公开(公告)号：US20220243906A1

公开(公告)日：2022-08-04

申请号：US17721632

申请日：2022-04-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Geun-woo KO ,  Seung-woo Lee ,  Jun-ho Lee ,  Pun-jae Choi

IPC: F21V23/00

Abstract: A light source module including: a printed circuit board; a light emitting device mounted on the printed circuit board and including a plurality of subarrays each of the plurality of subarrays including a plurality of light emitting cells; and a plurality of driving chips mounted on the printed circuit board, wherein each of the plurality of driving chips respectively drives a corresponding one of the plurality of subarrays, wherein the plurality of subarrays are electrically isolated from each other.

公开(公告)号：US20200025351A1

公开(公告)日：2020-01-23

申请号：US16454852

申请日：2019-06-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-min KWON ,  Pun-jae CHOI ,  Geun-woo KO ,  Jong-hyun LEE

IPC: F21S41/657 ,  F21S41/141 ,  B60Q1/04

Abstract: A light-emitting device includes an emission array including a plurality of light-emitting elements and a partition wall. The emission array includes a first region and a second region adjacent to each other. The partition wall is configured to isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array. The first region is associated with a first emission factor and the second region is associated with a second emission factor, the second emission factor different from the first emission factor.

公开(公告)号：US20170033268A1

公开(公告)日：2017-02-02

申请号：US15162754

申请日：2016-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-kuk LEE ,  Si-han KIM ,  Hyung-kun KIM ,  Yong-min KWON ,  Geun-woo KO

IPC: H01L33/60 ,  H01L33/32 ,  H01L33/56 ,  H01L33/00 ,  H01L33/62 ,  H01L33/38 ,  H01L33/06 ,  H01L33/18

CPC classification number: H01L33/60 ,  H01L33/007 ,  H01L33/06 ,  H01L33/18 ,  H01L33/32 ,  H01L33/38 ,  H01L33/382 ,  H01L33/44 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/005 ,  H01L2933/0058

Abstract: A light-emitting diode (LED) package includes a light-emitting structure including a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer; an isolating insulation layer; a first connection electrode portion and a second connection electrode portion electrically connected to the first conductive-type semiconductor layer and the second conductive-type semiconductor layer, respectively; a first electrode pad and a second electrode pad electrically connected to the first connection electrode portion and the second connection electrode portion, respectively; a first molding resin layer provided between the first electrode pad and the second electrode pad; a first pillar electrode and a second pillar electrode electrically connected to the first electrode pad and the second electrode pad, respectively; and a second molding resin layer provided on the first molding resin layer, the first electrode pad, and the second electrode pad, and between the first pillar electrode and the second pillar electrode.

Abstract translation: 发光二极管（LED）封装包括包括第一导电型半导体层，有源层和第二导电型半导体层的发光结构; 隔离绝缘层; 分别与第一导电型半导体层和第二导电型半导体层电连接的第一连接电极部分和第二连接电极部分; 分别电连接到第一连接电极部分和第二连接电极部分的第一电极焊盘和第二电极焊盘; 第一模塑树脂层，设置在所述第一电极焊盘和所述第二电极焊盘之间; 分别与第一电极焊盘和第二电极焊盘电连接的第一柱状电极和第二柱状电极; 以及设置在第一模塑树脂层，第一电极焊盘和第二电极焊盘上以及在第一柱状电极和第二柱状电极之间的第二模塑树脂层。

公开(公告)号：US20210341125A1

公开(公告)日：2021-11-04

申请号：US17373038

申请日：2021-07-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-min KWON ,  Pun-jae CHOI ,  Geun-woo KO ,  Jong-hyun LEE

IPC: F21S41/657 ,  H01L33/50 ,  H01L25/075 ,  B60Q1/04 ,  F21S41/141 ,  H01L33/02

Abstract: A light-emitting device includes an emission array including a plurality of light-emitting elements and a partition wall. The emission array includes a first region and a second region adjacent to each other. The partition wall is configured to isolate the first region and the second region from each other, such that the partition wall at least partially defines the first region in the emission array. The first region is associated with a first emission factor and the second region is associated with a second emission factor, the second emission factor different from the first emission factor.

公开(公告)号：US20190067538A1

公开(公告)日：2019-02-28

申请号：US15925037

申请日：2018-03-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-wook LEE ,  Geun-woo KO ,  Pun-jae CHOI ,  Jae-ho Han

IPC: H01L33/60 ,  H01L33/62 ,  H01L33/48 ,  H01L33/36 ,  H01L33/50

Abstract: A light-emitting package includes a light-emitting structure having a first surface and a second surface opposite to the first surface. The light-emitting package further includes an electrode layer disposed on the first surface and an insulating layer disposed on the light-emitting structure and the electrode layer. The light-emitting package additionally includes an interconnection conductive layer penetrating the insulating layer and connected to the electrode layer and a reflective layer disposed between the insulating layer and the interconnection conductive layer. The reflective layer reflects light generated from the light-emitting structure in a direction toward the second surface.