公开(公告)号：US20250022713A1

公开(公告)日：2025-01-16

申请号：US18633627

申请日：2024-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joongsuk Oh ,  Jinuk Byun ,  Hoyoung Kim ,  Hyunkyu Moon ,  Kiho Bae ,  Boun Yoon ,  Hojoon Lee ,  Seunghoon Choi

IPC: H01L21/304 ,  G06N3/04 ,  H01L21/66 ,  H01L21/67

Abstract: An offset data correction method includes measuring a measurement target that has undergone a chemical mechanical polishing (CMP) process, generating an offset correction model based on the measurement of the measurement target, and using the offset correction model, correcting measured data obtained from the measurement of the measurement target, wherein the offset correction model is trained by using the measured data and layout data of the measurement target as inputs.