公开(公告)号：US20200383247A1

公开(公告)日：2020-12-03

申请号：US16766363

申请日：2018-11-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyeongmin JIN ,  Min PARK ,  Jaedeok LIM ,  Jungje BANG ,  Jaeheung YE ,  Yongwon LEE ,  Seyoung JANG

IPC: H05K9/00 ,  H05K1/18 ,  H01Q1/52 ,  H04M1/02 ,  H01Q1/24

Abstract: The disclosure provides an electronic device having an electromagnetic shielding structure for preventing an antenna performance degradation. The disclosed electronic device may include: an antenna disposed in some areas of the electronic device; a printed circuit board; and a display module including a display panel, one or more signal lines coupled to the display panel, and a flexible substrate on which the one or more signal lines are disposed. The flexible substrate may include: a conductive layer coupled to the printed circuit board in a curved state and configured to shield an electromagnetic wave radiated from the one or more signal lines to the antenna; and a stress neutralization layer of which a material can be deformed over time in response to a shape of the flexible substrate coupled in a curved state. The stress neutralization layer may be disposed between the flexible substrate and the conductive layer.

公开(公告)号：US20160321442A1

公开(公告)日：2016-11-03

申请号：US15141279

申请日：2016-04-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghoon SONG ,  Yoonoh CHI ,  Gyeongmin JIN ,  Kwangsub LEE ,  Saebom LEE ,  Seyoung JANG ,  Chihyun CHO ,  Yunjang JIN

IPC: G06F21/32 ,  G06F3/0354 ,  G06K9/00 ,  G06F3/044

CPC classification number: G06F21/32 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1684 ,  G06F3/03547 ,  G06F3/041 ,  G06F3/044 ,  G06F3/0488 ,  G06F2203/0338 ,  G06F2203/04103 ,  G06K9/0002 ,  H01H2239/006 ,  H01H2239/008 ,  H01H2239/07 ,  H01H2239/074 ,  H04M1/23 ,  H04M1/67

Abstract: An electronic device is provided. The electronic device includes an input sensing module that detects at least two inputs and a processor that controls the electronic device to perform a function corresponding to an input received through the input sensing module, wherein the input sensing module includes at least one fingerprint recognition sensor, at least one touch sensor, and an input processor electrically connected to the at least one fingerprint recognition sensor and the at least one touch sensor and that processes an input received from the at least one fingerprint recognition sensor or the at least one touch sensor and that transfers the input to the processor.

Abstract translation: 提供电子设备。 电子设备包括检测至少两个输入的输入感测模块和控制电子设备执行与通过输入感测模块接收的输入相对应的功能的处理器，其中输入感测模块包括至少一个指纹识别传感器， 至少一个触摸传感器，以及电连接到所述至少一个指纹识别传感器和所述至少一个触摸传感器并且处理从所述至少一个指纹识别传感器或所述至少一个触摸传感器接收的输入的输入处理器， 将输入传送到处理器。

公开(公告)号：US20230199953A1

公开(公告)日：2023-06-22

申请号：US18107129

申请日：2023-02-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bongsoo KIM ,  Gyeongmin JIN ,  Hakjoon KIM ,  Jaebum LEE

IPC: H05K1/11 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K3/3436 ,  H05K2201/099

Abstract: An electronic device according to an embodiment may include: a Printed Circuit Board (PCB) including a first face and a second face; a semiconductor chip mounted on the second face; a conductive pad disposed on the second face; a solder resist layer disposed on the second face and including an aperture; an arc-shaped opening having an inner diameter and an outer diameter, disposed along an outer periphery of the conductive pad and in the aperture; and at least one external terminal disposed on the semiconductor chip and bonded to the conductive pad. The conductive pad may include: a first region having a smaller diameter than the outer diameter; and at least one second region extending from the first region in a first outer circumferential direction, and located at least in part between both ends of the opening. In addition, various embodiments recognized through the specification may also be possible.

公开(公告)号：US20220418108A1

公开(公告)日：2022-12-29

申请号：US17900687

申请日：2022-08-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeonkyung CHUNG ,  Jichul KIM ,  Jinyong PARK ,  Gyeongmin JIN

IPC: H05K1/11 ,  H04M1/02 ,  H05K3/34 ,  H05K1/02

Abstract: According to an embodiment, an electronic device may include a first printed circuit board (PCB), a second PCB having a shape corresponding to the first PCB, and an interposer surrounding a space between the first PCB and the second PCB and including multiple pads, wherein the interposer may include a first surface in contact with the first PCB, a second surface in contact with the second PCB, a first lateral surface facing the space, and a second lateral surface opposite to the first lateral surface, and a first point exposed through the second lateral surface, a second point exposed through one of the first lateral surface or the second lateral surface, and a heat conduction pattern disposed on the first surface in an area between the multiple pads to connect the first point and the second point.

公开(公告)号：US20220386465A1

公开(公告)日：2022-12-01

申请号：US17886327

申请日：2022-08-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyeongmin JIN ,  Jichul KIM ,  Yongjae SONG ,  Jaeyeon RA ,  Chagyu SONG

IPC: H05K1/14 ,  H05K1/02

Abstract: Disclosed is a printed circuit board assembly comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; and an interposer arranged between the first printed circuit board and the second printed circuit board, wherein the second printed circuit board includes a first part and a second part extending in a first direction from a part of the first part and wherein a length of the second part in a second direction perpendicular to the first direction is less than a length in the second direction of the first part, and wherein the direction of a first conductive pattern formed on the first part and the direction of a second conductive pattern formed on the second part are substantially perpendicular to each other.