公开(公告)号：US20230163094A1

公开(公告)日：2023-05-25

申请号：US17988469

申请日：2022-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Euisun Choi ,  Huijae Kim ,  Mingu Lee ,  Hyeonggyun Cheong ,  Yunpyo Hong

IPC: H01L23/00

CPC classification number: H01L24/74 ,  H01L24/80 ,  H01L24/08 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/7592 ,  H01L2224/8018 ,  H01L2224/08221 ,  H01L2224/8318 ,  H01L2224/32221 ,  H01L2224/75304 ,  H01L2224/75312 ,  H01L2224/75745 ,  H01L2224/75824 ,  H01L2224/80093 ,  H01L2224/80201 ,  H01L2224/80894 ,  H01L2224/80908 ,  H01L2224/83093 ,  H01L2224/83201 ,  H01L2224/83908

Abstract: A chip bonding apparatus, includes: a body; a substrate conveyor installed on the body to transfer a substrate; a bonding head conveyor disposed on an upper surface of the body; an alignment unit installed on the body and adjusting a position of the substrate and a position of a chip; and a bonding head installed in the bonding head conveyor and moved and attaching a chip therebelow, wherein the bonding head is provided with a chip bonding unit for attaching the chip in a lower end portion thereof, wherein the chip bonding unit, includes: a chip bonding unit body having an installation groove formed therein; a pushing module having one end portion inserted in the installation groove; and an attachment module having a deformable member deformed by the pushing module; wherein the deformable member is provided with a deformable portion which is deformed by being pressed by the pushing module, and having a bottom surface in contact and exerting a force on the chip to bond the chip to the substrate.

公开(公告)号：US12136563B2

公开(公告)日：2024-11-05

申请号：US17315604

申请日：2021-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mingu Lee ,  Chulhyun Park ,  Kangsan Lee ,  Eunhaeng Lee ,  Euisun Choi

IPC: H01L21/683 ,  H01L21/677 ,  H01L21/68

Abstract: A semiconductor manufacturing apparatus configured to bond a substrate to a semiconductor chip includes a support configured to mount a substrate on a main surface of the support; and a bonding head configured to transfer the semiconductor chip to stack the semiconductor chip on the substrate and including an attachment pad configured to attach the semiconductor chip, wherein the attachment pad includes a bottom surface configured to attach the semiconductor chip; a vacuum channel extending from the bottom surface; and a cavity, and wherein the bonding head is configured to adjust a shape of the bottom surface of the attachment pad by adjusting a pressure of air in the cavity.

公开(公告)号：US20220102185A1

公开(公告)日：2022-03-31

申请号：US17315604

申请日：2021-05-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mingu Lee ,  Chulhyun Park ,  Kangsan Lee ,  Eunhaeng Lee ,  Euisun Choi

IPC: H01L21/683 ,  H01L21/68 ,  H01L21/677

Abstract: A semiconductor manufacturing apparatus configured to bond a substrate to a semiconductor chip includes a support configured to mount a substrate on a main surface of the support; and a bonding head configured to transfer the semiconductor chip to stack the semiconductor chip on the substrate and including an attachment pad configured to attach the semiconductor chip, wherein the attachment pad includes a bottom surface configured to attach the semiconductor chip; a vacuum channel extending from the bottom surface; and a cavity, and wherein the bonding head is configured to adjust a shape of the bottom surface of the attachment pad by adjusting a pressure of air in the cavity.