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公开(公告)号：US20250096486A1
公开(公告)日：2025-03-20
申请号：US18964144
申请日：2024-11-29
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Juneseok LEE , Dohyuk HA , Jinsu HEO
Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
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公开(公告)号：US20230132490A1
公开(公告)日：2023-05-04
申请号：US18147270
申请日：2022-12-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Juneseok LEE , Junsig KUM , Kwanghyun BAEK , Dohyuk HA , Jinsu HEO , Youngju LEE , Jungyub LEE
Abstract: The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.
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公开(公告)号：US20210066791A1
公开(公告)日：2021-03-04
申请号：US16961756
申请日：2019-01-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jungmin PARK , Jungyub LEE , Seungtae KO , Yoongeon KIM , Youngju LEE
Abstract: The present invention relates to a communication technique for fusing a 5G communication system with IoT technology to support a higher data rate than a 4G system, and a system therefore. The present disclosure may be applied to intelligent services (for example, smart home, smart building, smart city, smart car or connected car, health care, digital education, retailing, security and safety related services, and the like) on the basis of 5G communication technology and IoT related technology. The present invention provides an antenna module including at least one antenna array comprising: a first dielectric having a plate shape; a second dielectric disposed on a top of the first dielectric, wherein a top of the second dielectric is separated from the top of the first dielectric by a first distance; a first radiator disposed on the top surface of the second dielectric; and a feeder disposed on the first dielectric and on the second dielectric to supply an RF signal to the first radiator; and a feeder disposed on the first dielectric and the second dielectric and configured to supply a radio frequency (RF) signal to the first radiator.
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公开(公告)号：US20200328500A1
公开(公告)日：2020-10-15
申请号：US16844706
申请日：2020-04-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Dohyuk HA , Youngju LEE , Jungyub LEE , Juneseok LEE , Jinsu HEO
Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module includes a first printed circuit board (PCB) stacked at least one layer, and a second PCB disposed on an upper surface of the first PCB and stacked at least one layer. The antenna module further includes a wireless communication chip disposed on an upper surface of the second PCB and controlling an electrical signal for a radio frequency, a first structure disposed on the upper surface of the first PCB and surrounding the upper surface of the first PCB, a first antenna disposed on an inner surface of the first structure to face the first PCB, and a feed line electrically connecting the first antenna and the wireless communication chip.
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公开(公告)号：US20230387598A1
公开(公告)日：2023-11-30
申请号：US18446906
申请日：2023-08-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsub KIM , Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Juneseok LEE , Dohyuk HA , Jinsu HEO
CPC classification number: H01Q9/0457 , H01Q9/0414 , H01Q21/065
Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). An antenna structure of a wireless communication system is provided. The antenna structure includes a first radiator, a first printed circuit board (PCB) in which the first radiator is arranged, a plurality of second radiators, a second PCB in which the plurality of second radiators are arranged, and a frame structure, wherein the frame structure is arranged such that an air layer is formed between the first PCB and the second PCB, and the plurality of second radiators can include a first metal patch arranged in a region corresponding to the first radiator, and a plurality of second metal patches arranged to be separated from the first metal patch so as to be fed by coupling.
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Patent Agency Ranking
公开(公告)号：US20230361441A1
公开(公告)日：2023-11-09
申请号：US18185937
申请日：2023-03-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seungho CHOI , Yoongeon KIM , Seokmin LEE , Seungtae KO , Junsig KUM , Jungyub LEE
Abstract: A phase shifter module is provided. The phase shifter module includes a dielectric, a plate, and a PCB including a metal pattern. The metal pattern includes a power divider having first and second transmission branches. The first transmission branch includes a first structure formed between a branch point of the power divider and an output terminal of the first transmission branch. The second transmission branch includes a second structure formed between the branch point of the power divider and the output terminal of the first transmission branch. The dielectric is disposed to overlap at least one of at least a portion of the first structure or at least a portion of the second structure. The dielectric is flexibly disposed so that a first region where the dielectric overlaps the first structure and a second region where the dielectric overlaps the second structure vary, according to movement of the plate.
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公开(公告)号：US20230275361A1
公开(公告)日：2023-08-31
申请号：US18313727
申请日：2023-05-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Seungtae KO , Kijoon KIM , Juho SON , Sangho LEE , Youngju LEE , Jungyub LEE , Yonghun CHEON , Dohyuk HA
IPC: H01Q21/06 , H01Q1/24 , H01Q1/42 , H04B7/0413 , H05K1/18
CPC classification number: H01Q21/065 , H01Q1/246 , H01Q1/42 , H04B7/0413 , H05K1/181 , H05K9/0049
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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公开(公告)号：US20230163488A1
公开(公告)日：2023-05-25
申请号：US18152311
申请日：2023-01-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Juneseok LEE , Dohyuk HA , Jinsu HEO
Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
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公开(公告)号：US20230099560A1
公开(公告)日：2023-03-30
申请号：US17754893
申请日：2020-10-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dohyuk HA , Kwanghyun BAEK , Juneseok LEE , Jinsu HEO , Youngju LEE , Jungyub LEE
Abstract: The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting higher data transmission rates than a 4th generation (4G) communication system such as long-term evolution (LTE). An antenna module in a wireless communication system includes: a printed circuit board (PCB); a radio frequency integrated circuit (RFIC); and a plurality of antenna elements for emitting a radio frequency (RF) signal, wherein the plurality of antenna elements may be disposed in a first area of a first surface of the PCB, and the RFIC may be disposed in a second area, different from the first area, of the first surface of the PCB.
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公开(公告)号：US20250038426A1
公开(公告)日：2025-01-30
申请号：US18918817
申请日：2024-10-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seokmin LEE , Yoongeon KIM , Seungho CHOI , Seungtae KO , Jungyub LEE , Jun HUR
Abstract: An electronic device is provided. The electronic device includes an antenna substrate and an antenna array comprising a sub array, the sub array includes a plurality of antenna elements, feeding network circuitry including a first power divider for first polarization and a second power divider for second polarization, which differs from the first polarization, and network circuitry for decoupling of a first signal of the first power divider and a second signal of the second power divider, wherein the sub array is disposed on a first surface of the antenna substrate, and wherein the feeding network circuitry disposed on the first side or a second side opposite to the first side of the antenna substrate, and wherein the network circuitry for decoupling is disposed in a region between the first power divider and the second power divider in the first side or the second side of the antenna substrate.
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