ,  H04W52/288 ,  H04W52/367

Abstract: An electronic device and a grip recognition method for reducing the SAR of the electronic device are provided. The electronic device of the present disclosure includes an antenna, a coupler, a processor electrically coupled to the antenna and the coupler, and a memory electrically coupled to the processor. The memory stores instructions that, when executed by the processor, cause the processor to detect a change of a transmit power value using the coupler during transmission of a radio signal through the antenna. The instructions further cause the processor to determine whether the electronic device is being gripped based on the change of the transmit power value.

公开(公告)号：US20240118730A1

公开(公告)日：2024-04-11

申请号：US18232139

申请日：2023-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joosung KIM ,  Sanguk KIM ,  Hyoseok NA

IPC: G06F1/16

CPC classification number: G06F1/1637 ,  G06F1/1626 ,  G06F1/1658 ,  H04M1/0266

Abstract: An electronic device includes a display; a conductive plate supporting the display; a bracket including a surface and a structure at least partially removed from the surface, wherein the surface faces toward the conductive plate and is spaced apart from the conductive plate; a connecting member crossing the structure along the surface and connecting the conductive plate and the bracket, the connecting member including a first conductive portion and a second conductive portion; and a conductive tape between the connecting member and the bracket, wherein the first conductive portion overlaps with the structure when viewed from a first direction toward the display and is at least partially inserted into the structure, at least part of the first conductive portion contacts the conductive plate, and the second conductive portion extends from the first conductive portion along a surface of the bracket and has an end attached to the bracket through the conductive tape.

公开(公告)号：US20230326916A1

公开(公告)日：2023-10-12

申请号：US18210132

申请日：2023-06-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanguk KIM

IPC: H01L25/18 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L23/538

CPC classification number: H01L25/18 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/3128 ,  H01L24/06 ,  H01L24/73 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/49822 ,  H01L2224/16146 ,  H01L2924/3511 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2224/0401 ,  H01L2224/06515 ,  H01L2224/73204 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16148

Abstract: A semiconductor package includes a package substrate, first and second bumps on a lower surface of the package substrate, a semiconductor chip on an upper surface of the package substrate, first and second connection patterns on the upper surface of the package substrate, a molding on the upper surface of the package substrate and covering the semiconductor chip, a warpage control layer on the molding, an upper insulating layer on the warpage control layer, a first opening passing through the upper insulating layer and exposing an upper surface of the warpage control layer, a second opening overlapping the first opening in a top view, the second opening passing through the warpage control layer and exposing the first connection pattern, and a third opening passing through the upper insulating layer and exposing the second connection pattern.

公开(公告)号：US20220374095A1

公开(公告)日：2022-11-24

申请号：US17673053

申请日：2022-02-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanguk KIM ,  Younghak PARK ,  Joosung KIM ,  Doil KU ,  Younggil GI ,  Yonghee YANG ,  Youngsub LEE

IPC: G06F3/044

Abstract: According to various embodiments of the disclosure, an electronic device may comprise: a housing including: a first surface, a second surface facing in a direction opposite to the first surface, and a side surface at least partially surrounding a space between the first surface and the second surface; a printed circuit board disposed between the first surface and the second surface; a first sensing element including a plurality of conductive vias arranged in parallel to the side surface in at least a portion of an edge of the printed circuit board; and a grip sensor electrically connected with the first sensing element. The grip sensor may be configured to detect a change in capacitance due to an approach or contact state of an external object to the housing, in at least a portion of the side surface of the housing using the first sensing element.

公开(公告)号：US20200036400A1

公开(公告)日：2020-01-30

申请号：US16491667

申请日：2018-03-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanguk KIM ,  Sangsoon KIM ,  Taekho LEE ,  Hyoseok NA

IPC: H04B1/00 ,  H04B1/401 ,  H01Q1/24

Abstract: Various embodiments of the present invention relate to an electronic device including an antenna impedance matching circuit. The electronic device may comprise: at least one interface; at least one detection circuit for detecting a connection of at least one external device to the at least one interface; at least two matching circuits; an antenna; and a switch module for receiving, from the at least one detection circuit, at least one signal corresponding to whether the at least one external device is connected to the at least one interface, and for connecting the antenna to a matching circuit, among the at least two matching circuits, corresponding to the at least one signal. Various other embodiments are also possible.