公开(公告)号：US20210136966A1

公开(公告)日：2021-05-06

申请号：US16638645

申请日：2018-07-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyun-Tae JANG ,  Min PARK ,  Byung Hoon LEE ,  Youngchul LEE ,  Changjoon LEE ,  Jiyoung JANG ,  Youngjun MOON ,  Minyoung PARK ,  Jeonggen YOON ,  Won CHOI ,  Siho JANG

IPC: H05K13/04 ,  H01L33/00 ,  H05K13/02

Abstract: According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.

公开(公告)号：US20180048047A1

公开(公告)日：2018-02-15

申请号：US15603582

申请日：2017-05-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soon Yong LEE ,  Yeon Sik YU ,  Il Kim ,  Keon Young SEO ,  Min-Goo SEO ,  Jae-Deok LIM ,  Si Ho JANG ,  Hyun-Tae JANG

IPC: H01P7/08 ,  H05K1/11 ,  H05K1/03 ,  H05K1/02

CPC classification number: H01P7/082 ,  H01P1/2005 ,  H05K1/0219 ,  H05K1/0227 ,  H05K1/0236 ,  H05K1/0353 ,  H05K1/115 ,  H05K2201/09218 ,  H05K2201/09618 ,  H05K2201/09781

Abstract: A split resonator and a printed circuit board (PCB) including the same are disclosed. The split resonator is mounted to one side of the PCB to improve the electromagnetic shielding effect, and absorbs a radiation field emitted to the outer wall of the PCB. The PCB includes: a substrate on which one or more electronic components are populated; a dielectric substrate mounted to one side of the substrate; one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and a connection portion configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate.

公开(公告)号：US20200235078A1

公开(公告)日：2020-07-23

申请号：US16650578

申请日：2018-07-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyung Woon JANG ,  Hyun-Tae JANG ,  Youngjun MOON ,  Changjoon LEE

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/24 ,  H01L27/12

Abstract: A display according to one embodiment of the present invention comprises: a light-transmitting first layer and including a plurality of cavities; a plurality of light-emitting diode (LED) chips disposed in the cavities; and a second layer including a circuit electrically connected to the plurality of LED chips. Various other embodiments are also possible.

公开(公告)号：US20180279516A1

公开(公告)日：2018-09-27

申请号：US15937646

申请日：2018-03-27

Applicant: Samsung Electronics Co., Ltd

Inventor： Chang-Joon LEE ,  Yong-Won LEE ,  Hyun-Tae JANG

IPC: H05K9/00 ,  H05K3/30 ,  H05K1/05 ,  H05K1/03 ,  H05K1/18

Abstract: According to various embodiments of the present disclosure, a metal unit may include: a core metal layer that is mainly composed of iron (Fe); and an outer layer formed on at least one face of the core metal layer, and bonded to solder so as to be attached to a printed circuit board. The metal unit and an electronic device including the same may be variously implemented according to embodiments.

公开(公告)号：US20160044835A1

公开(公告)日：2016-02-11

申请号：US14813448

申请日：2015-07-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong Won LEE ,  Hyun-Tae JANG ,  Jung Je BANG

IPC: H05K9/00 ,  H05K3/28 ,  H05K3/30 ,  H05K3/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0216 ,  G06F1/18 ,  H05K1/181 ,  H05K9/0032 ,  H05K2201/09972 ,  H05K2201/10371

Abstract: A printed circuit board (PCB) assembly includes a PCB, electronic components mounted on the PCB, a shield can provided to block electromagnetic waves of the electronic components, and an insulating layer provided to prevent an electrical short between the electronic components and the shield can, and the insulating layer is sprayed and formed on the shield can. The insulating layer which is sprayed and formed on the shield can does not have an adhesive layer, and thus the thickness thereof can be remarkably reduced compared to insulating materials requiring an adhesive layer.

Abstract translation: 印刷电路板（PCB）组件包括PCB，安装在PCB上的电子部件，可以设置用于阻挡电子部件的电磁波的屏蔽罩，以及用于防止电子部件和屏蔽壳之间的电短路的绝缘层 并且绝缘层被喷涂并形成在屏蔽罐上。 在屏蔽罩上喷涂形成的绝缘层不具有粘合剂层，因此与需要粘合剂层的绝缘材料相比，其厚度可以显着降低。