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公开(公告)号:US20170345822A1
公开(公告)日:2017-11-30
申请号:US15676317
申请日:2017-08-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kee Sang Kwon , Boun YOON , Sangjine PARK , Myunggeun SONG , Ki-Hyung KO , Jiwon YUN
IPC: H01L27/088 , H01L21/8234 , H01L29/78 , H01L29/66 , H01L29/51 , H01L29/49
Abstract: Semiconductor devices may include a substrate, gate electrodes on the substrate, and source/drain regions at both sides of each of the gate electrodes. Each of the gate electrodes may include a gate insulating pattern on the substrate, a lower work-function electrode pattern that is on the gate insulating pattern and has a recessed upper surface, and an upper work-function electrode pattern that conformally extends on the recessed upper surface of the lower work function electrode pattern. Topmost surfaces of the lower work-function electrode patterns may be disposed at an equal level, and the upper work-function electrode patterns may have different thicknesses from each other.
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公开(公告)号:US10714472B2
公开(公告)日:2020-07-14
申请号:US15676317
申请日:2017-08-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kee Sang Kwon , Boun Yoon , Sangjine Park , Myunggeun Song , Ki-Hyung Ko , Jiwon Yun
IPC: H01L29/51 , H01L27/088 , H01L29/78 , H01L21/8234 , H01L29/66 , H01L29/49
Abstract: Semiconductor devices may include a substrate, gate electrodes on the substrate, and source/drain regions at both sides of each of the gate electrodes. Each of the gate electrodes may include a gate insulating pattern on the substrate, a lower work-function electrode pattern that is on the gate insulating pattern and has a recessed upper surface, and an upper work-function electrode pattern that conformally extends on the recessed upper surface of the lower work function electrode pattern. Topmost surfaces of the lower work-function electrode patterns may be disposed at an equal level, and the upper work-function electrode patterns may have different thicknesses from each other.
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公开(公告)号:US09960241B2
公开(公告)日:2018-05-01
申请号:US14989485
申请日:2016-01-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sangjine Park , Kee Sang Kwon , Jae-Jik Baek , Boun Yoon
IPC: H01L29/417 , H01L29/78 , H01L29/06 , H01L29/51 , H01L29/423 , H01L27/088 , H01L21/8234
CPC classification number: H01L29/41791 , H01L21/823431 , H01L21/823475 , H01L27/0886 , H01L29/0649 , H01L29/41758 , H01L29/41783 , H01L29/42364 , H01L29/51 , H01L29/785
Abstract: A semiconductor device includes an active pattern protruding from a substrate, gate structures crossing over the active pattern, gate spacers on sidewalls of the gate structures, a source/drain region in the active pattern between the gate structures, and a source/drain contact on and connected to the source/drain region. The source/drain contact includes a first portion between the gate structures and being in contact with the gate spacers, a second portion on the first portion and not being in contact with the gate spacers, and a third portion on the second portion. A first boundary between the second and third portions is at the substantially same height as a top surface of the gate structure.
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