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公开(公告)号:US20240290833A1
公开(公告)日:2024-08-29
申请号:US18537552
申请日:2023-12-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minho CHOI , Kiseok LEE , Chansic YOON , Jaybok CHOI
IPC: H01L29/06 , H01L29/423 , H01L29/78 , H10B12/00
CPC classification number: H01L29/0649 , H01L29/4236 , H01L29/7855 , H10B12/482
Abstract: A semiconductor device includes device isolation layers extending in a first horizontal direction and spaced apart from each other in a second horizontal direction intersecting the first horizontal direction, active regions between the device isolation layers and spaced apart from each other in the first horizontal direction, insulating structures between the active regions, and a gate structure extending in a third horizontal direction between the first horizontal direction and the second horizontal direction and intersecting the active regions, wherein two side surfaces of each active region adjacent to each other define an acute angle, and wherein at least a portion of at least one of the insulating structures is between a corresponding pair of the active regions and between a corresponding pair of the device isolation layers and overlaps the corresponding pair of the active regions in the first horizontal direction.
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公开(公告)号:US20240284657A1
公开(公告)日:2024-08-22
申请号:US18529698
申请日:2023-12-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minho CHOI , Kiseok LEE , Chansic YOON , Chulkwon PARK , Jaybok CHOI
IPC: H10B12/00
CPC classification number: H10B12/34 , H10B12/315 , H10B12/482
Abstract: A semiconductor device includes a substrate having a plurality of active regions and defining a plurality of first gate trenches and a plurality of second gate trenches crossing the plurality of active regions and extending in a first horizontal direction, a plurality of gate structures including a plurality of first gate structures within the plurality of first gate trenches and a plurality of second gate structures within the plurality of second gate trenches, a bit line structure crossing the plurality of gate structures and extending in a second horizontal direction that intersects the first horizontal direction, and a contact plug disposed on a side surface of the bit line structure. When viewed in plan view, an area of at least some of the plurality of first gate structures is different from an area of at least some of the plurality of second gate structures.
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公开(公告)号:US20200061946A1
公开(公告)日:2020-02-27
申请号:US16433600
申请日:2019-06-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Se-Gon ROH , Changhyun ROH , Youngbo SHIM , Byung-Kwon CHOI , Haewook AHN , Mikyung PARK , Yeiji BAE , Minho CHOI
Abstract: A method of manufacturing an insole may include providing an electronic element on a support layer; connecting a connector to the support layer; providing the support layer to a lower mold frame; covering the lower mold frame with an upper mold frame; and applying a foam material between the lower mold frame and the upper mold frame.
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公开(公告)号:US20240112716A1
公开(公告)日:2024-04-04
申请号:US18119458
申请日:2023-03-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seungki HONG , Seung-jun LEE , Minho CHOI
IPC: G11C11/406 , G11C11/408
CPC classification number: G11C11/406 , G11C11/4085 , G11C11/4087
Abstract: A memory device includes plural banks that perform a per-bank refresh (PBR) operation, and an address register that provides a single row address signal to two banks of the plural banks, the two banks simultaneously performing the PBR operation and the single row address signal being shared by the two banks. The two banks activate a word line of each memory cell array based on a single decoded row address signal that is generated based on the single row address signal.
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公开(公告)号:US20200060379A1
公开(公告)日:2020-02-27
申请号:US16433435
申请日:2019-06-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Se-Gon ROH , Changhyun ROH , Youngbo SHIM , Byung-Kwon CHOI , Haewook AHN , Mikyung PARK , Yeiji BAE , Minho CHOI
Abstract: An insole may include an insole body in a shape receivable in a shoe; an electronic element provided in the insole body; a connection line configured to electrically connect to the electronic element and including a contact terminal exposed to the outside of the insole body; and a connector including a detachable member configured to at least partially protrude outward from the insole body and configured to support the contact terminal.
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